Application specific electronics packaging systems, methods and devices
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel ( 68 a, 68 b ) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
1. A method of manufacturing electronic devices comprising:
forming a continuous carrier formed of an electrically conductive material and having a plurality of fingers, each finger of the plurality of fingers having an aperture therethrough;
molding a plurality of non-conductive substrates onto the carrier, the plurality of non-conductive substrates having apertures therethrough which are aligned with the apertures of the plurality of fingers;
forming traces on the substrates;
electroplating the traces;
electrically attaching components to the traces to form a plurality of devices, wherein the traces are electrically connected to the plurality of fingers;
singulating one of the devices from the remainder of the carrier.
2. The method of claim 1 , wherein forming the traces comprises:
ablating the substrate with a laser;
depositing an ink on the ablated surface; and
sintering the ink.
3. The method of claim 1 , wherein pockets are molded into the substrate such that portions of the carrier are exposed.
4. A device comprising:
a singulated carrier portion having a plurality of fingers, at least one finger of the plurality of fingers having an aperture therethrough;
a substrate molded onto the singulated carrier portion, the substrate having at least one aperture therethrough which is aligned with the aperture of the at least one finger;
seed layer traces on the substrate;
plated metal traces on the seed layer traces; and
a component electrically attached to at least one plated metal trace, wherein at least one plated metal trace is electrically connected to the at least one finger of the plurality of fingers.
5. The device of claim 4 , wherein the device comprises at least one of a printed circuit board, a flex circuit, a connector, a thermal management feature, EMI shielding, a high current conductor, an RFID apparatus, an antenna, a wireless power device, a sensor, a MEMS apparatus, an LED device, a microprocessor, a memory device, an ASIC, a passive device, an impedance control device, and an electro-mechanical apparatus.
6. The device of claim 4 , wherein the component is seated within a pocket formed in the substrate.
7. The device of claim 6 , wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed.
8. The device of claim 4 , wherein the singulated carrier portion comprises metal.
9. The device of claim 4 , wherein the singulated carrier portion comprises a flex material.
10. The device of claim 9 , wherein the flex material comprises a polyimide flex material.
11. The device of claim 4 , wherein the plated metal traces comprise electroplated plated metal traces.
12. The device of claim 4 , wherein the seed layer traces comprise sintered ink.
13. The device of claim 4 , wherein the seed layer traces comprise sintered paste.
14. A device comprising:
a singulated carrier portion having a plurality of fingers, at least one finger of the plurality of fingers having an aperture therethrough;
a substrate molded onto the singulated carrier portion, the substrate having at least one aperture therethrough which is aligned with the aperture of the at least one finger;
conductive traces formed on the substrate with a laser and electroplating;
a component electrically coupled to at least one of the conductive traces, wherein at least one conductive trace is electrically connected to the at least one finger of the plurality of fingers.
15. The device of claim 14 , wherein the device comprises at least one of a printed circuit board, a flex circuit, a connector, a thermal management feature, EMI shielding, a high current conductor, an RFID apparatus, an antenna, a wireless power device, a sensor, a MEMS apparatus, an LED device, a microprocessor, a memory device, an ASIC, a passive device, an impedance control device, and an electro-mechanical apparatus.
16. The device of claim 14 , wherein the component is seated within a pocket formed in the substrate.
17. The device of claim 16 , wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed.
18. The device of claim 14 , wherein the singulated carrier portion comprises metal.
19. The device of claim 14 , wherein the singulated carrier portion comprises a flex material.
20. The device of claim 19 , wherein the flex material comprises a polyimide flex material.