Method for forming semiconductor device structure
A method includes forming a first semiconductor layer over a substrate. A second semiconductor layer is formed over the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are etched to form a fin structure that extends from the substrate. The fin structure has a remaining portion of first semiconductor layer and a remaining portion of the second semiconductor layer atop the remaining portion of the first semiconductor layer. A capping layer is formed to wrap around three sides of the fin structure. At least a portion of the capping layer and at least a portion of the remaining portion of the second semiconductor layer in the fin structure are oxidized to form an oxide layer wrapping around three sides of the fin structure.
1. A method comprising:
forming a first semiconductor layer over a substrate;
forming a second semiconductor layer over the first semiconductor layer;
etching the first semiconductor layer and the second semiconductor layer to form a fin structure that extends from the substrate, the fin structure having a remaining portion of first semiconductor layer and a remaining portion of the second semiconductor layer atop the remaining portion of the first semiconductor layer;
forming a capping layer to wrap around three sides of the fin structure such that the capping layer is in contact with the remaining portion of the first semiconductor layer; and
oxidizing at least a portion of the capping layer and at least a portion of the remaining portion of the second semiconductor layer in the fin structure to form an oxide layer wrapping around three sides of the fin structure.
2. The method of claim 1 , further comprising planarizing the first semiconductor layer prior to forming the second semiconductor layer.
3. The method of claim 1 , further comprising forming a spacer layer on a side of the first semiconductor layer prior to forming the second semiconductor layer.
4. The method of claim 1 , wherein the first semiconductor layer is formed from silicon germanium.
5. The method of claim 1 , wherein the second semiconductor layer is formed from silicon.
6. The method of claim 1 , wherein the oxide layer is silicon-containing and/or silicon-germanium-containing.
7. The method of claim 1 , wherein the oxide layer is formed having a thickness of 10 angstroms to 50 angstroms.
8. The method of claim 1 , wherein after the oxidization, a thickness of the remaining portion of the second semiconductor layer and a thickness of a sidewall portion of the capping layer are at least 3 angstroms.
9. The method of claim 1 , further comprising:
forming a liner layer conformal to side surfaces of the fin structure; and
forming an isolation feature over the substrate and the liner layer.
10. A method comprising:
epitaxially growing a silicon germanium layer over a substrate;
performing a chemical mechanical polish (CMP) process to planarize the silicon germanium layer;
epitaxially growing an epitaxial layer over the planarized silicon germanium layer;
patterning the epitaxial layer and the planarized silicon germanium layer to form a fin structure;
forming an isolation feature over the substrate and in contact with the patterned epitaxial layer of the fin structure;
recessing the isolation feature; and
performing an oxygen plasma process on the fin structure to form an oxide layer having a non-uniform thickness over three sides of a remaining portion of the fin structure.
11. The method of claim 10 , wherein the oxide layer is silicon-containing and/or silicon-germanium-containing.
12. The method of claim 10 , wherein performing the oxygen plasma process is such that the oxide layer is thicker over a top side of the three sides of the remaining portion of the fin structure than over a lateral side of the three sides of the remaining portion of the fin structure.
13. The method of claim 10 , further comprising forming a gate dielectric layer over the oxide layer.
14. A method comprising:
forming a fin structure over a substrate, wherein the fin structure comprises a bottom portion, a middle portion over the bottom portion and a top portion over the middle portion, wherein the top portion and the middle portion are made of different materials;
forming a liner layer laterally surrounding the bottom portion and the middle portion of the fin structure, and spaced apart from the top portion of the fin structure;
forming an isolation feature over the liner layer such that the isolation feature is spaced apart from the bottom portion of the fin structure and in contact with the top portion of the fin structure;
recessing the liner layer and the isolation feature to expose sidewalls of the middle portion and the top portion of the fin structure;
after recessing the liner layer and the isolation feature, forming a capping layer over the sidewalls of the middle portion and the top portion of the fin structure; and
oxidizing the top portion of the fin structure and the capping layer to form an oxide layer over the fin structure.
15. The method of claim 14 , wherein the top portion of the fin structure has a material substantially the same as the capping layer.
16. The method of claim 14 , wherein the top portion of the fin structure is formed from silicon.
17. The method of claim 14 , wherein the middle portion of the fin structure is formed from silicon germanium.
18. The method of claim 14 , wherein the capping layer is formed by using an ALD process or a plasma enhanced ALD (PEALD) process.
19. The method of claim 14 , wherein forming the capping layer is such that the capping layer is thinner than the top portion of the fin structure.
20. The method of claim 14 , further comprising forming a gate dielectric layer over the oxide layer.