Semiconductor device and manufacturing method thereof
To offer a semiconductor device including a thin film transistor having excellent characteristics and high reliability and a method for manufacturing the semiconductor device without variation. The summary is to include an inverted-staggered (bottom-gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used for a semiconductor layer and a buffer layer is provided between the semiconductor layer and source and drain electrode layers. An ohmic contact is formed by intentionally providing a buffer layer containing In, Ga, and Zn and having a higher carrier concentration than the semiconductor layer between the semiconductor layer and the source and drain electrode layers.
1. A semiconductor device comprising a transistor, the transistor comprising:
a gate electrode over a substrate;
a first insulating film over the gate electrode;
a second insulating film over the first insulating film;
a first oxide semiconductor layer over the second insulating film, the first oxide semiconductor layer comprising a channel formation region of the transistor overlapping with the gate electrode;
a channel protective layer over the channel formation region;
a first layer over the first oxide semiconductor layer, the first layer containing indium or zinc;
a second layer over the first layer and the channel protective layer, the second layer containing titanium; and
a conductive layer over the second layer and the channel protective layer, the conductive layer electrically connected to the first oxide semiconductor layer,
wherein a first top edge of the second layer is projected from a first bottom edge of the conductive layer, and
wherein a second top edge opposite to the first top edge of the second layer is projected from a second bottom edge opposite to the first bottom edge of the conductive layer.
2. The semiconductor device according to claim 1 ,
wherein the channel protective layer includes a halogen element, and
wherein the halogen element is one of fluorine and chlorine.
3. The semiconductor device according to claim 2 , wherein a concentration of the halogen element is greater than or equal to 1×10 15 cm −3 and less than or equal to 1×10 20 cm −3 .
4. The semiconductor device according to claim 1 ,
wherein the first insulating film is a silicon nitride film, and
wherein the second insulating film is a silicon oxide film.
5. The semiconductor device according to claim 1 , wherein the semiconductor device is selected from the group consisting of an electronic book, a television set, a digital photo frame, and a mobile phone.
6. A semiconductor device comprising a transistor, the transistor comprising:
a gate electrode over a substrate;
a first insulating film over the gate electrode;
a second insulating film over the first insulating film;
a first oxide semiconductor layer over the second insulating film, the first oxide semiconductor layer comprising a channel formation region of the transistor overlapping with the gate electrode;
a channel protective layer over the channel formation region;
a first layer over the first oxide semiconductor layer, the first layer containing indium or zinc and having a first carrier concentration;
a second layer over the first layer and the channel protective layer, the second layer containing titanium and having a second carrier concentration; and
a conductive layer over the second layer and the channel protective layer, the conductive layer electrically connected to the first oxide semiconductor layer,
wherein a first top edge of the second layer is projected from a first bottom edge of the conductive layer,
wherein a second top edge opposite to the first top edge of the second layer is projected from a second bottom edge opposite to the first bottom edge of the conductive layer, and
wherein the second carrier concentration is higher than the first carrier concentration.
7. The semiconductor device according to claim 6 ,
wherein the channel protective layer includes a halogen element, and
wherein the halogen element is one of fluorine and chlorine.
8. The semiconductor device according to claim 7 , wherein a concentration of the halogen element is greater than or equal to 1×10 15 cm −3 and less than or equal to 1×10 20 cm −3 .
9. The semiconductor device according to claim 6 ,
wherein the first insulating film is a silicon nitride film, and
wherein the second insulating film is a silicon oxide film.
10. The semiconductor device according to claim 6 , wherein the semiconductor device is selected from the group consisting of an electronic book, a television set, a digital photo frame, and a mobile phone.
11. A semiconductor device comprising a transistor, the transistor comprising:
a gate electrode over a substrate;
a first insulating film over the gate electrode;
a second insulating film over the first insulating film;
a first oxide semiconductor layer over the second insulating film, the first oxide semiconductor layer comprising a channel formation region of the transistor overlapping with the gate electrode;
a channel protective layer over the channel formation region;
a first layer containing titanium over the channel protective layer; and
a conductive layer over the first layer and the channel protective layer, the conductive layer electrically connected to the first oxide semiconductor layer,
wherein a first top edge of the first layer is projected from a first bottom edge of the conductive layer, and
wherein a second top edge opposite to the first top edge of the first layer is projected from a second bottom edge opposite to the first bottom edge of the conductive layer.
12. The semiconductor device according to claim 11 ,
wherein the channel protective layer includes a halogen element, and
wherein the halogen element is one of fluorine and chlorine.
13. The semiconductor device according to claim 12 , wherein a concentration of the halogen element is greater than or equal to 1×10 15 cm −3 and less than or equal to 1×10 20 cm −3 .
14. The semiconductor device according to claim 11 ,
wherein the first insulating film is a silicon nitride film, and
wherein the second insulating film is a silicon oxide film.
15. The semiconductor device according to claim 11 , wherein the semiconductor device is selected from the group consisting of an electronic book, a television set, a digital photo frame, and a mobile phone.