IP Library › Granted Patent US 11,018,181
Granted Patent B2
US 11,018,181 · App. 16/561,565 · Granted May 25, 2021

Solid-state imaging device

Inventor: Shunsuke Hasegawa (Kawasaki Kanagawa, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
H01L27/14868H01L27/14818
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Quick Facts
Patent No.
US 11,018,181
App. No.
16/561,565
Granted
May 25, 2021
Kind
B2
Abstract

A solid-state imaging device includes a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type on the first semiconductor layer; and first and second detectors positioned inside the second semiconductor layer. The first and second detectors are arranged in a first direction along a boundary between the first semiconductor layer and the second semiconductor layer. The device further includes first and second semiconductor regions provided between the first semiconductor layer and the first and second detectors, respectively. The first and second semiconductor regions include second conductivity type impurities with a higher concentration than that in the second semiconductor layer. The first detector has a first thickness along a second direction from the first semiconductor layer toward the second semiconductor layer, and the second detector has a second thickness along the second direction, the second thickness being thicker than the first thickness.

Claims (43)

1. A solid-state imaging device, comprising:

a first semiconductor layer of a first conductivity type;

a second semiconductor layer of a second conductivity type, the second semiconductor layer being provided on the first semiconductor layer;

a first detector positioned inside the second semiconductor layer, the first detector including a first semiconductor portion of the first conductivity type;

a second detector positioned inside the second semiconductor layer, the second detector including a second semiconductor portion of the first conductivity type, the first and second detectors being arranged in a first direction along a boundary between the first semiconductor layer and the second semiconductor layer;

a first semiconductor region provided between the first semiconductor layer and the first detector, the first semiconductor region including second conductivity type impurities with a higher concentration than the concentration of second conductivity type impurities in the second semiconductor layer and the concentration of first conductivity type impurities in the first semiconductor portion of the first detector; and

a second semiconductor region provided between the first semiconductor layer and the second detector, the second semiconductor region including the second conductivity type impurity with a higher concentration than the concentration of second conductivity type impurities in the second semiconductor layer and the concentration of first conductivity type impurities in the second semiconductor portion of the second detector,

the first detector having a first thickness along a second direction from the first semiconductor layer toward the second semiconductor layer,

the second detector having a second thickness along the second direction, the second thickness being thicker than the first thickness.

2. The device according to claim 1 , further comprising:

a third detector positioned inside the second semiconductor layer, the third detector including a third semiconductor portion of the first conductivity type, the first to third detectors being arranged along the boundary between the first semiconductor layer and the second semiconductor layer; and

a third semiconductor region provided between the first semiconductor layer and the third detector, the third semiconductor region including second conductivity type impurity with a higher concentration than the concentration of second conductivity type impurities in the second semiconductor layer and the concentration of first conductivity type impurities in the third semiconductor portion of the third detector,

the third detector having a third thickness along the second direction, the third thickness being thinner than the second thickness of the second detector.

3. The device according to claim 2 , wherein

the second semiconductor layer includes a first portion and a second portion, the first portion being positioned between the first semiconductor layer and the first semiconductor region, the second portion being positioned between the first semiconductor layer and the third semiconductor region, and

the second semiconductor region contacts the first semiconductor layer.

4. The device according to claim 2 , further comprising:

a third semiconductor layer of the second conductivity type;

a fourth semiconductor layer of the second conductivity type; and

a fifth semiconductor layer of the second conductivity type,

the first detector being positioned between the first semiconductor region and the third semiconductor layer,

the second detector being positioned between the second semiconductor region and the fourth semiconductor layer,

the third detector being positioned between the third semiconductor region and the fifth semiconductor layer.

5. The device according to claim 2 , further comprising:

a first filter selectively transmitting blue light;

a second filter selectively transmitting red light; and

a third filter selectively transmitting green light,

the first detector being positioned between the first filter and the first semiconductor region,

the second detector being positioned between the second filter and the second semiconductor region,

the third detector being positioned between the third filter and the third semiconductor region.

6. The device according to claim 5 , wherein the third thickness of the third detector being thicker than the first thickness of the first detector.

7. The device according to claim 5 , wherein the third thickness of the third detector being equal to the first thickness of the first detector.

8. The device according to claim 2 , further comprising:

a charge transfer portion electrically connected to the first to third detectors.

9. The device according to claim 8 , wherein

the first to third detectors being provided respectively in a plurality, the plurality of first detectors including a pair of first detectors arranged along the first semiconductor layer in a first direction, the plurality of second detectors including a pair of second detectors arranged in the first direction, the plurality of third detectors including a pair of third detectors arranged in the first direction; the pair of first detectors, the pair of second detectors and the pair of third detectors being arranged in a second direction crossing the first direction; and

the charge transfer portion is positioned between the pair of first detectors, between the pair of second detectors and between the pair of third detectors, the charge transfer portion being electrically connected to the pair of first detectors, the pair of second detectors and the pair of third detectors.

10. The device according to claim 1 , further comprising a first semiconductor substrate of the first conductivity type,

the first semiconductor layer being positioned between the second semiconductor layer and the first semiconductor substrate.

11. The device according to claim 10 , wherein the device is configured to supply a higher electric potential to the first semiconductor substrate than the electric potentials of the first and second detectors while being dark.

12. The device according to claim 1 , further comprising a second semiconductor substrate of the second conductivity type,

the first semiconductor layer being positioned between the second semiconductor layer and the second semiconductor substrate.

13. The device according to claim 12 , wherein the device is configured to supply a higher electric potential to the second semiconductor substrate than the electric potentials of the first and second detectors while being dark.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2019
From: HASEGAWA, SHUNSUKE
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 050628/0118 →
Priority Claims (1)
JP JP2019-048072 · Mar 15, 2019 · national
Continuity (1)
Related Publication 20200295080A1 · Sep 17, 2020
Cited By (1)
US 12,266,676