IP Library › Granted Patent US 12,542,155
Granted Patent B2
US 12,542,155 · App. 18/583,021 · Granted Feb 3, 2026

Magnetic disk device having piezoelectric element

Inventor: Shunya Setoma (Yokohama Kanagawa, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
G11B5/4833G11B5/486G11B5/4873H10N30/50H10N30/872
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Quick Facts
Patent No.
US 12,542,155
App. No.
18/583,021
Granted
Feb 3, 2026
Kind
B2
Abstract

A disk device according to one embodiment includes a magnetic disk, a magnetic head, a piezoelectric element, a flexure, a first bond, and a second bond. The piezoelectric element includes a first piezoelectric body, a first electrode and a second electrode on a first surface of the first piezoelectric body, and a third electrode on a second surface of the piezoelectric body. The third electrode is connected to the second electrode. A first pad and a second pad are disposed on an outer surface of the flexure. A first through hole is open to a part of the first pad. The first electrode and the third electrode overlap with the part. The first bond joins the first pad and the first electrode together and is partly accommodated in the first through hole. The second bond joins the second pad and the second electrode together.

Claims (89)

1 . A disk device comprising:

a magnetic disk;

a magnetic head configured to read and write information from and to the magnetic disk;

a piezoelectric element including

a first piezoelectric body,

a first electrode disposed on a first surface of the first piezoelectric body,

a second electrode disposed on the first surface away from the first electrode in a first direction along the first surface, and

a third electrode disposed on a second surface of the first piezoelectric body and connected to the second electrode, the second surface being opposite to the first surface;

a flexure with a first through hole, on which the magnetic head is mounted, the flexure including

an outer surface facing the first electrode and the second electrode,

a first pad disposed on the outer surface, and

a second pad disposed on the outer surface away from the first pad in the first direction, the first through hole being open to a part of the first pad, the part with which the first electrode and the third electrode overlap in a second direction which the first surface faces;

a conductive, first bond that joins the first pad and the first electrode together and is partly accommodated in the first through hole; and

a conductive, second bond that joins the second pad and the second electrode together.

2 . The disk device according to claim 1 , wherein

the piezoelectric element has an end surface at an end in a third direction along the first surface and orthogonal to the first direction, and

the third electrode is exposed to an outside of the piezoelectric element at least at the end surface.

3 . The disk device according to claim 1 , wherein

the flexure is provided with a first hole, and

the first hole opens to the first pad away from the third electrode along the outer surface in a fourth direction opposite to the first direction.

4 . The disk device according to claim 3 , wherein

the first hole penetrates the flexure.

5 . The disk device according to claim 3 , wherein

the flexure includes

a metal plate,

a first insulating layer,

a second insulating layer interposed between the metal plate and the first insulating layer, and

a conductive layer interposed between the first insulating layer and the second insulating layer,

the conductive layer includes the first pad,

the first hole penetrates the first pad, and

the second insulating layer closes the first hole.

6 . The disk device according to claim 3 , wherein

the first through hole has a cross-sectional area larger than the first hole.

7 . The disk device according to claim 1 , wherein

the piezoelectric element includes a second piezoelectric body and a fourth electrode,

the second piezoelectric body has a third surface attached to the second surface,

the fourth electrode is disposed on a fourth surface of the second piezoelectric body and connected to the first electrode, the fourth surface being opposite to the third surface,

the flexure is provided with a second through hole open to a part of the second pad, the part with which the second electrode and the fourth electrode overlap in the second direction, and

the second bond is partly accommodated in the second through hole.

8 . The disk device according to claim 7 , wherein

the flexure is provided with a second hole, and

the second hole opens to the second pad away from the fourth electrode along the outer surface in the first direction.

9 . The disk device according to claim 7 , wherein

the second through hole has a cross-sectional area smaller than the first through hole.

10 . The disk device according to claim 1 , wherein

the flexure includes a base, and a protrusion protruding from the base in the first direction, and

the protrusion has a width smaller than the piezoelectric element in a fifth direction along the first surface and orthogonal to the first direction.

11 . The disk device according to claim 10 , wherein

the protrusion includes

a metal plate,

a first insulating layer,

a second insulating layer interposed between the metal plate and the first insulating layer, and

a conductive layer interposed between the first insulating layer and the second insulating layer,

the conductive layer includes the first pad, and

the metal plate has a width smaller than the second insulating layer in the fifth direction.

12 . The disk device according to claim 1 , wherein

the flexure includes

a metal plate,

a first insulating layer,

a second insulating layer interposed between the metal plate and the first insulating layer, and

a conductive layer interposed between the first insulating layer and the second insulating layer,

the conductive layer includes the first pad,

the first through hole penetrates the second insulating layer and the first pad,

the metal plate is provided with a third through hole communicating with the first through hole, and

the third through hole has an edge surrounding the first through hole with spacing from an edge of the first through hole.

13 . The disk device according to claim 1 , wherein

the flexure includes

a metal plate,

a first insulating layer,

a second insulating layer interposed between the metal plate and the first insulating layer, and

a conductive layer interposed between the first insulating layer and the second insulating layer, and

the first bond is partly attached to a part of the flexure, the part including the metal plate in a sixth direction which the outer surface faces.

14 . The disk device according to claim 1 , wherein

the first pad is set to a ground potential, and

the piezoelectric element is configured to expand or contract in the first direction by an applied voltage to the second electrode.

15 . A disk device comprising:

a magnetic disk;

a magnetic head configured to read and write information from and to the magnetic disk;

a piezoelectric element including

a piezoelectric body,

a first electrode disposed on a first surface of the first piezoelectric body,

a second electrode disposed on the first surface away from the first electrode in a first direction along the first surface, and

a third electrode disposed on a second surface of the piezoelectric body and connected to the second electrode, the second surface being opposite to the first surface;

a flexure with a through hole, on which the magnetic head is mounted, the flexure including

an outer surface facing the first electrode and the second electrode,

a first pad disposed on the outer surface, and

a second pad disposed on the outer surface away from the first pad in the first direction, the through hole being open to the first pad between an end and a center of the first pad in the first direction;

a conductive, first bond that joins the first pad and the first electrode together and is partly accommodated in the through hole; and

a conductive, second bond that joins the second pad and the second electrode together.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2024
From: SETOMA, SHUNYA
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 066774/0733 →
Priority Claims (1)
JP 2023-121461 · Jul 26, 2023 · national
Continuity (1)
Related Publication 20250037738A1 · Jan 30, 2025
References Cited (17)
US 5745319A · Takekado · 1998 [cited by examiner]
US 8760813B2 · Arai · 2014 [cited by applicant]
US 10957351B2 · Nesori · 2021 [cited by examiner]
US 10984825B2 · Suzuki · 2021 [cited by applicant]
US 11121647B2 · Ee et al. · 2021 [cited by applicant]
US 11348609B2 · Nesori · 2022 [cited by examiner]
US 11694715B2 · Suzuki · 2023 [cited by examiner]
US 12211528B2 · Setoma · 2025 [cited by examiner]
US 20200265866A1 · Suzuki · 2020 [cited by examiner]
US 20200286511A1 · Nesori · 2020 [cited by examiner]
US 20200327904A1 · Glaess · 2020 [cited by examiner]
US 20200381013A1 · Suzuki · 2020 [cited by examiner]
US 20210210117A1 · Suzuki · 2021 [cited by examiner]
US 20220076698A1 · Nesori · 2022 [cited by examiner]
US 20230029666A1 · Suzuki · 2023 [cited by examiner]
US 20230298622A1 · Setoma · 2023 [cited by examiner]
US 20240096379A1 · Suzuki · 2024 [cited by examiner]