IP Library Granted Patent US 10,892,262
Granted Patent B2
US 10,892,262 · App. 16/398,118 · Granted Jan 12, 2021

Semiconductor device having junctionless vertical gate transistor and method of manufacturing the same

Inventors: Jung-Min Moon (Seoul, KR); Tae-Kyun Kim (Daejeon, KR); Seok-Hee Lee (Daejeon, KR)
Assignees: SK hynix Inc.; Korea Advanced Institute of Science and Technology
H01L27/10814H01L29/105H01L29/66666H01L29/7827H01L29/7828H01L29/4236H01L29/42376
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Quick Facts
Patent No.
US 10,892,262
App. No.
16/398,118
Granted
Jan 12, 2021
Kind
B2
Abstract

A junctionless vertical gate transistor includes an active pillar vertically protruding from a substrate and including a first impurity region, a second impurity region and a third impurity region sequentially formed over the first impurity region; gate electrodes coupled to sidewalls of the second impurity region; and bit lines arranged in a direction of intersecting with the gate electrodes and each contacting the first impurity region. The first to the third impurity regions include impurities of the same polarity.

Claims (17)

1. A semiconductor device comprising:

an active pillar extending upward from a top surface of a substrate and including:

a first source/drain region provided at a first level,

a channel region provided at a second level higher than the first level, and

a second source/drain region provided at a third level higher than the second level;

a bit line coupled to the first source/drain region and buried within the substrate; and

a gate electrode coupled to the channel region,

wherein the first and the second source/drain regions and the channel region have the same polarities,

wherein the bit line is disposed over a liner insulation layer formed along inner sidewalls of a recess formed in the substrate, and

wherein a top surface of the bit line and a top surface of the liner insulation layer are level with the top surface of the substrate.

2. The semiconductor device of claim 1 ,

wherein the first and the second source/drain regions and the channel region are doped with the same impurities at substantially the same concentration, and

wherein substantially no junction is formed among the first and the second source/drain regions and the channel region.

3. The semiconductor device of claim 2 ,

wherein a doping concentration of the first and the second source/drain regions and the channel region is 8×10 18 to 2×10 19 atom/cm 3 .

4. The semiconductor device of claim 3 ,

wherein a thickness of the active pillar measured from one sidewall to an opposite sidewall is 5˜20 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2019
From: MOON, JUNG-MIN; KIM, TAE-KYUN; LEE, SEOK-HEE
To: SK HYNIX INC.; KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 049034/0210 →
Priority Claims (1)
KR 10-2012-0024991 · Mar 12, 2012 · national
Continuity (3)
Division 14825030 · Aug 12, 2015
Continuation 13759395 · Feb 5, 2013
Related Publication 20190252387A1 · Aug 15, 2019
Cited By (4)
US 12,369,311 US 12,389,586 US 12,557,296 US 12,581,641