Motor control device with built-in current sensing resistor and power transistor
A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction.
1. A motor control device with built-in shunt resistor and power transistor, comprising:
a high-thermally conductive substrate, whose heat transfer coefficient is at least greater than 10 W/m·k, and coefficient of thermal expansion at least smaller than 10×10 −6 /K;
at least one electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes at least one first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart;
at least one high power transistor conductively connected to the electrical conductive circuit; and
at least one shunt resistor conductively connected to the high power transistor, in which the shunt resistor respectively includes a body, as well as a pair of welding portions extending outwards individually along the mutually opposite directions from the body, and wherein the body has a prescribed width, and the width of the welding portion is not smaller than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction between the welding portion and the first thermal connection pad portion and the second thermal connection pad portion.
2. The motor control device with built-in shunt resistor and power transistor according to claim 1 , wherein the thermal conductivity of the thermal connection pad portion is higher than that of the high-thermally conductive substrate.
3. The motor control device with built-in shunt resistor and power transistor according to claim 1 , wherein the electrically conductive circuit is selected from a set of copper or copper alloys.
4. The motor control device with built-in shunt resistor and power transistor according to claim 1 , further comprising an underfill layer filled between the body and the high-thermally conductive substrate thereby buffering the motor vibration stress endured by the welding portion and the body.
5. The motor control device with built-in shunt resistor and power transistor according to claim 1 , further comprising a temperature sensing device installed on the electrical conductive circuit.
6. The motor control device with built-in shunt resistor and power transistor according to claim 1 , wherein the thermal conductivity coefficient of the welded portion is at least greater than 200 W/m·K.
7. The motor control device with built-in shunt resistor and power transistor according to claim 1 , wherein the resistivity of the welding portion is at least greater than 1.68×10 −8 Ωm.
8. A control device with built-in shunt resistor and high power consumption component, comprising:
a substrate;
at least one electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes at least one first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart;
at least one high power consumption component characterized in operation state variations due to current changes, which is installed on the electrically conductive circuit; and
at least one shunt resistor conductively connected to the high power consumption component, in which the shunt resistor respectively includes a body whose thermal expansion coefficient is greater than that of the substrate, as well as a pair of welding portions extending outwards individually along the mutually opposite directions from the body, and wherein the body has a prescribed width, and the width of the welding portion is not smaller than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction between the welding portion and the first thermal connection pad portion and the second thermal connection pad portion.