Gate-all-around (GAA) and fin field-effect transistor (FinFet) hybrid static random-access memory (SRAM)
Certain aspects of the present disclosure generally relate to a static random-access memory (SRAM) implemented using both a gate-all-around (GAA)-type transistor and a fin field-effect transistor (FinFET). For example, certain aspects are directed to an SRAM memory cell having a flip-flop (FF) having a pull-up (PU) transistor and a pull-down (PD) transistor, and a pass-gate (PG) transistor coupled between a bit line of the SRAM memory cell and the FF, a gate of the PG transistor being coupled to a word line (WL) of the SRAM memory cell. In certain aspects, at least one of the PU transistor, the PD transistor, or the PG transistor comprises a GAA transistor, and at least another one of the PU transistor, the PD transistor, or the PG transistor comprises a FinFET.
1. A static random-access memory (SRAM) memory cell, comprising:
a flip-flop (FF) having a pull-up (PU) transistor and a pull-down (PD) transistor; and
a pass-gate (PG) transistor coupled between a bit line (BL) of the SRAM memory cell and the FF, a gate of the PG transistor being coupled to a word line (WL) of the SRAM memory cell, wherein:
the PD transistor comprises a gate-all-around (GAA) transistor;
the PG transistor comprises a first fin field-effect transistor (FinFET); and
the PU transistor comprises a second FinFET.
2. The SRAM memory cell of claim 1 , wherein a drive current strength of the PD transistor is greater than a drive current strength of the PG transistor.
3. The SRAM memory cell of claim 1 , wherein:
the PG transistor comprises an n-type metal-oxide-semiconductor (NMOS) transistor;
the PD transistor comprises another NMOS transistor; and
the PU transistor comprises a p-type metal-oxide-semiconductor (PMOS) transistor having a source coupled to the NMOS transistor and to a source of the other NMOS transistor.
4. The SRAM memory cell of claim 1 , wherein a a drive current strength of the PG transistor is less than a drive current strength of the PU transistor.
5. A static random-access memory (SRAM) memory cell comprising:
a flip-flop (FF) having a pull-up (PU) transistor and a pull-down (PD) transistor; and
a pass-gate (PG) transistor coupled between a bit line (BL) of the SRAM memory cell and the FF, a gate of the PG transistor being coupled to a word line (WL) of the SRAM memory cell, wherein:
the PG transistor comprises a fin field-effect transistor (FinFET);
the PD transistor comprises a first gate-all-around (GAA) transistor; and
the PU transistor comprises a second GAA transistor.
6. The SRAM memory cell of claim 5 , wherein a width of a channel slab of the PD transistor is greater than a width of a channel slab of the PU transistor.
7. The SRAM memory cell of claim 5 , wherein a drive current strength of the PD transistor is greater than a drive current strength of the PG transistor.
8. The SRAM memory cell of claim 1 , wherein the GAA transistor comprises a channel and a gate region surrounding the channel.
9. The SRAM memory cell of claim 1 , wherein each of the first FinFET and the second FinFET comprises a fin and a gate region adjacent to at least two sides of the fin.
10. A static random-access memory (SRAM), comprising:
a plurality of memory cells, each of the plurality of memory cells comprising:
a flip-flop (FF) having a pull-up (PU) transistor and a pull-down (PD) transistor; and
a pass-gate (PG) transistor coupled between a bit line (BL) of the SRAM and the FF, a gate of the PG transistor being coupled to one of a plurality of word lines (WLs) of the SRAM, wherein:
the PG transistor comprises a first gate-all-around (GAA) transistor;
the PU transistor comprises a second GAA transistor; and
the PD transistor comprises a fin field-effect transistor (FinFET).
11. The SRAM of claim 10 , wherein a drive current strength of the PG transistor is less than a drive current strength of the PD transistor.
12. The SRAM of claim 10 , wherein:
the PG transistor comprises an n-type metal-oxide-semiconductor (NMOS) transistor;
the PD transistor comprises another NMOS transistor; and
the PU transistor comprises a p-type metal-oxide-semiconductor (PMOS) transistor having a source coupled to the NMOS transistor and to a source of the other NMOS transistor.
13. The SRAM of claim 10 , wherein a drive current strength of the PU transistor is less than a drive current strength of the PD transistor.
14. The SRAM memory cell of claim 5 , wherein a drive current strength of the PU transistor is less than the drive current strength of the PG transistor.
15. The SRAM of claim 10 , wherein a width of a channel slab of the PG transistor is smaller than a width of a channel slab of the PD transistor.
16. The SRAM of claim 10 , wherein a width of a channel slab of the PU transistor is smaller than a width of a channel slab of the PD transistor.