IP Library Granted Patent US 10,816,484
Granted Patent B2
US 10,816,484 · App. 16/661,305 · Granted Oct 27, 2020

Flaw inspection device and flaw inspection method

Inventors: Toshifumi Honda (Tokyo, JP); Takahiro Urano (Tokyo, JP); Mamoru Kobayashi (Tokyo, JP); Hisashi Hatano (Tokyo, JP); Hironori Sakurai (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
G01N21/956G01N21/8806G05B19/41875H01L22/10G01N2201/061H01L22/12
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Quick Facts
Patent No.
US 10,816,484
App. No.
16/661,305
Granted
Oct 27, 2020
Kind
B2
Abstract

The present invention aims at providing a defect inspection technique capable of setting parameters used for detecting a defect with a less burden to a user. A defect inspection device according to the present invention receives multiple reference values input by the user and calculates a defect extraction condition so as to optimize an evaluation value calculated with the use of the reference values, the number of actual reports, and the number of false reports.

Claims (33)

1. A defect inspection device for inspecting a defect of an inspection target, comprising:

a feature amount calculator that calculates a feature amount of a defect candidate of the inspection target;

a storage device that stores extraction condition data describing an initial value of a con the defect of the inspection target;

a defect determination processor that compares the feature amount with the condition to extract the defect of the inspection target;

a display that outputs information representing the defect extracted by the defect determination processor; and

an interface that receives a designation input for designating whether the defect extracted by the defect determination processor is an actual report or a false report,

wherein the defect determination processor receives a plurality of reference values though the interface and calculates the condition which an evaluation value calculated using the number of actual reports, the number of false reports, and the reference values becomes optimum for each of the reference values,

wherein the defect determination processor extracts the defect of the inspection target by using the condition calculated for each of the reference values, and

wherein the display outputs the condition calculated by the defect determination processor for each of the reference values and outputs the defects extracted using the conditions calculated for each of the reference values, and outputs information representing the extracted defect by using the condition calculated by the defect determination processor for each of the reference values.

2. The defect inspection device according to claim 1 ,

wherein the defect determination processor calculates an actual report rate representing a rate of the number of actual reports to a total of the number of actual records and the number of false reports and calculates the evaluation value by using the actual report rate.

3. The defect inspection device according to claim 2 ,

wherein the defect determination processor receives, as each of the reference values, a numerical value designating a weight of the actual report rate at the evaluation value, and calculates the evaluation value using the weight.

4. The defect inspection device according to claim 1 ,

wherein the defect determination processor receives a numerical value of a defect capture rate indicating a rate of the number of actual reports to the number of actual reports detected by using the initial value of the condition as the reference value, and

the defect determination processor calculates the evaluation value by using the defect capture rate.

5. The defect inspection device according to claim 1 ,

wherein the defect determination processor receives a numerical value of a false report rate representing a rate of the number of false reports to a total of the number of actual reports and the number of false reports as the reference value, and

the defect determination processor calculates the evaluation value by using the false report rate.

6. The defect inspection device according to claim 1 ,

wherein the defect determination processor receives a numerical value of a defect residual rate representing a rate of the number of false reports to the number of false reports detected by using the initial value of the condition as the reference value, and

the defect determination processor calculates the evaluation value by using the defect residual rate.

7. The defect inspection device according to claim 1 ,

wherein the defect determination processor receives an instruction to designate which of the conditions calculated for each of the reference values is to be used and extracts the defect of the inspection target by using the designated condition.

8. A defect inspection method for inspecting a defect of an inspection target, comprising:

calculating a feature amount from an exterior appearance of the inspection target;

reading detection condition data describing an initial value of a condition for extracting the defect of the inspection target from a storage processor;

comparing the feature amount with the condition to extract the defect of the inspection target;

outputting information representing the defect that is extracted when comparing the feature amount to extract the defect; and

receiving a designation input for designating whether the defect that is extracted when comparing the feature amount to extract the defect is an actual report or a false report,

wherein comparing the feature amount to extract the defect further comprises: receiving a plurality of reference values; and calculating the condition under which an evaluation value calculated using the number of actual reports, the number of false reports, and the reference values becomes optimum for each of the reference values,

wherein comparing the feature amount to extract the defect further comprises: extracting the defect of the inspection target by using the condition calculated for each of the reference values, and

wherein outputting information representing the defect further comprises: outputting the condition that is calculated when comparing the feature amount to extract the defect for each of the reference values; and outputting information representing the defect that is extracted when comparing the feature amount to extract the defect by using the condition calculated for each of the reference values.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →
Continuity (2)
Continuation 16085890
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