Semiconductor device, semiconductor wafer, and electronic device
A semiconductor device is provided in which the power consumption can be reduced by reducing the driving voltage and the on-state current can be increased in a period in which a transistor having an extremely low off-state current is brought into an electrically floating state. The semiconductor device comprises a memory cell, a first circuit, and a second circuit. The memory cell includes a first transistor. The first transistor includes a first semiconductor layer, a first gate electrode, and a first back gate electrode. The first gate electrode is connected to a word line. The first back gate electrode is connected to a back gate line. The first circuit supplies a signal for controlling the conduction state of the first transistor to the word line. The second circuit supplies a voltage for controlling the threshold voltage of the first transistor to the back gate line. The second circuit has a function of bringing the back gate line into an electrically floating state in a period in which a signal for controlling the conduction state of the first transistor is supplied to the word line.
1. A semiconductor device comprising:
a memory cell including a transistor;
a first circuit; and
a second circuit,
wherein the transistor includes a gate electrode and a back gate electrode,
wherein the first circuit is configured to supply a signal for controlling a conduction state of the transistor to the gate electrode, and
wherein the second circuit is configured to supply a voltage to the back gate electrode for controlling a threshold voltage of the transistor and configured to change the supply of the voltage to the back gate electrode to place the back gate electrode into an electrical floating state in a period in which the signal for controlling the conduction state of the transistor is supplied to the gate electrode.
2. The semiconductor device according to claim 1 ,
wherein a first wiring connected to the gate electrode and a second wiring connected to the back gate electrode have a first capacitance,
wherein the second wiring and wirings other than the first wiring connected to the memory cell and electrodes included in the memory cell have a second capacitance, and
wherein the first capacitance is 1.2 times or more as large as than the second capacitance.
3. The semiconductor device according to claim 1 ,
wherein a first wiring connected to the gate electrode is provided over a second wiring connected to the back gate electrode, and
wherein the first wiring and the second wiring have a region overlapping with each other with an insulating layer located therebetween.
4. An electronic device comprising:
the semiconductor device according to claim 1 ; and
at least one of an antenna, a battery, an operation switch, a microphone, and a speaker.
5. A semiconductor wafer comprising:
a plurality of the semiconductor devices according to claim 1 ; and
a separation region.
6. The semiconductor device according to claim 1 , wherein the voltage of the back gate electrode increases only in a period in which the gate electrode is set to a high-level voltage.
7. A semiconductor device comprising:
a memory cell including a first transistor;
a first circuit; and
a second circuit including a second transistor,
wherein the first transistor includes a first gate electrode and a back gate electrode,
wherein the first circuit is configured to supply a signal for controlling a conduction state of the first transistor to the first gate electrode,
wherein the second circuit is configured to supply a voltage for controlling a threshold voltage of the first transistor to the back gate electrode and to place the back gate electrode into an electrical floating state in a period in which the signal for controlling the conduction state of the first transistor is supplied to the first gate electrode, and
wherein the second transistor includes a second gate electrode connected to one of a source and a drain of the second transistor.
8. The semiconductor device according to claim 7 , wherein the second transistor contains an oxide semiconductor.
9. The semiconductor device according to claim 7 ,
wherein the first transistor and the second transistor are n-channel transistors, and
wherein a threshold voltage of the second transistor is higher than the threshold voltage of the first transistor at a time when potentials of the first gate electrode and the back gate electrode are the same.
10. The semiconductor device according to claim 7 ,
wherein a first wiring connected to the first gate electrode and a second wiring connected to the back gate electrode have a first capacitance,
wherein the second wiring and wirings other than the first wiring connected to the memory cell and electrodes included in the memory cell have a second capacitance, and
wherein the first capacitance is 1.2 times or more as large as than the second capacitance.
11. The semiconductor device according to claim 7 ,
wherein a first wiring connected to the first gate electrode is provided over a second wiring connected to the back gate electrode, and
wherein the first wiring and the second wiring have a region overlapping with each other with an insulating layer located therebetween.
12. An electronic device comprising:
the semiconductor device according to claim 7 ; and
at least one of an antenna, a battery, an operation switch, a microphone, and a speaker.
13. A semiconductor wafer comprising:
a plurality of the semiconductor devices according to claim 7 ; and
a separation region.
14. The semiconductor device according to claim 7 , wherein the voltage of the back gate electrode increases only in a period in which the first gate electrode is set to a high-level voltage.
15. A semiconductor device comprising:
a memory cell including a first transistor;
a first circuit; and
a second circuit including a second transistor,
wherein the first transistor includes a first gate electrode and a first back gate electrode,
wherein the first circuit is configured to supply a signal for controlling a conduction state of the first transistor to the first gate electrode,
wherein the second circuit is configured to supply a voltage for controlling a threshold voltage of the first transistor to the first back gate electrode and to place the first back gate electrode into an electrical floating state in a period in which the signal for controlling the conduction state of the first transistor is supplied to the first gate electrode,
wherein the second transistor includes a second gate electrode and a second back gate electrode, and
wherein a wiring connected to the second gate electrode is different from a wiring connected to the second back gate electrode.
16. The semiconductor device according to claim 15 , wherein the second transistor contains an oxide semiconductor.
17. The semiconductor device according to claim 15 ,
wherein the first transistor and the second transistor are n-channel transistors, and
wherein a threshold voltage of the second transistor is higher than the threshold voltage of the first transistor at a time when potentials of the first gate electrode and the first back gate electrode are the same.
18. The semiconductor device according to claim 15 ,
wherein a first wiring connected to the first gate electrode and a second wiring connected to the first back gate electrode have a first capacitance,
wherein the second wiring and wirings other than the first wiring connected to the memory cell and electrodes included in the memory cell have a second capacitance, and
wherein the first capacitance is 1.2 times or more as large as than the second capacitance.
19. The semiconductor device according to claim 15 ,
wherein a first wiring connected to the first gate electrode is provided over a second wiring connected to the first back gate electrode, and
wherein the first wiring and the second wiring have a region overlapping with each other with an insulating layer located therebetween.
20. An electronic device comprising:
the semiconductor device according to claim 15 ; and
at least one of an antenna, a battery, an operation switch, a microphone, and a speaker.
21. A semiconductor wafer comprising:
a plurality of the semiconductor devices according to claim 15 ; and
a separation region.
22. The semiconductor device according to claim 15 , wherein the voltage of the first back gate electrode increases only in a period in which the first gate electrode is set to a high-level voltage.
23. A semiconductor device comprising:
a plurality of memory cells each including a transistor, the plurality of memory cells arranged in m rows and n columns;
a first circuit; and
p second circuits, where p equals m/2 and each second circuit corresponds to two of the m rows of the plurality of memory cells,
wherein the transistor includes a gate electrode and a back gate electrode,
wherein the first circuit is configured to supply a signal for controlling a conduction state of the transistor to the gate electrode, and
wherein each of the p second circuits is configured to supply a voltage for controlling a threshold voltage of the transistor to the back gate electrode and to place the back gate electrode into an electrical floating state in a period in which the signal for controlling the conduction state of the transistor is supplied to the gate electrode.
24. The semiconductor device according to claim 23 ,
wherein a first wiring connected to the gate electrode and a second wiring connected to the back gate electrode have a first capacitance,
wherein the second wiring and wirings other than the first wiring connected to one of the plurality of memory cells and electrodes included in the one of the plurality of memory cells have a second capacitance, and
wherein the first capacitance is 1.2 times or more as large as than the second capacitance.
25. The semiconductor device according to claim 23 ,
wherein a first wiring connected to the gate electrode is provided over a second wiring connected to the back gate electrode, and
wherein the first wiring and the second wiring have a region overlapping with each other with an insulating layer located therebetween.
26. An electronic device comprising:
the semiconductor device according to claim 23 ; and
at least one of an antenna, a battery, an operation switch, a microphone, and a speaker.
27. A semiconductor wafer comprising:
a plurality of the semiconductor devices according to claim 23 ; and
a separation region.
28. The semiconductor device according to claim 23 , wherein the voltage of the back gate electrode increases only in a period in which the gate electrode is set to a high-level voltage.