Diffusion break structures in semiconductor devices
The present disclosure generally relates to semiconductor devices and processing. The present disclosure also relates to isolation structures formed in active regions, more particularly, diffusion break structures in an active semiconductor layer of a semiconductor device. The present disclosure also relates to methods of forming such structures and replacement metal gate processes.
1. A semiconductor device comprising:
a semiconductor feature above a substrate;
a pair of gate spacers having upper and lower portions on the semiconductor feature;
an isolation trench in the semiconductor feature;
an isolation structure having a lower portion disposed in the isolation trench and having an upper portion disposed between the lower portions of the pair of gate spacers that extends above the semiconductor feature; and
a conductive gate structure disposed on the isolation structure and between the upper portions of the pair of gate spacers.
2. The semiconductor device of claim 1 , wherein the isolation structure includes a barrier layer lining the isolation trench and the lower portions of the pair of gate spacers, and a dielectric fill disposed over the barrier layer.
3. The semiconductor device of claim 2 , wherein the barrier layer includes a nitride-containing dielectric compound and the dielectric fill includes an oxide-containing dielectric compound.
4. The semiconductor device of claim 1 , wherein the isolation trench has substantially vertical sidewalls that are aligned with inner sidewalls of the pair of gate spacers.
5. The semiconductor device of claim 1 , wherein the isolation trench extends into the substrate.
6. The semiconductor device of claim 1 , further comprising source or drain regions in the semiconductor feature, wherein the isolation structure is between and spaced apart from the source or drain regions.
7. The semiconductor device of claim 6 , wherein the isolation structure has a top surface that is above top surfaces of the source or drain regions.
8. The semiconductor device of claim 1 , wherein the conductive gate structure is a first conductive gate structure and further comprising an adjacent second conductive gate structure disposed on the semiconductor feature.
9. The semiconductor device of claim 8 , wherein the first and second conductive gate structures include an electrically conductive material.
10. A semiconductor device comprising:
a first, second and third semiconductor features above a substrate;
a pair of gate spacers having upper and lower portions disposed on and extending laterally across the first, second and third semiconductor features;
an isolation trench in the second semiconductor feature;
an isolation structure having a lower portion disposed in the isolation trench and having an upper portion disposed between the lower portions of the pair of gate spacers that extends above the second semiconductor feature; and
a conductive gate structure disposed on the isolation structure and between the upper portions of the pair of gate spacers, wherein the conductive gate structure extends laterally over the first and third semiconductor features.
11. The semiconductor device of claim 10 , further comprising an insulating layer disposed on the substrate, wherein the first and third semiconductor features and the isolation structure are separated by the insulating layer.
12. The semiconductor device of claim 11 , wherein the isolation trench extends through the insulating layer and into the substrate.
13. The semiconductor device of claim 11 , wherein the conductive gate structure extends over the insulating layer.
14. The semiconductor device of claim 10 , wherein the isolation structure has a top surface that is at a level higher than top surfaces of the first and third semiconductor features.
15. The semiconductor device of claim 12 , wherein the isolation trench has substantially vertical sidewalls that are aligned with inner sidewalls of the pair of gate spacers.
16. The semiconductor device of claim 10 , further comprising source or drain regions in the semiconductor feature, wherein the isolation structure is between and spaced apart from the source or drain regions.
17. The semiconductor device of claim 16 , wherein the isolation structure has a top surface that is above top surfaces of the source or drain regions.
18. The semiconductor device of claim 15 , wherein the isolation structure includes a barrier layer lining the isolation trench and the lower portions of the pair of gate spacers, and a dielectric fill disposed over the barrier layer.
19. The semiconductor device of claim 18 , wherein the barrier layer includes a nitride-containing dielectric compound and the dielectric fill includes an oxide-containing dielectric compound.