Methods for transferring graphene films and substrates comprising graphene films

1. A method for transferring a graphene film onto a substrate, the method comprising:

(a) applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate;

(b) thermally treating the polymer layer;

(c) applying a thermal release polymer layer to the thermally treated polymer layer;

(d) removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and

(e) contacting the exposed graphene surface with a target substrate.

2. The method of claim 1 , wherein the growth substrate is a metal substrate.

3. The method of claim 1 , further comprising depositing the graphene film on the growth substrate by chemical vapor deposition or plasma-enhanced chemical vapor deposition.

4. The method of claim 1 , wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate.

5. The method of claim 1 , wherein applying the polymer layer comprises dip coating, spin coating, or spray coating the polymer onto the graphene film.

6. The method of claim 1 , wherein thermally treating the polymer comprises heating the polymer layer to a temperature ranging from about 80° C. to about 150° C. for a period of time ranging from about 1 minute to about 60 minutes.

7. The method of claim 1 , wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane.

8. The method of claim 1 , wherein applying the thermal release polymer layer comprises pressing, roll-to-roll transfer, or lamination.

9. The method of claim 1 , wherein removing the growth substrate comprises exposing the growth substrate to an etchant at a temperature ranging from about 25° C. to about 60° C. for a time period ranging from about 30 minutes to about 12 hours.

10. The method of claim 1 , wherein the target substrate comprises glass.

11. The method of claim 1 , further comprising removing the thermal release polymer by heating to a temperature ranging from about 100° C. to about 200° C. and peeling away the thermal release polymer.

12. The method of claim 11 , further comprising removing the polymer layer by exposing the polymer layer to an organic solvent at a temperature ranging from about 25° C. to about 60° C. for a time period ranging from about 15 minutes to about 60 minutes.

13. The method of claim 12 , further comprising annealing the graphene film at a temperature ranging from about 100° C. to about 400° C. for a time period ranging from about 15 minutes to about 60 minutes, optionally under vacuum.

14. A transfer substrate comprising a graphene film, a thermal release polymer layer, and a polymer layer disposed therebetween, wherein the polymer layer has a thickness ranging from 50 nm to 200 nm.

15. The transfer substrate according to claim 14 , wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane.

16. The transfer substrate of claim 14 , wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate.

17. The transfer substrate of claim 14 , wherein the thermal release polymer has a thickness ranging from about 100 nm to about 1 mm.

18. The transfer substrate of claim 14 , wherein the graphene film has a thickness ranging from about 0.3 nm to about 200 nm.

19. The transfer substrate of claim 14 , wherein the graphene film is substantially transparent.

20. The transfer substrate of claim 14 , wherein the graphene film has a sheet resistance of less than about 3 KΩ/sq.