IP Library › Granted Patent US 10,862,065
Granted Patent B2
US 10,862,065 · App. 16/438,881 · Granted Dec 8, 2020

Method for manufacturing light-emitting device

Inventors: Yoshiharu Hirakata (Kanagawa, JP); Shunpei Yamazaki (Tokyo, JP)
H01L51/524H01L27/3209H01L51/003H01L51/0097H01L51/52H01L51/5253H01L51/56H01L27/3244H01L2227/323H01L2227/326H01L2251/5338H01L2251/5361H04M1/0268Y02E10/549Y02P70/521
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Quick Facts
Patent No.
US 10,862,065
App. No.
16/438,881
Granted
Dec 8, 2020
Kind
B2
Abstract

To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

Claims (49)

1. A manufacturing method of an electronic device comprising:

preparing an exterior unit, a light-emitting panel, a circuit, an inner lid, a battery, and an outer lid, wherein the exterior unit has a first curved long side surface; and

fixing the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid so that the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid are placed in this order,

wherein the light-emitting panel comprises:

a first substrate having a projected region, the first substrate being flexible;

a light-emitting element; and

a terminal portion on the projected region.

2. The manufacturing method of an electronic device according to claim 1 ,

wherein the battery is placed between the inner lid and the outer lid.

3. The manufacturing method of an electronic device according to claim 1 ,

wherein the light-emitting panel has a second curved long side surface, and

wherein the second curved long side surface is placed along the first curved long side surface.

4. The manufacturing method of an electronic device according to claim 1 , further comprising the step of forming the light-emitting panel,

wherein the step of forming the light-emitting panel includes:

attaching a second substrate to the first substrate; and

bending the first substrate by a force generated by the second substrate.

5. The manufacturing method of an electronic device according to claim 1 ,

wherein the inner lid and the outer lid have a similar size, and

wherein the inner lid is bigger in size than the battery.

6. The manufacturing method of an electronic device according to claim 1 , wherein the projected region is facing a second curved long side surface, or is perpendicular to the battery, or projects from a curved long side surface of the light-emitting panel.

7. The manufacturing method of an electronic device according to claim 1 , wherein a desiccant or a deoxidant is stored in a space sealed by the inner lid and the exterior unit.

8. The manufacturing method of an electronic device according to claim 1 , wherein the inner lid and the outer lid have a similar size or wherein the inner lid is bigger in size than the battery.

9. The manufacturing method of an electronic device according to claim 1 , wherein the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid are fixed in this order without another element provided between the exterior unit and the light-emitting panel, or without another element provided between the light-emitting panel and the circuit, or without another element provided between the circuit and the inner lid, or without another element provided between the inner lid and the battery, or without another element provided between the battery and the outer lid.

10. The manufacturing method of an electronic device according to claim 1 , wherein the projected region is facing a second curved long side surface and is perpendicular to the battery and projects from a curved long side surface of the light-emitting panel.

11. A manufacturing method of an electronic device comprising:

preparing an exterior unit, a light-emitting panel, a circuit, an inner lid, a battery, and an outer lid, wherein the exterior unit has a first curved long side surface; and

fixing the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid so that the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid are placed in this order,

wherein the light-emitting panel comprises:

a first substrate having a projected region, the first substrate being flexible;

a light-emitting element; and

a terminal portion on the projected region, and

wherein the projected region is placed along the first curved long side surface.

12. The manufacturing method of an electronic device according to claim 11 ,

wherein the battery is placed between the inner lid and the outer lid.

13. The manufacturing method of an electronic device according to claim 11 ,

wherein the light-emitting panel has a second curved long side surface, and

wherein the second curved long side surface is placed along the first curved long side surface.

14. The manufacturing method of an electronic device according to claim 11 , further comprising the step of forming the light-emitting panel,

wherein the step of forming the light-emitting panel includes:

attaching a second substrate to the first substrate; and

bending the first substrate by a force generated by the second substrate.

15. The manufacturing method of an electronic device according to claim 11 , wherein the projected region is facing a second curved long side surface, or is perpendicular to the battery, or projects from a curved long side surface of the light-emitting panel.

16. The manufacturing method of an electronic device according to claim 11 , wherein a desiccant or a deoxidant is stored in a space sealed by the inner lid and the exterior unit.

17. The manufacturing method of an electronic device according to claim 11 , wherein the inner lid and the outer lid have a similar size or wherein the inner lid is bigger in size than the battery.

18. The manufacturing method of an electronic device according to claim 11 , wherein the exterior unit, the light-emitting panel, the circuit, the inner lid, the battery, and the outer lid are fixed in this order without another element provided between the exterior unit and the light-emitting panel, or without another element provided between the light-emitting panel and the circuit, or without another element provided between the circuit and the inner lid, or without another element provided between the inner lid and the battery, or without another element provided between the battery and the outer lid.

19. The manufacturing method of an electronic device according to claim 11 , wherein the projected region is facing a second curved long side surface and is perpendicular to the battery and projects from a curved long side surface of the light-emitting panel.

20. The manufacturing method of an electronic device according to claim 11 ,

wherein the inner lid and the outer lid have a similar size, and

wherein the inner lid is bigger in size than the battery.

Priority Claims (1)
JP 2012-178810 · Aug 10, 2012 · national
Continuity (3)
Continuation 15357636 · Nov 21, 2016
Continuation 13960998 · Aug 7, 2013
Related Publication 20190296258A1 · Sep 26, 2019
Cited By (1)
US 12,271,241