Structure and formation method of semiconductor device with resistive elements
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first resistive element and a second resistive element over the semiconductor substrate. The semiconductor device structure also includes a first conductive feature electrically connected to the first resistive element and a second conductive feature electrically connected to the second resistive element. The semiconductor device structure further includes a dielectric layer surrounding the first conductive feature and the second conductive feature.
1. A semiconductor device structure, comprising:
a semiconductor substrate;
a first resistive element and a second resistive element over the semiconductor substrate;
a first conductive feature and a second conductive feature electrically connected to the first resistive element, wherein the second resistive element is between the first conductive feature and the second conductive feature, and the second resistive element is electrically isolated from the first conductive feature and the second conductive feature, wherein a first portion of the first conductive feature is entirely above a topmost surface of the first resistive element, and the first portion of the first conductive feature is below a bottom surface of the second resistive element;
a third conductive feature electrically connected to the second resistive element; and
a dielectric layer surrounding the first conductive feature and the second conductive feature.
2. The semiconductor device structure as claimed in claim 1 , wherein the first resistive element is between the second resistive element and the semiconductor substrate.
3. The semiconductor device structure as claimed in claim 2 , wherein the first resistive element is larger than the second resistive element.
4. The semiconductor device structure as claimed in claim 2 , further comprising a capacitor dielectric layer between the first resistive element and the second resistive element, wherein the capacitor dielectric layer has a greater dielectric constant than that of the dielectric layer.
5. The semiconductor device structure as claimed in claim 4 , wherein the first conductive feature has a first portion extending into the first resistive element, the third conductive feature has a second portion extending into the second resistive element, and the second portion is longer than the first portion.
6. The semiconductor device structure as claimed in claim 1 , further comprising a barrier layer between the dielectric layer and the first conductive feature, wherein the first resistive element has a greater atomic concentration of nitrogen than that of the barrier layer.
7. The semiconductor device structure as claimed in claim 1 , wherein the first conductive feature extends upwardly above a top surface of the second resistive element.
8. The semiconductor device structure as claimed in claim 1 , wherein the second resistive element is thinner than the first resistive element.
9. The semiconductor device structure as claimed in claim 1 , wherein the second resistive element has a greater resistance than that of the first resistive element.
10. The semiconductor device structure as claimed in claim 1 , further comprising a capacitor dielectric layer between the first resistive element and the second resistive element, wherein the capacitor dielectric layer is in direct contact with the dielectric layer.
11. The semiconductor device structure as claimed in claim 1 , wherein the topmost surface of the first resistive element is lower than a bottommost surface of the second resistive element.
12. The semiconductor device structure as claimed in claim 1 , further comprising a capacitor dielectric layer between the first resistive element and the second resistive element, wherein the second resistive element is entirely above a top surface of the capacitor dielectric layer.
13. The semiconductor device structure as claimed in claim 12 , wherein a bottom surface of the capacitor dielectric layer is level with a bottommost surface of the first resistive element.
14. A semiconductor device structure, comprising:
a semiconductor substrate;
a first resistive element over the semiconductor substrate;
a second resistive element over the first resistive element, wherein the first resistive element is larger than the second resistive element;
a dielectric layer between the first resistive element and the second resistive element;
a conductive feature, wherein a bottom portion of the conductive feature is entirely above a topmost surface of the first resistive element, the bottom portion of the conductive feature is below the second resistive element, and a top portion of the conductive feature is above the first resistive element and the second resistive element; and
a barrier layer between the conductive feature and the dielectric layer, wherein the barrier layer surrounds the conductive feature and contacts sidewalls of the conductive feature.
15. The semiconductor device structure as claimed in claim 14 , wherein the first resistive element has a greater atomic concentration of nitrogen than that of the barrier layer.
16. The semiconductor device structure as claimed in claim 15 , wherein the barrier layer is in direct contact with the first resistive element.
17. The semiconductor device structure as claimed in claim 14 , further comprising a second dielectric layer covering the first resistive element and the second resistive element, wherein the dielectric layer has a greater dielectric constant than that of the second dielectric layer.
18. The semiconductor device structure as claimed in claim 17 , wherein the bottom portion of the conductive feature is in the dielectric layer, and the top portion of the conductive feature is in the second dielectric layer.
19. A semiconductor device structure, comprising:
a semiconductor substrate;
a first resistive element and a second resistive element over the semiconductor substrate, wherein a top surface of the second resistive element is higher than a top surface of the first resistive element;
a dielectric layer between the first resistive element and the second resistive element;
a conductive feature, wherein a bottom portion of the conductive feature is entirely above a topmost surface of the first resistive element, the bottom portion of the conductive feature is below the second resistive element and between the first resistive element and the second resistive element, and a top portion of the conductive feature is above the top surface of the second resistive element; and
a barrier layer between the conductive feature and the dielectric layer, wherein the first resistive element is denser than the barrier layer.
20. The semiconductor device structure as claimed in claim 19 , wherein the first resistive element and the second resistive element are electrically isolated from each other.