Semiconductor device
A semiconductor device has transistors formed on a substrate and including first and second impurity regions of a first conductivity type, a guard ring of a second conductivity type formed on the substrate and surrounding the transistors in a plan view, a wiring formed on and electrically connected to the guard ring, and a ground wiring formed on the wiring and electrically connected to the wiring and the second impurity region. In a plan view, the transistor includes a first part having a distance that is a first distance from the guard ring, and a second part having a distance that is a second distance shorter than the first distance from the guard ring. In a plan view, the first part is located at a position separated from the ground wiring, and the second part is located at a position overlapping the ground wiring.
1. A semiconductor device comprising:
a substrate which includes first fins and second fins;
a first transistor which includes a first impurity region of a first conductivity type and a second impurity region of the first conductivity type, the first impurity region and the second impurity region being formed in the first fins which extend in a first direction in a plan view;
a first guard ring which includes a third impurity region of a second conductivity type which is different from the first conductivity type, the third impurity region being formed in the second fins which extend in the first direction in a plan view, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the third impurity region; and
a ground wiring formed on the first wiring, the ground wiring being electrically connected to the first wiring and the second impurity region,
wherein
the first transistor includes a first part and a second part,
the first part and the second part are arranged in a second direction which is perpendicular to the first direction in a plan view,
the first part of the first transistor is separated by a first distance from the first guard ring in the first direction in a plan view,
the second part of the first transistor is separated by a second distance from the first guard ring in the first direction in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the ground wiring in a plan view, and the second part is overlapped with the ground wiring in a plan view.
2. The semiconductor device as claimed in claim 1 , further comprising:
a power supply wiring,
wherein the first impurity region is electrically connected to the power supply wiring.
3. The semiconductor device as claimed in claim 1 , further comprising:
a plurality of first vias connecting the third impurity region and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends.
4. The semiconductor device as claimed in claim 1 , wherein
the first transistor includes a third part,
the third part is separated by a third distance from the first guard ring in the first direction in a plan view,
the third distance is shorter than the first distance, and
the second part is positioned between the first part and the third part in a plan view.
5. The semiconductor device as claimed in claim 1 , wherein a distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view.
6. A semiconductor device comprising:
a substrate which includes first fins and second fins;
a first transistor which includes a first impurity region of a second conductivity type and a second impurity region of the second conductivity type, the first impurity region and the second impurity region being formed in the first fins which extend in a first direction in a plan view;
a first guard ring which includes a third impurity region of a first conductivity type which is different from the second conductivity type, the third impurity region being formed in the second fins which extend in the first direction in a plan view, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the third impurity region; and
a power supply wiring formed on the first wiring, the power supply wiring being electrically connected to the first wiring and the first impurity region,
wherein
the first transistor includes a first part and a second part,
the first part and the second part are arranged in a second direction which is perpendicular to the first direction in a plan view,
the first part of the first transistor is separated by a first distance from the first guard ring in the first direction in a plan view,
the second part of the first transistor is separated by a second distance from the first guard ring in the first direction in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the power supply wiring in a plan view, and
the second part is overlapped with the power supply wiring in a plan view.
7. The semiconductor device as claimed in claim 6 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the power supply wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the first guard ring extends.
8. The semiconductor device as claimed in claim 6 , wherein
the first transistor includes a third part,
the third part is separated by a third distance from the first guard ring in the first direction in a plan view, and
the second part is positioned between the first part and the third part.
9. The semiconductor device as claimed in claim 6 , wherein a distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view.
10. A semiconductor device comprising:
a substrate which includes first fins, second fins, third fins and fourth fins;
a first transistor which includes a first impurity region of a first conductivity type and a second impurity region of the first conductivity type, the first impurity region and the second impurity region being formed in the first fins which extend in a first direction in a plan view;
a first guard ring which includes a third impurity region of a second conductivity type which is different from the first conductivity type, the third impurity region being formed in the second fins which extend in the first direction in a plan view, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the third impurity region;
a ground wiring formed on the first wiring, the ground wiring being electrically connected to the first wiring and the second impurity region;
a second transistor which includes a fourth impurity region of the second conductivity type and a fifth impurity region of the second conductivity type, the fourth impurity region and the fifth impurity region being formed in the third fins which extend in the first direction in a plan view;
a second guard ring which includes a sixth impurity region of the first conductivity type, the sixth impurity region being formed in the fourth fins which extend in the first direction in a plan view, the second guard ring surrounding the second transistor in a plan view;
a second wiring formed on the second guard ring and electrically connected to the sixth impurity region; and
a power supply wiring formed on the second wiring, the power supply wiring being electrically connected to the second wiring and the fourth impurity region,
wherein the first transistor includes a first part and a second part,
the first part of the first transistor is separated by a first distance from the first guard ring in a plan view,
the second part of the first transistor is separated by a second distance from the first guard ring in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the ground wiring in a plan view,
the second part is overlapped with the ground wiring in a plan view,
the second transistor includes a third part and a fourth part,
the third part of the second transistor is separated by a third distance from the second guard ring in a plan view,
the fourth part of the second transistor is separated by a fourth distance from the second guard ring in a plan view,
the fourth distance is shorter than the third distance,
the third part is separated from the power supply wiring in a plan view, and
the fourth part is overlapped with the power supply wiring in a plan view.
11. The semiconductor device as claimed in claim 10 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends.
12. The semiconductor device as claimed in claim 10 , further comprising:
a plurality of second vias connecting the second guard ring and the second wiring,
wherein a density of the plurality of second vias which are overlapped with the power supply wiring in a plan view, along a direction in which the second guard ring extends, is higher than a density of the plurality of second vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the second guard ring extends.
13. The semiconductor device as claimed in claim 10 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring; and
a plurality of second vias connecting the second guard ring and the second wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends, and
wherein a density of the plurality of second vias which are overlapped with the power supply wiring in a plan view, along a direction in which the second guard ring extends, is higher than a density of the plurality of second vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the second guard ring extends.
14. The semiconductor device as claimed in claim 10 , further comprising:
an input and output terminal connected to the first impurity region and the fifth impurity region.
15. The semiconductor device as claimed in claim 10 ,
wherein the first transistor includes a fifth part,
the fifth part is separated by a third distance from the first guard ring in a plan view,
the third distance is shorter than the first distance, and
the second part is positioned between the first part and the fifth part in a plan view.
16. The semiconductor device as claimed in claim 10 , wherein
a distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view, and
a distance between the second transistor and the second guard ring increases in steps between the third part and the fourth part in a plan view.
17. The semiconductor device as claimed in claim 10 , wherein
the second transistor includes a sixth part,
the sixth part is separated by a sixth distance from the second guard ring in a plan view, and
the fourth part is positioned between the third part and the sixth part.