Fingerprint sensor device and method
A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
1. A method comprising:
attaching a fingerprint sensor to a first side of a first redistribution layer;
attaching a high voltage chip to a second side of the first redistribution layer, wherein the second side of the first redistribution layer is opposite to the first side of the first redistribution layer; and
attaching a substrate to the second side of the first redistribution layer, wherein the high voltage chip extends into an opening of the substrate.
2. The method of claim 1 , further comprising forming a conductive column on the first side of the first redistribution layer adjacent the fingerprint sensor.
3. The method of claim 2 , further comprising encapsulating the fingerprint sensor and the conductive column in an encapsulant.
4. The method of claim 1 , forming a second redistribution layer in electrical contact with the fingerprint sensor, wherein the fingerprint sensor is interposed between the first redistribution layer and the second redistribution layer.
5. The method of claim 4 , further comprising forming a sensor surface material layer on the second redistribution layer, wherein the second redistribution layer is interposed between the sensor surface material layer and the fingerprint sensor.
6. The method of claim 1 , wherein a center of the high voltage chip is spaced apart from a center of the fingerprint sensor in a plan view.
7. The method of claim 1 , wherein a width of the high voltage chip is less than a width of the fingerprint sensor.
8. A method comprising:
forming a plurality of through vias in a fingerprint sensor substrate, the plurality of through vias extending from a first side of the fingerprint sensor substrate to a second side of the fingerprint sensor substrate, the first side of the fingerprint sensor substrate being opposite to the second side of the fingerprint sensor substrate;
forming a first redistribution layer on the first side of the fingerprint sensor substrate;
attaching a high voltage chip to the first redistribution layer, the first redistribution layer being interposed between the high voltage chip and the fingerprint sensor substrate; and
attaching a second substrate to the first redistribution layer, the first redistribution layer being interposed between the second substrate and the fingerprint sensor substrate.
9. The method of claim 8 , wherein the second substrate has an opening, and wherein the high voltage chip is disposed within the opening.
10. The method of claim 8 , forming an array of electrodes on the second side of the fingerprint sensor substrate, wherein the plurality of through vias electrically couple the array of electrodes to the first redistribution layer.
11. The method of claim 8 , further comprising attaching a fingerprint sensor cover to the second side of the fingerprint sensor substrate.
12. The method of claim 11 , wherein the fingerprint sensor cover is attached to the second side of the fingerprint sensor substrate using a glue layer.
13. The method of claim 8 , wherein the high voltage chip is disposed at a corner of the fingerprint sensor substrate in a plan view.
14. The method of claim 8 , wherein a width of the high voltage chip is less than a width of the fingerprint sensor substrate.
15. A method comprising:
forming a plurality of first through vias and a plurality of second through vias in a fingerprint sensor substrate, the plurality of first through vias and the plurality of second through vias extending from a first side of the fingerprint sensor substrate to a second side of the fingerprint sensor substrate, the first side of the fingerprint sensor substrate being opposite to the second side of the fingerprint sensor substrate;
forming an array of electrodes over the first side of the fingerprint sensor substrate;
attaching a fingerprint sensor cover to the first side of the fingerprint sensor substrate, wherein the array of electrodes is interposed between the fingerprint sensor substrate and fingerprint sensor cover;
attaching a high voltage chip to the second side of the fingerprint sensor substrate, wherein the high voltage chip is bonded to the plurality of first through vias; and
attaching a second substrate to the second side of the fingerprint sensor substrate, wherein the second substrate is bonded to the plurality of second through vias.
16. The method of claim 15 , wherein the second substrate comprises an opening, and wherein a sidewall of the high voltage chip faces a sidewall of the opening.
17. The method of claim 15 , wherein the fingerprint sensor cover comprises sapphire or glass.
18. The method of claim 15 , wherein the fingerprint sensor cover is attached to the first side of the fingerprint sensor substrate using a glue layer.
19. The method of claim 15 , wherein the plurality of first through vias electrically couple the high voltage chip to the array of electrodes.
20. The method of claim 15 , wherein the plurality of first through vias are interposed between a first subset of the plurality of second through vias and a second subset of the plurality of second through vias.