Selective layer formation using deposition and removing
Methods and systems for selectively depositing dielectric films on a first surface of a substrate relative to a passivation layer previously deposited on a second surface are provided. The methods can include at least one cyclical deposition process used to deposit material on the first surface while the passivation layer is removed, thereby preventing deposition over the passivation layer.
1. An atomic layer deposition (ALD) process for selectively forming a dielectric material on a first surface of a patterned substrate, comprising:
providing a substrate comprising a first surface and a second surface, wherein the second surface comprises a passivation layer thereover;
conducting at least one deposition cycle comprising alternately and sequentially contacting the substrate with a first precursor and a second reactant comprising oxygen;
wherein the second reactant reacts with the first precursor to form a dielectric material on the first surface; and
wherein the passivation layer is ashed by the second reactant during each deposition cycle.
2. The method of claim 1 , wherein the first surface is a dielectric surface.
3. The method of claim 1 , wherein the first surface comprises a low-k material.
4. The method of claim 1 , wherein the second surface is a metal surface.
5. The method of claim 1 , wherein the dielectric material comprises silicon oxide.
6. The method of claim 1 , wherein the dielectric material comprises a metal oxide.
7. The method of claim 1 , wherein the first precursor is an alkylaminosilane.
8. The method of claim 1 , wherein the passivation layer comprises an organic material.
9. The method of claim 1 , wherein the passivation layer is selectively deposited on the second surface relative to the first surface prior to beginning the first deposition cycle.
10. The method of claim 1 , wherein the deposition cycle is repeated a plurality of times to form an oxide film of a desired thickness on the dielectric surface.
11. The method of claim 10 , further comprising the selective deposition of additional passivation layer to the passivation layer between the beginning and end of each deposition cycle.
12. The method of claim 1 , wherein the at least one deposition cycle begins with contacting the substrate with the second reactant before contact with the first precursor.
13. The method of claim 1 , wherein contacting the substrate with the second reactant further comprises activating the second reactant with plasma.
14. The method of claim 1 , wherein the dielectric material is selectively formed on the first surface relative to the passivation layer.
15. The method of claim 1 , wherein the dielectric material is formed on the passivation layer and wherein the dielectric material is removed from the passivation layer with the ashing of the passivation layer, thereby selectively forming the dielectric material on the first surface.
16. A cyclical deposition process for selectively a forming a material on a surface of a patterned substrate, comprising:
providing a substrate comprising a first surface and a second surface, wherein the second surface comprises a passivation layer thereover;
conducting at least one deposition cycle comprising alternately and sequentially contacting the substrate with a first precursor and a second reactant;
wherein the second reactant reacts with the first precursor to form the material on the first surface; and
wherein the passivation layer is etched by the second reactant during each deposition cycle.
17. The cyclical deposition process of claim 16 , wherein the second reactant comprises plasma-activated species.
18. The cyclical deposition process of claim 17 , wherein the second reactant comprises oxygen, the passivation layer comprises an organic layer, and etching comprises ashing.
19. The cyclical deposition process of claim 16 , wherein deposition is halted before the etching of the passivation layer exposes the second surface.
20. The cyclical deposition process of claim 19 , further comprising further depositing additional passivation layer over the second surface after halting the deposition and prior to continuing the deposition.
21. A plasma enhanced atomic layer deposition (PEALD) process for selectively forming an oxide material on a first dielectric surface of a patterned substrate, comprising:
providing a substrate comprising a first dielectric surface and a second metallic surface, wherein the second metallic surface comprises an organic passivation layer thereover;
conducting at least one deposition cycle comprising alternately and sequentially contacting the substrate with a first precursor and a second reactant comprising oxygen and plasma;
wherein the second reactant reacts with the first precursor to form an oxide material on the first dielectric surface; and
wherein the organic passivation layer is ashed by the second reactant during each deposition cycle.