Component for use in plasma processing apparatus, plasma processing apparatus, and method for manufacturing the component
A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.
1. A component for use in a plasma processing apparatus, which is to be exposed to a plasma, the component comprising:
a holding body; and
a shower plate connected to a bottom surface of the holding body, the shower plate including:
(i) a base material having a plurality of through holes and a first rough surface at which one end of each of the through holes is opened, the first rough surface of the base material formed only on a surface of the base material disposed outside of the through holes and at a side of the shower plate that is not connected to the bottom surface of the holding body,
(ii) an alumite layer having a second rough surface formed on the first rough surface of the base material by an anodic oxidation process, wherein the alumite layer has a thickness of about 20 μm to 150 μm, and
(iii) a thermally sprayed film formed on the second rough surface of the alumite layer, wherein the thermally sprayed film has a thickness of about 150 μm to 250 μm,
wherein the plurality of through holes include substantially vertical sidewalls and tapered ends, wherein the tapered ends are located adjacent the side of the shower plate that is not connected to the holding body,
wherein the alumite layer is formed on the vertical sidewalls and the tapered ends,
wherein the thermally sprayed film is formed on the alumite layer on the side of the shower plate that is not connected to the holding body but is not provided on the substantially vertical sidewalls of the through holes, and
wherein at a location of the first rough surface, the alumite layer is formed on the first rough surface and the thermally sprayed film is formed on the alumite layer while, on the substantially vertical sidewalls of the through holes, only the alumite layer is formed.
2. The component of claim 1 , wherein the first rough surface of the base material has an arithmetic average roughness ranging from 1.5 μm to 5 μm.
3. The component of claim 1 , wherein the component is configured to inject a gas into a processing chamber of the plasma processing apparatus.
4. The component of claim 1 , wherein the alumite layer has a film thickness of 50 μm or above.
5. A plasma processing apparatus comprising the component of claim 1 .
6. A method for manufacturing a shower plate for use in a plasma processing apparatus, which is to be exposed to a plasma, the method comprising:
providing a base material of the shower plate having a plurality of through holes, the plurality of through holes having substantially vertical side walls and tapered ends;
performing roughening on one surface of the base material at which one end of each of the plurality of through holes is opened so as to form a first rough surface, the first rough surface formed on the one surface only outside of the through holes;
forming an alumite layer having a second rough surface on the first rough surface by an anodic oxidation process, wherein the alumite layer has a thickness of about 20 μm to 150 μm; and
forming a thermally sprayed film on the second rough surface of the alumite layer wherein the thermally sprayed film has a thickness of about 150 μm to 250 μm,
wherein the base material is connected to a bottom surface of a holding body, and the first rough surface of the base material is provided on a side of the base material that is not connected to the bottom surface of the holding body,
wherein the alumite layer is formed on the vertical sidewalls and the tapered ends,
wherein the thermally sprayed film is formed on the alumite layer on the side of the shower plate that is not connected to the holding body but is not provided on the substantially vertical sidewalls of the through holes, and
wherein at a location of the first rough surface, the alumite layer is formed on the first rough surface and the thermally sprayed film is formed on the alumite layer while, on the substantially vertical sidewalls of the through holes, only the alumite layer is formed.
7. The method of claim 6 , wherein in said performing roughening to form the first rough surface, the first rough surface of the base material is formed to have an arithmetic average roughness ranging from 1.5 μm to 5 μm.
8. The method of claim 6 , wherein the roughening to form the first rough surface is a blast processing and an abrasive used for the blast processing has a grain size of F40 to F220 defined in JIS R 6001.
9. The method of claim 6 , wherein the roughening to form the first rough surface is a blast processing and an abrasive used for the blast processing is silicon carbide (SiC), glass bead, or zirconium.
10. The method of claim 6 , wherein the tapered shape of each of the plurality of through holes is formed by a chamfering process prior to performing the roughening to form the first rough surface.
11. The component of claim 1 , wherein a gas diffusion space that communicates with the plurality of through holes is provided between the holding body and the shower plate.
12. The method of claim 6 , wherein a gas diffusion space that communicates with the plurality of through holes is provided between the holding body and the base material.