Selectively etched self-aligned via processes
Processing methods may be performed to expose a contact region on a semiconductor substrate. The methods may include selectively recessing a first metal on a semiconductor substrate with respect to an exposed first dielectric material. The methods may include forming a liner over the recessed first metal and the exposed first dielectric material. The methods may include forming a second dielectric material over the liner. The methods may include forming a hard mask over selected regions of the second dielectric material. The methods may also include selectively removing the second dielectric material to expose a portion of the liner overlying the recessed first metal.
1. A method of exposing a contact region on a semiconductor substrate, the method comprising:
selectively recessing a first metal on a semiconductor substrate with respect to an exposed first dielectric material;
forming a liner over the recessed first metal and the exposed first dielectric material;
forming a second dielectric material over the liner;
forming a third dielectric material over the second dielectric material, wherein the third dielectric material and the first dielectric material are the same material;
forming a hard mask over selected regions of the second dielectric material;
performing a first selective removal of a portion of the third dielectric material, wherein the first selective removal does not expose the second dielectric material; and
selectively removing the second dielectric material to expose a portion of the liner overlying the recessed first metal, wherein selectively removing the second dielectric material comprises selectively removing the third dielectric material and the second dielectric material.
2. The method of exposing a contact region of claim 1 , wherein a process chemistry used for the selective removal is characterized by a selectivity toward the second dielectric material that is greater than a selectivity toward the third dielectric material.
3. The method of exposing a contact region of claim 1 , further comprising forming a photoresist pattern overlying the hard mask.
4. The method of exposing a contact region of claim 3 , further comprising removing the photoresist pattern subsequent the first selective removal operation.
5. The method of exposing a contact region of claim 4 , further comprising performing a second selective removal operation to remove a second portion of the third dielectric material and the second dielectric material.
6. The method of exposing a contact region of claim 5 , wherein the first selective removal operation and the second selective removal operation are anisotropic.
7. The method of exposing a contact region of claim 5 , wherein the first selective removal operation or the second selective removal operation comprises a dry etch using a plasma enhanced fluorine-containing precursor.
8. A method of exposing a contact region on a semiconductor substrate, the method comprising:
selectively recessing a metal on a semiconductor substrate with respect to an exposed first dielectric material to form a gap;
forming a second dielectric material overlying the metal within the gap to height of the first dielectric material;
forming a third dielectric material overlying the second dielectric material and the first dielectric material;
forming a hard mask over selected regions of the second dielectric material; and
selectively removing both of the third dielectric material and the second dielectric material to expose the recessed metal during a single removal operation, wherein a process chemistry used for the selective removal is characterized by a selectivity toward the second dielectric material that is greater than a selectivity toward the third dielectric material.
9. The method of exposing a contact region of claim 8 , wherein the third dielectric material and the first dielectric material are the same material.
10. The method of exposing a contact region of claim 8 , further comprising forming a photoresist pattern overlying the hard mask.
11. The method of exposing a contact region of claim 10 , further comprising performing a first selective removal of a portion of the third dielectric material, wherein the first selective removal does not expose the second dielectric material.
12. The method of exposing a contact region of claim 11 , further comprising removing the photoresist pattern subsequent the first selective removal operation.
13. The method of exposing a contact region of claim 12 , further comprising performing a second selective removal operation to remove a second portion of the third dielectric material and the second dielectric material.
14. The method of exposing a contact region of claim 13 , wherein the first selective removal operation and the second selective removal operation are anisotropic.
15. The method of exposing a contact region of claim 13 , wherein the first selective removal operation or the second selective removal operation comprises a dry etch using a plasma enhanced fluorine-containing precursor.