Semiconductor device
A semiconductor device includes a first conductivity type first semiconductor region, a second semiconductor region on the first semiconductor region, a third semiconductor region on the second semiconductor region, a first insulating portion extending inwardly of, and surrounded by, the first semiconductor region, a gate electrode extending inwardly of the first insulating portion and spaced from the second semiconductor region in a second direction that intersects a first direction extending from the first semiconductor region to the second semiconductor region, by the first insulating portion, and a first electrode including a portion spaced from the first semiconductor region in the second direction by the first insulating portion, and surrounded by the first insulating portion and the gate electrode.
1. A semiconductor device, comprising:
a first semiconductor region of a first conductivity type;
a second semiconductor region of a second conductivity type on the first semiconductor region;
a third semiconductor region of the first conductivity type on the second semiconductor region;
a first insulating portion extending into the first semiconductor region, the second semiconductor region and the third semiconductor region;
a first electrode on the third semiconductor region and portions of the first insulating portion and having a first opening therethrough;
a gate electrode extending inwardly of the first insulating portion and spaced from the second semiconductor region in a second direction that intersects a first direction extending from the first semiconductor region to the second semiconductor region by the first insulating portion;
a second electrode including a portion spaced from the first semiconductor region in the second direction by the first insulating portion, and surrounded by the first insulating portion and the gate electrode;
a second insulating portion on the first electrode;
a first conductive portion on the second insulating portion; and
a first conductive connecting portion extending through the first insulating portion and connecting the gate electrode and the first conductive portion.
2. The semiconductor device of claim 1 , further comprising:
a third insulating portion on the first conductive portion:
a second conductive portion on the third insulating portion; and
a second conductive connecting portion extending through the second and third insulating portions to connect the third conductive portion and the first electrode.
3. The semiconductor device of claim 2 , wherein the second electrode is connected to the portion of the first electrode on the first insulating portion.
4. The semiconductor device of claim 1 , wherein the second electrode extends further inwardly of the first insulating portion than the gate electrode.
5. The semiconductor device of claim 1 , further comprising a fourth electrode, wherein the first semiconductor region is interposed between the fourth electrode and the second semiconductor region.
6. The semiconductor device of claim 5 , further comprising a fourth semiconductor region of the first conductivity type between the fourth electrode and the first semiconductor region.
7. The semiconductor device of claim 6 , wherein a first conductivity type impurity concentration of the third semiconductor region is greater than a first conductivity type impurity concentration of the first semiconductor region.
8. The semiconductor device of claim 1 , wherein the gate electrode has an annular shape.
9. A semiconductor device, comprising:
a first semiconductor region of a first conductivity type;
a second semiconductor region of a second conductivity type on the first semiconductor region;
a third semiconductor region of the first conductivity type on the second semiconductor region;
a plurality of first electrodes extending inwardly of the first, second, and third semiconductor regions;
a gate electrode surrounding at least one of the first electrodes and extending inwardly of the second semiconductor layer;
a first conductive region overlying the third semiconductor region and portions of the first insulating layer, wherein the first conductive region includes a first opening therethrough overlying the gate electrode;
a second conductive region overlying, and spaced from, the first conductive region; and
a first conductive connection portion extending from the second conductive region through the first opening to the gate electrode.
10. The semiconductor device of claim 9 , further comprising a first insulating region extending between the first electrode and the gate electrode and adjacent portions of the first, second, and third semiconductor regions.
11. The semiconductor device of claim 10 , wherein the first electrode extends further inwardly of the first semiconductor region than the gate electrode.
12. The semiconductor device of claim 9 , further comprising:
a third conductive region overlying, and spaced from, the second conductive region;
a second opening in the second conductive region overlying the location of the first electrode; and
a second conductive connection portion extending from the third conductive region through the second opening to the first electrode.
13. The semiconductor device of claim 9 , wherein the gate electrode as an annular shape.
14. A semiconductor device, comprising:
a first semiconductor region of a first conductivity type;
a second semiconductor region of a second conductivity type on the first semiconductor region;
a third semiconductor region of the first conductivity type on the second semiconductor region;
a first insulating portion extending inwardly of, and surrounded by, the first semiconductor region, the second semiconductor region, and the third semiconductor region;
an annular gate electrode extending inwardly of the first insulating portion;
a first electrode extending inwardly of the first insulating portion and surrounded by the first insulating portion and the annular gate electrode;
a first metal layer on the third semiconductor region and the first insulating portion, and electrically connected to the third semiconductor region;
a first insulating layer on the first metal layer;
a second metal layer on the first insulating layer;
a second insulating layer on the second metal layer;
a third metal layer on the second insulating layer; and
a first connection portion extending through the first insulating layer and an opening in the first metal layer to connect the second metal layer and the annular gate electrode.
15. The semiconductor device according to claim 14 , wherein the first connection portion extends into the first insulating portion and contacts the annular gate electrode at a level that is below a level of the first metal layer.
16. The semiconductor device according to claim 14 , further comprising:
a second connection portion extending through the first insulating layer and the second insulating layer to connect the first metal layer and the third metal layer.