Method for forming a temperature compensated dielectric material
Disclosed are embodiments of tungsten bronze crystal structures that can have both a high dielectric constant and low temperature coefficient, making them advantageous for applications that experience temperature changes and gradients. In particular, tantalum can be substituted into the crystal structure to improve properties. Embodiments of the material can be useful for radiofrequency applications such as resonators and antennas.
1. A method of forming a temperature compensated dielectric material, the method comprising modifying a Ba—Sm—Ti—O tungsten bronze structure by inserting tantalum and adjusting barium and samarium content to balance the charges, the temperature compensated dielectric material having a dielectric constant of at least 60, a Qf at 1 GHz of at least 7000, and a temperature coefficient of resonant frequency of less than 15.
2. The method of claim 1 further including forming a radiofrequency component from the temperature compensated dielectric material.
3. The method of claim 1 wherein the temperature compensated dielectric material contains no aluminum.
4. The method of claim 1 wherein the temperature compensated dielectric material has a dielectric constant of at least 80.
5. The method of claim 1 wherein the temperature compensated dielectric material has a temperature coefficient of resonant frequency of less than 5.
6. The method of claim 1 wherein the temperature compensated dielectric material has a Qf at 1 GHz of at least 8000.
7. The method of claim 1 wherein the temperature compensated dielectric material has no rutile or perovskite phase.
8. A method of forming a temperature compensated dielectric material having a high dielectric constant while maintaining a low temperature coefficient of resonant frequency, the method comprising modifying a tungsten bronze crystal structure including Ba, Sm, Ti, and O and incorporating Ta into the tungsten bronze crystal structure to form the temperature compensated dielectric material having a chemical formula Ba 12+3x Sm 28−3x Ti 54−3x Ta 3x O 162 , x being between 0 and 3.
9. The method of claim 8 wherein the temperature compensated dielectric material has a chemical formula Ba 12.6 Sm 27.4 Ti 53.4 Ta 0.6 O 162 .
10. The method of claim 8 wherein the temperature compensated dielectric material has a dielectric constant of at least 60 and a temperature coefficient of resonant frequency of less than 15.
11. The method of claim 8 wherein the temperature compensated dielectric material has a temperature coefficient of resonant frequency of less than 5.
12. The method of claim 8 wherein the temperature compensated dielectric material has no rutile or perovskite phase.
13. The method of claim 8 wherein the temperature compensated dielectric material has a Qf at 1 GHz of at least 7000.
14. The method of claim 8 wherein the temperature compensated dielectric material has a Qf at 1 GHz of at least 8000.
15. A method of forming a temperature compensated dielectric material, the method comprising inserting Ta into a Ba—Sm—Ti—O tungsten bronze structure to form the temperature compensated dielectric material, the temperature compensated dielectric material having a high dielectric constant while maintaining a low temperature coefficient of resonant frequency, the temperature compensated dielectric material comprising a chemical formula Ba 12.6 Sm 27.4 Ti 53.4 Ta 0.6 O 162 .
16. The method of claim 15 wherein the temperature compensated dielectric material has a tungsten bronze crystal structure.
17. The method of claim 15 wherein the temperature compensated dielectric material has a dielectric constant of at least 60 and a temperature coefficient of resonant frequency of less than 15.
18. The method of claim 15 wherein the temperature compensated dielectric material has a temperature coefficient of resonant frequency of less than 4.
19. The method of claim 15 wherein the temperature compensated dielectric material has no rutile or perovskite phase.
20. The method of claim 15 further comprising forming a radiofrequency component from the temperature compensated dielectric material.
21. The method of claim 8 further comprising forming a radiofrequency component from the temperature compensated dielectric material.