Head suspension assembly and disk device
View Patent ↗According to one embodiment, a head suspension assembly includes a support plate, a wiring member on the support plate, a head, and a piezoelectric element on the wiring member. The wiring member includes a metal plate and a multilayered member including a first insulating layer, a conducting layer, a second insulating layer, and connection pads formed from the conducting layer. Each of the connection pads is overlaid on a recess formed in the first insulating layer, so as to form a recessed portion along the recess, and the second insulating layer includes an opening opposing each of the connection pads. The piezoelectric element is connected to the connection pads by a conductive adhesive filled in the openings and the recessed portions of the connection pads.
1. A head suspension assembly comprising:
a support plate;
a wiring member disposed on the support plate;
a head mounted on the wiring member; and
an expandable/contractable piezoelectric element mounted on the wiring member,
the wiring member comprising:
a metal plate fixed to the support plate; and
a multilayered member comprising a first insulating layer, a conducting layer stacked on the first insulating layer, a second insulating layer stacked on the first insulating layer and the conducting layer, the conducting layer including at least two of connection pads and a plurality of wiring lines connected to the connection pads,
each of the connection pads being overlaid on a recess formed in the first insulating layer, so as to form a recessed portion along the recess, and the second insulating layer comprising an opening opposing each of the connection pads, and
the piezoelectric element being connected to the connection pads by a conductive adhesive filled in the openings and the recessed portions of the connection pads.
2. The head suspension assembly of claim 1 , wherein
the first insulating layer comprises a second recess disposed by a side of the recess with an interval therebetween,
the conducting layer and the second insulating layer are stacked to be overlaid on the second recess, and
a part of the conductive adhesive is filled in a recess formed along the second recess in the second insulating layer.
3. The head suspension assembly of claim 2 , wherein
the wiring member comprises a second cover layer provided to be overlaid on the second insulating layer in a vicinity of the second recess, so as to dam up and stop the conductive adhesive.
4. The head suspension assembly of claim 1 , wherein
the first insulating layer comprises a second recess disposed by a side of the recess with an interval therebetween,
the conducting layer is stacked on the first insulating layer in a position off from the second recess,
the second insulating layer is stacked on the first insulating layer and the conducting layer so as to be overlaid on the second recess, and
a part of the conductive adhesive is filled in a recess formed along the second recess in the second insulating layer.
5. The head suspension assembly of claim 1 , wherein
the wiring member comprises a second cover layer provided to be overlaid on the second insulating layer in a vicinity of the opening, so as to dam up and stop the conductive adhesive.
6. The head suspension assembly of claim 1 , wherein
at least one of the plurality of wiring lines, which are connected to the connection pads comprises an extending portion integrated as one body, extending from the wiring lines and opposing one side edge of the connection pad with a gap therebetween,
the second insulating layer is stacked on the first insulating layer so as to be overlaid on the wiring lines and the extending portion, and
a part of the conductive adhesive is filled in a recess formed in the second insulating layer along a recess between the extending portion and the connection pad.
7. A disk device comprising:
a disk-shaped recording medium comprising a magnetic recording layer; and
a head suspension assembly of claim 1 , which supports a magnetic head.
8. The disk device of claim 7 , wherein
the first insulating layer comprises a second recess disposed by a side of the recess with an interval therebetween,
the conducting layer and the second insulating layer are stacked to be overlaid on the second recess, and
a part of the conductive adhesive is filled in a recessed portion formed along the second recess in the second insulating layer.
9. The disk device of claim 8 , wherein
the wiring member comprises a second cover layer provided to be overlaid on the second insulating layer in a vicinity of the second recess, so as to dam up and stop the conductive adhesive.
10. The disk device of claim 7 , wherein
the first insulating layer comprises a second recess disposed by a side of the recess with an interval therebetween,
the conducting layer is stacked on the first insulating layer in a position off from the second recess,
the second insulating layer is stacked on the first insulating layer and the conducting layer so as to be overlaid on the second recess, and
a part of the conductive adhesive is filled in a recess formed along the second recess in the second insulating layer.
11. The disk device of claim 7 , wherein
the wiring member comprises a second cover layer provided to be overlaid on the second insulating layer in a vicinity of the opening, so as to dam up and stop the conductive adhesive.