Head suspension assembly and disk apparatus
View Patent ↗A head suspension assembly includes a support plate, an interconnection member including a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied across the connection pads. At least one opening is formed in each of the connection pads. The piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled in the opening.
1. A head suspension assembly comprising:
a support plate;
an interconnection member comprising:
a metal plate on the support plate,
a first insulating layer on the metal plate,
a conductive layer on the first insulating layer and forming a pair of connection pads, and
a second insulating layer on the conductive layer;
a head mounted on the interconnection member; and
a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied across the connection pads, wherein
an opening penetrating at least the second insulating layer and the conductive layer is formed in each of the connection pads, the opening formed in one of the connection pads having a wavelike shape, and
the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive, which contacts at least the piezoelectric element, the connection pad, and a side surface of the second insulating layer.
2. The head suspension assembly according to claim 1 , wherein the opening formed in the other of the connection pads has a different shape from the opening formed in said one of the connection pads.
3. The head suspension assembly according to claim 2 , wherein the opening formed in the other of the connection pads has a rectangular shape.
4. The head suspension assembly according to claim 1 , wherein the conductive adhesive is filled in the opening formed in each of the connection pads.
5. The head suspension assembly according to claim 1 , wherein the opening formed in the other of the connection pads further penetrates the first insulating layer.
6. The head suspension assembly according to claim 5 , wherein the conductive adhesive connecting the other of the connection pads to the piezoelectric element further contacts a side surface of the first insulating layer and the metal plate.
7. The head suspension assembly according to claim 1 , wherein said one of the connection pads in which the opening having the wavelike shape is formed is closer to the head than the other of the connection pads.
8. A disk apparatus comprising:
a disk-like recording medium having a recording layer; and
a head suspension assembly comprising:
a support plate,
an interconnection member comprising:
a metal plate on the support plate,
a first insulating layer on the metal plate,
a conductive layer on the first insulating layer and forming a pair of connection pads, and
a second insulating layer on the conductive layer,
a head mounted on the interconnection member and configured to read data from and write data onto the recording layer, and
a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied across the connection pads, wherein
an opening penetrating at least the second insulating layer and the conductive layer is formed in each of the connection pads, the opening formed in one of the connection pads having a wavelike shape, and
the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive, which contacts at least the piezoelectric element, the connection pad, and a side surface of the second insulating layer.
9. The disk apparatus according to claim 8 , wherein the opening formed in the other of the connection pads has a different shape from the opening formed in said one of the connection pads.
10. The disk apparatus according to claim 9 , wherein the opening formed in the other of the connection pads has a rectangular shape.
11. The disk apparatus according to claim 8 , wherein the conductive adhesive is filled in the opening formed in each of the connection pads.
12. The disk apparatus according to claim 8 , wherein the opening formed in the other of the connection pads further penetrates the first insulating layer.
13. The disk apparatus according to claim 12 , wherein the conductive adhesive connecting the other of the connection pads to the piezoelectric element further contacts a side surface of the first insulating layer and the metal plate.
14. The disk apparatus according to claim 8 , wherein said one of the connection pads in which the opening having the wavelike shape is formed is closer to the head than the other of the connection pads.