Optical module, fabrication method thereof, and terminal device using the same
Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.
1. An optical module, comprising a lens and a sensor package; wherein
the lens is positioned at an uppermost position of the optical module and arranged under a lower position of a terminal screen, and is configured to transmit light passing through the terminal screen;
the sensor package comprises an optical sensor, a photosensitive region being arranged on an upper surface of the optical sensor, the photosensitive region being configured to receive light passing through the lens; and
an air gap is formed between the lens and the photosensitive region of the optical sensor, and the photosensitive region of the optical sensor is configured to receive the light passing through the terminal screen via the air gap,
wherein the sensor package further comprises:
a carrier provided with an opening in which the optical sensor is positioned, wherein an upper surface of the carrier is flush with the upper surface of the optical sensor;
a redistribution layer arranged on an upper surface of the optical sensor formed by a fan-out process,
an interposer arranged above the carrier, wherein the air gap is formed between the interposer and the optical sensor, and
a bump mounted on the interposer such that the bump is electrically connected to the redistribution layer.
2. An optical module fabrication method, comprising:
packaging an optical sensor to form a sensor package, wherein a photosensitive region configured to receive light is arranged on an upper surface of the optical sensor; and
forming an optical module by using the sensor package and a lens configured to transmit light, wherein the lens is positioned at an uppermost position of the optical module,
wherein an air gap is formed between the lens and the photosensitive region of the optical sensor,
wherein the packaging an optical sensor to form a sensor package further comprises:
packaging the optical sensor by a fan-out process, and forming a redistribution pad;
mounting a bump on the redistribution pad;
electrically connecting the optical sensor to the substrate via the bump by a surface mounting technology (SMT) process;
sealing the optical sensor by underfill dispensing, and exposing a photosensitive region of the optical sensor from a through hole on a substrate of the optical sensor; and
bonding a filter layer to an upper surface of the photosensitive region.
3. The method according to claim 2 , wherein prior to the packaging an optical sensor to form a sensor package, the method further comprises:
bonding the optical sensor to the substrate, and electrically connecting the optical sensor to the substrate; and
the packaging an optical sensor to form a sensor package comprises:
packaging the optical sensor by a first packaging process, and forming the sensor package.
4. The method according to claim 3 , wherein
the bonding the optical sensor to the substrate, and electrically connecting the optical sensor to the substrate comprises:
mounting a bump on a wafer of an optical sensor chip by a bump process, and forming the optical sensor by dicing; and
connecting the optical sensor to the substrate by a flip chip process, and electrically connecting the optical sensor to the substrate via the bump.
5. The method according to claim 4 , wherein the packaging the optical sensor by a first packaging process, and forming the sensor package comprises:
sealing the optical sensor by underfill dispensing; and
packaging the optical sensor and the substrate by the first packaging process, defining the air gap between the substrate and the optical sensor, and forming the sensor package, wherein the first packaging process is a mold process.
6. The method according to claim 2 , wherein the packaging an optical sensor to form a sensor package comprises:
forming the sensor package by singulated cutting, wherein sensor chips in various sensor packages are optical sensors, and the air gap is defined between the substrate and the optical sensor.
7. An optical module, comprising a lens and a sensor package, wherein:
the lens is positioned at an uppermost position of the optical module and arranged under a lower position of a terminal screen, and is configured to transmit light passing through the terminal screen;
the sensor package comprises an optical sensor, a photosensitive region being arranged on an upper surface of the optical sensor, the photosensitive region being configured to receive light passing through the lens; and
an air gap is formed between the lens and the photosensitive region of the optical sensor, and the photosensitive region of the optical sensor is configured to receive the light passing through the terminal screen via the air gap,
wherein the sensor package further comprises a carrier positioned at a lowermost position of the sensor package; wherein the sensor package further comprises a plastic packaging adhesive, the optical sensor is positioned on an upper surface of the carrier, and an upper surface of the plastic packaging adhesive is flush with the upper surface of the optical sensor;
an interposer or a lid is arranged above the plastic packaging adhesive, and
the air gap is formed between the interposer or the lid and the optical sensor.