Toposelective vapor deposition using an inhibitor
The current disclosure generally relates to the manufacture of semiconductor devices. Specifically, the disclosure relates to methods of depositing a layer on a substrate comprising a recess. The method comprises providing the substrate comprising a recess in a reaction chamber, depositing inhibition material on the substrate to fill the recess with inhibition material, removing the inhibition material from the substrate for exposing a deposition area and depositing a layer on the deposition area by a vapor deposition process. A vapor deposition assembly for performing the method is also disclosed.
1 . A method of depositing one or more layers on a substrate comprising a recess, wherein the method comprises:
depositing an inhibition material on the substrate to fill the recess;
removing the inhibition material from a top part of the recess; and
depositing, by a selective vapor deposition process, the one or more layers on the substrate where the inhibition material was removed until the one or more layers fill the top part of the recess to form an air gap in a lower part of the recess.
2 . The method of claim 1 , comprising:
removing, prior to the depositing of the one or more layers, some of the inhibition material from the lower part of the recess where the air gap is formed.
3 . The method of claim 1 , wherein the depositing of the one or more layers comprises multiple phases of depositing the one or more layers, and wherein the method further comprises:
removing, between the multiple phases, some or all of the inhibition material from the lower part of the recess where the air gap is formed.
4 . The method of claim 1 , comprising:
removing the inhibition material from a top surface of the substrate outside of the recess prior to the removing of the inhibition material from the top part of the recess; and
depositing one layer of the one or more layers on the top surface where the inhibition material was removed.
5 . The method of claim 1 , wherein the one or more layers comprises multiple lavers, and wherein each of the multiple layers comprises a different material.
6 . The method of claim 1 , wherein the selective vapor deposition process is a cyclic vapor deposition process.
7 . The method of claim 6 , wherein the cyclic vapor deposition process comprises supplying at least two precursors in an alternating and sequential manner.
8 . The method of claim 1 wherein the inhibition material comprises organic material.
9 . The method of claim 8 , wherein the organic material comprises a polymer or polyimide.
10 . The method of claim 1 , wherein the inhibition material inhibits the selective vapor deposition process from depositing the one or more layers on the substrate.
11 . A method of deposition of layers on a substrate comprising a recess filled with an inhibition material, wherein the method comprises:
removing a portion of the inhibition material from the substrate to expose a first deposition area;
depositing a first layer on the first deposition area by a selective vapor deposition process;
removing, after the depositing of the first layer, an additional portion of the inhibition material to expose a second deposition area in a top part of the recess; and
depositing a second layer on the second deposition area to form an air gap in a lower part of the recess covered by the second layer.
12 . The method of claim 11 , further comprising:
depositing the second layer on the first layer, wherein the first layer and the second layer comprise different materials.
13 . The method of claim 11 , wherein the first deposition area and the first layer extend into the recess, and the second layer is deposited over the first layer.
14 . The method of claim 11 , comprising:
removing, prior to the depositing of the second layer, some of the inhibition material from the lower part of the recess where the air gap is formed.
15 . The method of claim 11 , wherein the depositing of the second layer comprises:
depositing an initial portion of the second layer;
removing, after the depositing of the initial portion of the second layer, a remaining portion of the inhibition material from the lower part of the recess where the air gap is formed; and
depositing a remaining portion of the second layer after the removing of the remaining portion of the inhibition material.
16 . The method of claim 11 , wherein the selective vapor deposition process is a cyclic vapor deposition process that comprises supplying at least two precursors in an alternating and sequential manner.
17 . The method of claim 11 , wherein:
the removing of the portion of the inhibition material from the substrate to expose the first deposition area is performed in a first reaction chamber; and
the depositing of the first layer on the first deposition area is performed in a second reaction chamber.
18 . A vapor deposition assembly for depositing a layer on a substrate comprising a recess, the vapor deposition assembly comprising:
a first chamber configured and arranged to deposit an inhibition material on the substrate to fill the recess, and to remove the inhibition material from a top part of the recess; and
a second chamber configured and arranged to deposit, by a selective vapor deposition process, one or more layers on the substrate where the inhibition material was removed until the one or more layers fill the top part of the recess to form an air gap in a lower part of the recess.
19 . The vapor deposition assembly of claim 18 , wherein the vapor deposition assembly is a cluster tool.
20 . The vapor deposition assembly of claim 18 , further comprising:
an inhibition material precursor vessel coupled to the first chamber;
a layer precursor vessel coupled to the second chamber; and
a controller configured to control flow of precursors from the inhibition material precursor vessel and the layer precursor vessel into the first chamber and the second chamber, respectively.