Apparatus, system, and method for handling aligned wafer pairs
An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
1. An end effector apparatus for handling wafers comprising:
a frame member having a Y-shaped frame;
a floating carrier connected to a front end of the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter proximate to the front end of the frame member and the frame member including two arms at the front end of the frame member; and
a plurality of vacuum pads connected along the semi-circular interior perimeter of the floating carrier, wherein each of the plurality of vacuum pads extend inward of the semicircular interior perimeter of the floating carrier.
2. The end effector apparatus of claim 1 , wherein the plurality of vacuum pads are movably connected to the floating carrier and radially adjustable along the semi-circular interior perimeter.
3. The end effector apparatus of claim 1 , wherein the floating carrier is movably connected to the frame member and adjustable along an axis of the semi-circular interior perimeter, wherein a size of the gap is adjustable.
4. The end effector apparatus of claim 3 , wherein a plurality of limit features loosely couple the floating carrier to the frame member.
5. The end effector apparatus of claim 1 , further comprising a plurality of clamp-spacer assemblies connected to at least one of the frame member and the floating carrier, each of the clamp-spacer assemblies having at least one spacer flag and at least one mechanical clamp.
6. The end effector apparatus of claim 5 , wherein the plurality of clamp-spacer assemblies are spaced substantially equidistantly on the semi-circular interior perimeter of the floating carrier.
7. The end effector apparatus of claim 5 , wherein the at least one mechanical clamp is positioned below a bottom surface of the floating carrier.
8. The end effector apparatus of claim 1 , further comprising a centering mechanism removably engagable with the frame member and the floating carrier, wherein the centering mechanism prevents a position change of the floating carrier relative to the frame member.
9. The end effector apparatus of claim 8 , wherein the centering mechanism further comprises a pin removably engagable between a first hole within the frame member and a second hole within the floating carrier, wherein engagement of the pin in the first and second holes aligns the floating carrier to the frame member along a direction of an axis of the semi-circular interior perimeter of the floating carrier.
10. The end effector apparatus of claim 8 , wherein the centering mechanism further comprises a mechanical clamp.
11. The end effector apparatus of claim 8 , wherein the centering mechanism further comprises a vacuum clamp.
12. A laser pre-bond device comprising the end effector of the claim 1 for a laser pre-bond process.
13. An end effector apparatus for handling wafers comprising:
a frame member with a semi-circular inner perimeter at its front end;
a floating carrier connected directly to the front end of the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter; and
a plurality of vacuum pads connected along the semi-circular interior perimeter of the floating carrier, wherein each of the plurality of vacuum pads extend inward of the semi-circular interior perimeter of the floating carrier.
14. The end effector apparatus of claim 13 , wherein the semicircular interior perimeter of the floating carrier is similar to the semi-circular inner perimeter of the frame member.