Semiconductor device
According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.
1. A semiconductor device, comprising:
a semiconductor chip;
a first conductive member including a first portion and a second portion, the second portion being electrically connected to the semiconductor chip, a direction from the semiconductor chip toward the second portion being aligned with a first direction, a direction from the second portion toward the first portion being aligned with a second direction crossing the first direction;
a second conductive member including a third portion; and
a first connection member provided between the first portion and the third portion, the first connection member being conductive,
the first portion having a first surface opposing the first connection member,
the first surface including a recess and a protrusion,
the recess including a first bottom portion, and a second distance,
the second distance being a distance along the first direction between the recess and the third portion, the second distance increasing along an orientation from the second portion toward the first portion,
at least a portion of the first bottom portion and at least a portion of an upper face of the third portion being parallel to the second direction,
wherein at least a portion of the first bottom portion is perpendicular to the first direction.
2. The device according to claim 1 , wherein the recess is provided inward from two end portions of the first portion and is separated from the two end portions of the first portion.
3. The device according to claim 1 , wherein
a plurality of the protrusions are provided, and
the recess is positioned between the protrusions.
4. The device according to claim 1 , wherein a depth of the recess exceeds 10 μm.
5. The device according to claim 4 , wherein the depth of the recess is 60 or less.
6. The device according to claim 1 , further comprising;
second connection member, the second connection member being conductive; and
a resin portion including a first partial region, the first partial region being provided around the first portion, the third portion, and the first connection member,
the second connection member electrically connecting the semiconductor chip and the second portion and being positioned between the semiconductor chip and the second portion,
the resin portion further including a second partial region provided around the second portion and the second connection member.
7. The device according to claim 1 , further comprising:
a resin portion including a first partial region, the first partial region being provided around the first portion, the third portion, and the first connection member;
a third conductive member including a fifth portion; and
a third connection member provided between the fifth portion and the semiconductor chip, the third connection member being conductive,
the resin portion further including a third partial region provided around the fifth portion and the third connection member.
8. The device according to claim 7 , wherein
the third conductive member further includes a sixth portion, and
at least a portion of the sixth portion is not covered with the resin portion.
9. The device according to claim 1 , wherein
the first connection member includes a particle, and
a size of the particle exceeds 10 μm and is 20 μm or less.
10. The device according to claim 1 , further comprising a resin portion including a first partial region, the first partial region being provided around the first portion, the third portion, and the first connection member,
the resin portion-including a plurality of fillers, and
a concentration of the fillers in the resin portion being not less than 76 weight% and not more than 84 weight%.
11. The device according to claim 1 , wherein an end portion of the first portion on a middle portion side is bent.
12. The device according to claim 1 , wherein an other portion of the first connection member is positioned at an end portion of the first portion and the first portion is posited between the other portion of the first connection member and the portion of the first connection member that is positioned between the first bottom portion and the third portion.