Isolation structures of semiconductor devices

1. A method of fabricating a semiconductor device, the method comprising:

forming a fin structure with a stacked fin portion and a fin base portion on a substrate, wherein the stacked fin portion is epitaxially grown on the fin base portion;

forming polysilicon gate structures with a first work function value on first fin regions of the stacked fin portion;

forming doped fin regions with dopants of a first type conductivity on second fin regions of the stacked fin portion;

doping one of the polysilicon gate structures with dopants of a second type conductivity to adjust the first work function value to a second work function value;

patterning a photoresist layer on two of the polysilicon gate structures adjacent to the one of the polysilicon gate structures prior to the doping; and

replacing the two of the polysilicon gate structures with non-polysilicon gate structures having a third work function value less than the first and second work function values.

2. The method of claim 1 , wherein a threshold voltage of the one of the polysilicon gate structures is greater than a threshold voltage of the non-polysilicon gate structures.

3. The method of claim 1 , wherein the replacing the two of the polysilicon gate structures comprises forming two gate all around (GAA) structures.

4. The method of claim 3 , wherein the forming the two GAA structures comprises:

patterning a photoresist layer on the one of the polysilicon gate structures after the doping;

removing the two of the polysilicon gate structures; and

etching portions of the first semiconductor layers in the first fin regions exposed by the removal of the two of the polysilicon gate structures.

5. The method of claim 3 , wherein the forming the two GAA structures further comprises depositing non-polysilicon materials around portions of the second semiconductor layers in the first fin regions exposed by the etching of the portions of the first semiconductor layers.

6. The method of claim 1 , wherein the forming the polysilicon gate structures comprises forming the polysilicon gate structures with an aspect ratio equal to or greater than 9.

7. A method, comprising:

forming a fin structure on a substrate;

forming polysilicon structures with a first work function value on first fin portions of the fin structure;

forming doped fin regions with dopants of a first type conductivity on second fin portions of the fin structure;

doping at least one of the polysilicon structures with dopants of a second type conductivity to adjust the first work function value to a greater second work function value; and

replacing at least two of the polysilicon structures adjacent to the at least one of the polysilicon structures with gate structures having a third work function value less than the first and second work function values.

8. The method of claim 7 , wherein the doping comprises ion implanting the dopants of the second type conductivity into the at least one of the polysilicon structures.

9. The method of claim 7 , wherein the at least one of polysilicon structures is interposed between the at least two of the polysilicon structures.

10. The method of claim 7 , further comprising patterning a photoresist layer on the at least two of the polysilicon structures prior to the doping.

11. The method of claim 7 , wherein the replacing the at least two of the polysilicon structures comprises:

patterning a photoresist layer on the at least one of the polysilicon structures after the doping; and

etching the at least two of the polysilicon structures.

12. The method of claim 7 , wherein the gate structures comprise high-k metal gate structures.

13. The method of claim 7 , wherein the forming the polysilicon structures comprises forming the polysilicon structures with an aspect ratio equal to or greater than 9.

14. The method of claim 7 , further comprising:

depositing an oxide layer on the fin structure;

forming the polysilicon structures on first portions of the oxide layer; and

removing second portions of the oxide layer to expose the second fin portions prior to the forming of the doped fin regions.

15. The method of claim 7 , wherein the forming the doped fin regions comprises:

etching the second fin portions to form recessed fin portions; and

epitaxially growing the doped fin regions from the recessed fin portions.

16. The method of claim 7 , wherein the forming the doped fin regions comprises epitaxially growing the doped fin regions on sidewalls and top surfaces of the second fin portions.

17. A method, comprising:

forming a first fin field effect transistor (finFET) with a first non-polysilicon gate structure and a doped epitaxial fin region on a fin structure on a substrate, wherein the doped epitaxial fin region has dopants of a first type conductivity;

forming a second finFET with a second non-polysilicon gate structure disposed on the fin structure; and

forming an isolation structure with a polysilicon gate structure on the fin structure to electrically isolate the first and second finFETs from each other, wherein the polysilicon gate structure has dopants of a second type conductivity opposite to the first type conductivity.

18. The method of claim 17 , wherein the forming the isolation structure comprises forming the polysilicon gate structure with a work function value greater than a work function value of the first or second non-polysilicon gate structure.

19. The method of claim 17 , wherein the forming the isolation structure comprises doping the polysilicon gate structure with dopants of conductivity type that is opposite to dopants of the doped epitaxial fin region.

20. The method of claim 17 , wherein the non-polysilicon gate structures comprises gate all around (GAA) structures.