IP Library › Granted Patent US 10,780,500
Granted Patent B2
US 10,780,500 · App. 16/217,468 · Granted Sep 22, 2020

Sintering and shaping method

Inventors: Koki Hirata (Nagano, JP); Shinichi Kato (Nagano, JP); Hiroshi Fukumoto (Nagano, JP); Chigusa Sato (Nagano, JP)
Assignee: Seiko Epson Corporation
B22F3/16B22F1/0059B22F3/008B28B1/001B28B7/465B29C64/165B29C67/00B33Y10/00B33Y30/00B33Y70/00B22F2998/10
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Quick Facts
Patent No.
US 10,780,500
App. No.
16/217,468
Granted
Sep 22, 2020
Kind
B2
Abstract

Provided is a three-dimensional shaped article with relatively high strength and relatively high accuracy. A sintering and shaping method includes: a shaping layer forming process of forming a shaping layer by using a sintering and shaping material in which inorganic particles are included; a process of applying a liquid binding agent, in which a thermoplastic resin and inorganic particles are included, to a desired region of the shaping layer; a process of curing the liquid binding agent, which is applied, to form a shaping cross-sectional layer (shaping portion); a process of removing a region (non-shaping portion) of the shaping layer to which the liquid binding agent is not applied; and a process of heating the shaping cross-sectional layer that is laminated for a sintering treatment.

Claims (21)

1. A sintering and shaping method, comprising:

a shaping layer forming process of forming a shaping layer by using a sintering and shaping material in which first inorganic particles are included;

a process of applying a liquid binding agent, in which a thermoplastic resin and second inorganic particles are included, to a desired region of the shaping layer, to form a shaping cross-sectional layer, a sintering initiation temperature of the second inorganic particles being lower than a sintering initiation temperature of the first inorganic particles;

a degreasing process of heating the shaping cross-sectional layer at a temperature lower than the sintering initiation temperature of the second inorganic particles to remove the thermoplastic resin;

a first sintering process of heating the shaping cross-sectional layer at a temperature equal to or higher than the sintering initiation temperature of the second inorganic particles and lower than the sintering initiation temperature of the first inorganic particles to fuse the second inorganic particles to the first inorganic particles after the degreasing process; and

a second sintering process of heating the shaping cross-sectional layer at a temperature equal to or higher than the sintering initiation temperature of the first inorganic particles to sinter the first inorganic particles.

2. The sintering and shaping method according to claim 1 ,

wherein the sintering and shaping material includes a thermoplastic binder that binds the first inorganic particles to each other, and

the shaping layer forming process is performed by heating the sintering and shaping material to a temperature that is equal to or higher than a melting point of the thermoplastic binder.

3. The sintering and shaping method according to claim 1 ,

wherein a ratio between a weight of the first inorganic particles which are included in the shaping cross-sectional layer and a weight of the second inorganic particles which are included in the shaping cross-sectional layer is in a range of 400:1 to 3:1.

4. The sintering and shaping method according to claim 1 ,

wherein a ratio between an average particle size of the first inorganic particles and an average particle size of the second inorganic particles is in a range of 50000:1 to 10:1.

5. The sintering and shaping method according to claim 4 ,

wherein the average particle size of the second inorganic particles is 0.001 micrometers to 10 micrometers.

6. The sintering and shaping method according to claim 1 ,

wherein the first inorganic particles and the second inorganic particles are ceramic particles or metal particles.

7. The sintering and shaping method according to claim 1 , further comprising

a process of curing the liquid binding agent after the process of applying the liquid binding agent.

8. The sintering and shaping method according to claim 1 , further comprising

a process of removing a region of the shaping layer to which the liquid binding agent is not applied after the process of applying the liquid binding agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2018
From: HIRATA, KOKI; KATO, SHINICHI; FUKUMOTO, HIROSHI; SATO, CHIGUSA
To: SEIKO EPSON CORPORATION
Reel/Frame 047754/0161 →
Priority Claims (1)
JP 2014-088895 · Apr 23, 2014 · national
Continuity (2)
Continuation 15108388
Related Publication 20190111487A1 · Apr 18, 2019