Semiconductor device

1. A semiconductor device comprising:

a semiconductor substrate having a first surface and a second surface, the second surface being positioned on an opposite side of the first surface;

a first wiring and a second wiring each formed on the first surface side of the semiconductor substrate;

a bypass wiring formed on a second surface side of the semiconductor substrate;

a first through via passing through the semiconductor substrate and electrically connected with the first wiring; and

a second through via passing through the semiconductor substrate, electrically connected with the second wiring, and arranged in a position different from the first through via,

wherein the bypass wiring is connected with the first through via and the second through via,

wherein the first wiring and the second wiring are included in a wiring structure formed on the first side of the semiconductor substrate, and

wherein a sheet resistance value of the bypass wiring is smaller than a sheet resistance value of wiring included in the wiring structure.

2. The semiconductor device according to claim 1 , wherein the bypass wiring is power supply wiring.

3. The semiconductor device according to claim 1 ,

wherein the wiring structure includes:

a first wiring structure formed in a first region; and

a second wiring structure formed in a second region,

wherein the first wiring structure includes the first wiring,

wherein the second wiring structure includes the second wiring,

wherein the first through via is connected with the first wiring structure, and

wherein the second through via is connected with the second wiring structure.

4. The semiconductor device according to claim 3 ,

wherein the first wiring structure includes a power supply wiring structure to which a first power supply potential is supplied,

wherein the second wiring structure includes:

a first power supply wiring structure to which the first power supply potential is supplied; and

a second power supply wiring structure to which a second power supply potential different from the first power supply potential is supplied, and

wherein the bypass wiring electrically connects the power supply wiring structure with the first power supply wiring structure.

5. The semiconductor device according to claim 4 ,

wherein the first region is a region where a standard cell to which the first power supply potential is supplied is formed, and

wherein the second region is a region where a standard cell to which the first power supply potential is supplied and a macro to which the second power supply potential is supplied are formed.

6. The semiconductor device according to claim 1 ,

wherein the wiring structure includes:

a first wiring structure formed in a first region;

a second wiring structure formed in a second region; and

a third wiring structure formed in a third region,

wherein the first region is a region where a standard cell to which a first power supply potential is supplied and a PLL circuit to which a fourth power supply potential is supplied are formed,

wherein the second region is a region where a standard cell to which the first power supply potential is supplied and a macro to which a second power supply potential is supplied are formed,

wherein the third region is a region where a voltage conversion circuit that generates the fourth power supply potential from a third power supply potential is formed,

wherein the first through via is electrically connected with the PLL circuit,

wherein the second through via is electrically connected with the voltage conversion circuit, and

wherein the bypass wiring connects the PLL circuit with the voltage conversion circuit.

7. A semiconductor device comprising:

a semiconductor substrate having a first surface and a second surface, the second surface being positioned on an opposite side of the first surface;

a first wiring and a second wiring each formed on the first surface side of the semiconductor substrate;

a bypass wiring formed on a second surface side of the semiconductor substrate;

a first through via passing through the semiconductor substrate and electrically connected with the first wiring; and

a second through via passing through the semiconductor substrate, electrically connected with the second wiring, and arranged in a position different from the first through via,

wherein the bypass wiring is connected with the first through via and the second through via,

wherein the first wiring and the second wiring are included in a wiring structure formed on the first side of the semiconductor substrate, and

wherein the wiring structure includes:

a global wiring layer including a third wiring with a smallest sheet resistance value;

a semi-global wiring layer including a fourth wiring with a sheet resistance value greater than the sheet resistance value of the third wiring; and

a local wiring layer including third wiring with a sheet resistance value greater than the sheet resistance value of the fourth wiring.

8. The semiconductor device according to claim 7 ,

wherein the wiring structure includes:

a first wiring structure formed in a first region; and

a second wiring structure formed in a second region,

wherein the first through via is connected with the first wiring structure,

wherein the second through via is connected with the second wiring structure,

wherein the first region is a region where a standard cell to which a first power supply potential is supplied is formed,

wherein the second region is a region where a standard cell to which the first power supply potential is supplied and a macro to which a second power supply potential is supplied are formed, and

wherein the second wiring included in the semi-global wiring layer is interposed in an electrical connection path between the second through via and the standard cell formed in the second region.

9. The semiconductor device according to claim 7 ,

wherein the wiring structure includes:

a first wiring structure formed in a first region; and

a second wiring structure formed in a second region,

wherein the first through via is connected with the first wiring structure,

wherein the second through via is connected with the second wiring structure,

wherein the first region is a region where a standard cell to which a first power supply potential is supplied is formed,

wherein the second region is a region where a standard cell to which the first power supply potential is supplied and a macro to which a second power supply potential is supplied are formed, and

wherein the second through via and the standard cell formed in the second region are electrically connected only by the third wiring included in the local wiring layer.

10. The semiconductor device according to claim 1 ,

wherein the semiconductor device is a semiconductor chip,

wherein the semiconductor chip has a first bump electrode that is formed on the wiring structure and is electrically connected with the wiring structure, and

wherein the bypass wiring is configured to be connectable with a second bump electrode that is formed in another semiconductor chip arranged in a laminated manner on the semiconductor chip.

11. The semiconductor device according to claim 8 ,

wherein the bypass wiring is connected with a wire.

12. The semiconductor device according to claim 1 ,

wherein the wiring structure includes:

a first trunk line which extends in a first direction in a plan view and to which a first potential is supplied; and

a branch line structure positioned in a lower layer of the first trunk line and extending in a second direction intersecting the first direction in a plan view,

wherein the branch line structure includes:

a first branch line to which the first potential is supplied;

a second branch line to which a second potential is supplied and which is positioned next to the first branch line; and

a third branch line to which the first potential is supplied and which is positioned next to the second branch line,

wherein the wiring structure further includes:

a first connection structure which is formed in the same layer as the first branch line and the third branch line, is connected with the first branch line, is connected with the first trunk line by a plurality of first plugs, and has a portion overlapping the first through via in a plan view; and

a second connection structure which is formed in the same layer as the first branch line and the third branch line, is connected with the third branch line, is connected with the first trunk line by a plurality of second plugs, has a portion overlapping the first through via in a plan view, and is arranged apart from the first connection structure via a space in a plan view, and

wherein the second branch line is arranged in the space.

13. The semiconductor device according to claim 12 ,

wherein the first potential is a power supply potential, and

wherein the second potential is a reference potential.

14. The semiconductor device according to claim 12 ,

wherein the first potential is a reference potential, and

wherein the second potential is a power supply potential.