Nanosheet single gate (SG) and extra gate (EG) field effect transistor (FET) co-integration
A method of forming a semiconductor device that includes providing a first stack of nanosheets having a first thickness and a second stack of nanosheets having a second thickness; and forming a oxide layer on the first and second stack of nanosheets. The oxide layer fills a space between said nanosheets in the first stack, and is conformally present on the nanosheets in the second stack. The method further includes forming a work function metal layer on the first and second stack of nanosheets. In some embodiments, the work function metal layer is present on only exterior surfaces of the first stack to provide a single gate structure and is conformally present about an entirety of the nanosheets in the second stack to provide a multiple gate structure.
1. A method of forming an electrical device comprising:
providing a first stack of nanosheets having a first thickness and a second stack of nanosheets having a second thickness, wherein the second thickness is less than the first thickness;
forming a dielectric layer on the first and second stack of nanosheets, wherein the dielectric layer fills a space between said nanosheets in the first stack, and is conformally present on the nanosheets in the second stack; and
forming a work function metal layer on the first and second stack of nanosheets, wherein the work function metal layer is present on only exterior surfaces of the first stack to provide a single gate structure and the work function metal layer is conformally present about an entirety of the nanosheets in the second stack to provide a multiple gate structure.
2. The method of claim 1 , further comprising:
forming a sacrificial gate structure on each of a first and second material stacks, wherein the first and second material stacks provide the first and second stacks of nanosheets;
forming source and drain regions on opposing sides of the sacrificial gate structure on each of the first and second material stacks;
removing the sacrificial gate structure to expose a channel portion of the first and second material stacks;
removing a sacrificial material layer of the first and second material stacks to nanosheet material layer of the first and second material stacks; and
thinning the nanosheets from the second material stacks to provide the second sheet of nanosheets having the second thickness.
3. The method of claim 2 , wherein thinning the nanosheets from the second material stack comprises:
forming a hardmask over the first stack of nanosheets leaving the second stack of nanosheets exposed;
oxidizing an exterior surface of the second stack of nanosheets to provide a surface oxide; and
removing the surface oxide with a selective etch.
4. The method of claim 1 , wherein the dielectric layer is an oxide.
5. The method of claim 1 , further comprising forming a high-k gate dielectric on the first and second stack of nanosheets.
6. The method of claim 1 , wherein the high-k gate dielectric is present around an entirety of an exterior surface for each nanosheets in the first and second stacks of nanosheets.
7. The method of claim 1 , wherein the multi-gate structure is a gate all around gate structure.