Substrate and semiconductor apparatus
The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.
1. A substrate which comprises
a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated,
wherein the surface-treated fiber film has a value of a flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a flexural rigidity of a like fiber film before surface treatment,
wherein the surface-treated fiber film contains a glass fiber, and a part or all of the glass fiber is bundled and surface-treated by a cured product consisting essentially of an organosilicon compound,
wherein the organosilicon compound consists of one or more compounds selected from the group consisting of an alkoxysilane, a polysilazane and a partially hydrolyzed condensate thereof, and a silicone-modified varnish, where the silicone-modified varnish is at least one selected from the group consisting of an alkyd-modified varnish, a polyester-modified varnish, an epoxy-modified varnish, and an acryl-modified varnish, and
wherein an amount of the organosilicon compound attached to the fiber film is from 2% by mass to 90% by mass, based on 100% by mass of the surface-treated fiber film.
2. The substrate according to claim 1 , wherein the substrate contains a white pigment.
3. The substrate according to claim 1 , further comprising a metal layer(s) on one surface or both surfaces of the surface-treated fiber film or a laminate thereof.
4. The substrate according to claim 2 , further comprising a metal layer(s) on one surface or both surfaces of the surface-treated fiber film or a laminate thereof.
5. The substrate according to claim 1 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried.
6. The substrate according to claim 2 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried.
7. The substrate according to claim 3 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried.
8. The substrate according to claim 4 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried.
9. The substrate according to claim 3 , wherein the metal layer is formed by either of metal plating, a metal foil or a metal plate.
10. The substrate according to claim 4 , wherein the metal layer is formed by either of metal plating, a metal foil or a metal plate.
11. The substrate according to claim 3 , further comprising an adhesive resin composition between the surface-treated fiber film and the metal layer(s) or between the surface-treated fiber films with each other, or both of these.
12. The substrate according to claim 4 , further comprising an adhesive resin composition between the surface-treated fiber film and the metal layer(s) or between the surface-treated fiber films with each other, or both of these.
13. The substrate according to claim 11 , wherein the adhesive resin composition is thermosetting.
14. The substrate according to claim 12 , wherein the adhesive resin composition is thermosetting.
15. The substrate according to claim 1 , further comprising a material prepared by further superimposing a prepreg base material comprising at least one sheet of a prepreg(s) in an uncured state in which a thermosetting resin composition has been impregnated into the base material and dried being laminated with the fiber film base material, and at least one of the surface-treated fiber film and the prepreg contains a white pigment.
16. The substrate according to claim 15 , wherein the substrate comprises the fiber film base material and the prepreg base material which are alternately superimposed.
17. The substrate according to claim 15 , wherein the substrate comprises each two or more sheets of the fiber film base materials and the prepreg base materials being laminated.
18. The substrate according to claim 16 , wherein the substrate comprises each two or more sheets of the fiber film base materials and the prepreg base materials being laminated.
19. The substrate according to claim 5 , wherein the thermosetting resin composition is a silicone resin composition.
20. The substrate according to claim 19 , wherein the silicone resin composition comprises the following Components (A) to (C):
(A) an organopolysiloxane represented by the following average composition formula,
(SiO 2 ) a (R 1 1-m R 2 m SiO 1.5 ) b (R 1 2-n R 2 n SiO) c (R 1 3-L R 2 L SiO 0.5 ) d
wherein R 1 represents a monovalent saturated hydrocarbon group having 1 to 10 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R 2 represents a monovalent unsaturated hydrocarbon group having 2 to 8 carbon atoms; m=0 to 1, n=0 to 2, L=0 to 3, and 1≤m+n+L≤6, and “a”, “b”, “c” and “d” are each numbers satisfying 0≤a≤1, 0≤b≤1, 0≤c≤0.9, 0≤d≤0.9, a+b>0, and a+b+c+d=1,
(B) a hydrogen polysiloxane containing one or more hydrosilyl groups, and
(C) a platinum based catalyst with an amount effective for curing.
21. The substrate according to claim 5 , wherein the thermosetting resin composition contains a filler.
22. The substrate according to claim 1 , wherein the surface-treated fiber film contains a filler.
23. The substrate according to claim 21 , wherein the filler contains a white pigment.
24. The substrate according to claim 22 , wherein the filler contains a white pigment.
25. The substrate according to claim 1 , wherein the substrate is a substrate which is bendable at 90° or more.
26. A semiconductor apparatus which is prepared by using the substrate according to claim 1 .
27. The substrate according to claim 1 , wherein the amount of the organosilicon compound attached to the fiber film is from 4.5% by mass to 70% by mass, based on 100% by mass of the surface-treated fiber film.
28. The substrate according to claim 1 , wherein the organosilicon compound consists of one or more compounds selected from the group consisting of an alkoxysilane, and a polysilazane and a partially hydrolyzed condensate thereof.
29. The substrate according to claim 1 , wherein the epoxy-modified varnish contains an epoxy group-containing alkoxysilane oligomer.