IP Library › Granted Patent US 11,007,620
Granted Patent B2
US 11,007,620 · App. 15/940,749 · Granted May 18, 2021

Method and apparatus for cleaning process monitoring

Inventors: Charlie Wang (Hsinchu, TW); Yu-Ping Tseng (Taipei, TW); Y. J. Chen (Taoyuan, TW); Wai-Ming Yeung (Hsinchu, TW); Chien-Shen Chen (Hsinchu, TW); Danny Kuo (Taipei, TW); Yu-Hsuan Hsieh (New Taipei, TW); Hsuan Lo (New Taipei, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
B24B53/017B08B1/002B08B3/00B08B3/14B24B37/013C02F1/00H01L21/02052H01L21/02074H01L21/67028H01L21/67253
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Quick Facts
Patent No.
US 11,007,620
App. No.
15/940,749
Granted
May 18, 2021
Kind
B2
Abstract

A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.

Claims (45)

1. A method for cleaning process monitoring, comprising:

performing a chemical-mechanical planarization (CMP) process on a surface of a first substrate, wherein the CMP process utilizes a chemical slurry and mechanical polishing to remove materials from the surface of the first substrate;

pre-cleaning the surface using deionized water;

after the pre-cleaning, cleaning the surface of the first substrate in a cleaning container with a cleaning solution, wherein the cleaning solution is received in an inlet and drained through an outlet;

detecting a plurality of particle parameters in the cleaning solution in the outlet;

comparing the plurality of particle parameters to a pre-defined end point value; and

reconfiguring the cleaning process based on a result from the comparing.

2. The method of claim 1 , wherein the comparing is performed by a controller.

3. The method of claim 2 , wherein the controller is further configured to:

receive the plurality of particle parameters from the particle detector;

configure a flow rate of the waste solution out of the outlet and a flow rate of the cleaning solution into the inlet; and

transmit the plurality of particle parameters to a host computer for display.

4. The method of claim 1 , wherein the detecting is performed by at least one particle detector.

5. The method of claim 4 , wherein the at least one particle detector comprises at least one of the following detectors: optical detector, aerosol detector, liquid detector, solid detector, and laser detector.

6. The method of claim 1 , wherein the plurality of particle parameters comprise particle size and particle concentration as a function of cleaning time.

7. The method of claim 1 , wherein the pre-defined end point value equals to 10000 particles per milliliter in the waste solution.

8. The method of claim 4 , wherein the pre-defined end point value is configured based on size of particles.

9. The method of claim 1 , wherein the reconfiguring comprises one of the following:

terminating the cleaning process when the plurality of particle parameters are determined equal to or less than the pre-defined end point value, and continuing the cleaning process when the plurality of particle parameters are determined greater than the pre-defined end point value.

10. A method for cleaning process monitoring, comprising:

performing a chemical-mechanical planarization (CMP) process on a surface of a first substrate, wherein the CMP process utilizes a chemical slurry and mechanical polishing to remove materials from the surface of the first substrate;

pre-cleaning the surface using deionized water;

after the pre-cleaning, megasonically cleaning the surface of the first substrate in a liquid medium within a cleaning container, wherein the liquid medium is received in an inlet and drained through an outlet;

detecting a plurality of particle parameters in the liquid medium in the outlet;

comparing the plurality of particle parameters to a pre-defined end point value; and

reconfiguring the cleaning process based on a result from the comparing.

11. The method of claim 10 , wherein the comparing is performed by a controller.

12. The method of claim 10 , wherein the detecting is performed by at least one particle detector.

13. The method of claim 12 , wherein the at least one particle detector comprises at least one of the following detectors: optical detector, aerosol detector, liquid detector, solid detector, and laser detector.

14. The method of claim 10 , wherein the plurality of particle parameters comprise particle size and particle concentration as a function of cleaning time.

15. The method of claim 10 , wherein the pre-defined end point value equals to 10000 particles per milliliter in the waste solution.

16. The method of claim 10 , wherein the pre-defined end point value is configured based on size of particles.

17. The method of claim 1 , wherein the reconfiguring comprises one of the following:

terminating the cleaning process when the plurality of particle parameters are determined equal to or less than the pre-defined end point value, and continuing the cleaning process when the plurality of particle parameters are determined greater than the pre-defined end point value.

18. A method for a cleaning process monitoring, comprising:

performing a chemical-mechanical planarization (CMP) process on a surface of a first substrate, wherein the CMP process utilizes a chemical slurry and mechanical polishing to remove materials from the surface of the first substrate;

pre-cleaning the surface using deionized water;

after the pre-cleaning, brush scrubbing the surface of the first substrate in a cleaning container with a cleaning solution, wherein the cleaning solution is received in an inlet and drained through an outlet;

detecting a plurality of particle parameters in the cleaning solution in the outlet;

comparing the plurality of particle parameters to a pre-defined end point value; and

terminating the cleaning process when the plurality of particle parameters are determined equal to or less than the pre-defined end point value, and continuing the cleaning process when the plurality of particle parameters are determined greater than the pre-defined end point value.

19. The method of claim 18 wherein the detecting is performed by at least one particle detector.

20. The method of claim 19 , wherein the at least one particle detector comprises at least one of the following detectors: optical detector, aerosol detector, liquid detector, solid detector, and laser detector.

21. The method of claim 18 , wherein the plurality of particle parameters comprise particle size and particle concentration as a function of cleaning time.

22. The method of claim 18 , wherein the pre-defined end point value equals to 10000 particles per milliliter in the waste solution, the 10000 particles meeting a pre-defined size criteria.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2018
From: WANG, CHARLIE; TSENG, YU-PING; CHEN, Y.J.; YEUNG, WAI-MING; CHEN, CHIEN-SHEN; KUO, DANNY; HSIEH, YU-HSUAN; LO, HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 046716/0359 →
Continuity (2)
Provisional Application 62585746 · Nov 14, 2017
Related Publication 20190143481A1 · May 16, 2019