Techniques for processing substrates using directional reactive ion etching
A method of treating a substrate includes directing ions to the substrate along at least one non-zero angle with respect to a perpendicular to a substrate surface in a presence of a reactive ambient containing a reactive species where the substrate includes a surface feature. At least one surface of the surface feature is etched using the ions in combination with the reactive ambient at a first etch rate that is greater than a second etch rate when the ions are directed to the substrate without the reactive ambient and greater than a third etch rate when the reactive ambient is provided to the substrate without the ions.
1. A method of treating a substrate, comprising:
providing a surface feature in the substrate, wherein the surface feature comprises a first material, disposed as a liner along a second material, the surface feature comprising a first sidewall and a second sidewall opposite the first sidewall and facing the first sidewall, the first sidewall and the second sidewall being separated by a first distance, wherein the first sidewall and the second sidewall define a reentrant profile; and
directing first ions to the first sidewall along at least one non-zero angle with respect to a perpendicular to a substrate plane in a presence of a reactive ambient containing a reactive species,
directing second ions to the second sidewall along at least one non-zero angle with respect to the perpendicular to a substrate plane in the presence of the reactive ambient containing a reactive species,
wherein the first sidewall and the second sidewall are etched by the ions in combination with the reactive ambient, wherein a first portion of the first material is etched, wherein at least a portion of the first material remains as the liner along the first sidewall, after the directing the ions, and
wherein a distance between an upper part of the first sidewall and an upper part of the second sidewall is increased, while a distance between a lower part of the first sidewall and a lower part of the second sidewall is not increased.
2. The method of claim 1 , wherein the surface feature defines a trench, including the first sidewall and the second sidewall.
3. The method of claim 2 , wherein after the directing the ions, a trench width increases in an upper portion of the trench adjacent an upper surface of the trench.
4. The method of claim 1 , wherein the first sidewall and the second sidewall extend along a first direction in a plane of the substrate, and wherein a projection of a trajectory of the ions within the substrate plane extends parallel to a second direction, orthogonal to the first direction, wherein the ions do not impact surfaces extending along the second direction.
5. The method of claim 4 , wherein the surface feature comprises a trench, wherein the trench comprises a first shape before the directing the ions, wherein the trench comprises a second shape after the directing the ions, and wherein the second shape is elongated along the second direction with respect to the first shape.
6. The method of claim 1 , wherein the ions comprise a bimodal distribution of trajectories, wherein the ions simultaneously impact the first sidewall and the second sidewall.
7. A method of modifying a trench, comprising:
providing the trench in a substrate, the trench including a first sidewall and a second sidewall, opposite the first sidewall, the first sidewall and the second sidewall comprising a first material, disposed as a liner along a second material, wherein the first sidewall and the second sidewall define a reentrant profile; and
directing first ions to the first sidewall along at least one non-zero angle with respect to a perpendicular to a substrate plane in a presence of a reactive ambient containing a reactive species,
directing second ions to the second sidewall along at least one non-zero angle with respect to the perpendicular to a substrate plane in the presence of the reactive ambient containing a reactive species,
wherein the first sidewall and the second sidewall are etched by the ions in combination with the reactive ambient, wherein a first portion of the first material is etched, and wherein at least a portion of the first material remains as the liner along the first sidewall, after the directing the ions, and
wherein a distance between an upper part of the first sidewall and a lower part of the second sidewall is increased, while a distance between a lower part of the first sidewall and a lower part of the second sidewall is not increased.
8. The method of claim 7 , wherein the trench is formed in a layer, the layer comprising a first material, the layer disposed on a base, comprising a third material, wherein the trench further comprises a trench bottom, the trench bottom comprising a surface of the third material, and wherein the trench bottom is not etched during the directing the ions.
9. The method of claim 7 , wherein, before the directing the ions, the trench comprises a narrowing profile along the perpendicular, and wherein, after the directing the ions the trench comprises a uniform profile along the perpendicular.
10. The method of claim 7 , wherein the ions comprise a bimodal distribution of trajectories, wherein the ions simultaneously impact the first sidewall and the second sidewall.
11. A method of treating a substrate, comprising:
providing a surface feature in the substrate, wherein the surface feature includes a first side and a second side, opposite the first side and facing the first side, the first side and the second side being separated by a first distance, the first side and the second side comprising a first material, disposed as a liner along a second material, wherein the first sidewall and the second sidewall define a reentrant profile; and
directing first ions to the first side along at least one non-zero angle with respect to a perpendicular to a substrate plane in a presence of a reactive ambient containing a reactive species,
directing second ions to the second side along at least one non-zero angle with respect to the perpendicular to a substrate plane in the presence of the reactive ambient containing a reactive species,
wherein the first side and the second side are etched by the ions in combination with the reactive ambient, wherein a first portion of the first material is etched, and wherein at least a portion of the first material remains as the liner along the first side, after the directing the ions, and
wherein a distance between an upper part of the first side and the second side is increased, while a distance between a lower part of the first side and a lower part of the second side is not increased.
12. The method of claim 11 , wherein the surface feature defines a trench.
13. The method of claim 11 , wherein the surface feature defines a via.