Storage device applying a cancel circuit
A data reading error is reduced. A memory cell array in a storage device includes a write word line, a read word line, a write bit line, a read bit line, a source line, and a gain cell. For example, a read transistor in the gain cell can include a metal oxide in a channel formation region. A cancel circuit is electrically connected to the read bit line. The cancel circuit has a function of supplying, to the read bit line, current for canceling leakage current supplied to the read bit line from the gain cell in a non-selected state. In read operation, a potential change of the read bit line due to leakage current is compensated for by the current from the cancel circuit, so that a data reading error is reduced.
1. A storage device comprising:
a control circuit;
a row circuit;
a column circuit; and
a memory cell array, the memory cell array comprising:
a plurality of memory cells; and
a plurality of lines,
wherein one of the plurality of memory cells comprises:
a first transistor;
a second transistor; and
a capacitor,
wherein the first transistor comprises a metal oxide in a channel formation region,
wherein an off-state current of the first transistor is in the order of several yoctoamperes per micrometer to several zeptoamperes per micrometer,
wherein a retention time of the one of the plurality of memory cells is 1 to 10 years,
wherein the column circuit comprises a cancel circuit,
wherein the cancel circuit is configured to supply, to one of the plurality of lines, current for canceling leakage current supplied to the one of the plurality of lines from the one of the plurality of memory cells in a non-selected state,
wherein the cancel circuit includes a third transistor and a fourth transistor,
wherein a first potential is input to a first terminal of the third transistor,
wherein a channel length of the third transistor is different from a channel length of the fourth transistor,
wherein a second potential is input to a gate of the third transistor and a gate of the fourth transistor, and
wherein a second terminal of the third transistor is electrically connected to a first terminal of the fourth transistor.
2. The storage device according to claim 1 , wherein the plurality of lines comprises:
a write word line;
a read word line;
a write bit line; and
a read bit line.
3. The storage device according to claim 2 , wherein a second terminal of the fourth transistor is electrically connected to the read bit line.
4. The storage device according to claim 1 , wherein the metal oxide comprises a Zn oxide, a Zn-Sn oxide, a Ga-Sn oxide, an In-Ga oxide, an In-Zn oxide, and an In-M-Zn oxide (M is Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf).
5. The storage device according to claim 1 ,
wherein the first transistor is a write transistor, and
wherein the second transistor is a read transistor.
6. The storage device according to claim 1 ,
wherein the cancel circuit includes an inverter circuit,
wherein an output terminal of the inverter circuit is electrically connected to a gate of the third transistor, and
wherein an input terminal of the inverter circuit is electrically connected to the one of the plurality of lines.
7. The storage device according to claim 1 , wherein the one of the plurality of memory cells includes a selection transistor.
8. A storage device comprising:
a cancel circuit; and
a memory cell array, the memory cell array comprising:
a plurality of memory cells;
a write word line;
a read word line;
a write bit line; and
a read bit line,
wherein one of the plurality of memory cells comprises:
a first transistor;
a second transistor;
a capacitor; and
a node,
wherein the first transistor comprises a metal oxide in a channel formation region,
wherein an off-state current of the first transistor is in the order of several yoctoamperes per micrometer to several zeptoamperes per micrometer,
wherein a retention time of the one of the plurality of memory cells is 1 to 10 years,
wherein the cancel circuit is configured to supply, to the read bit line, current for canceling leakage current supplied to the read bit line from the one of the plurality of memory cells in a non-selected state,
wherein the cancel circuit includes a third transistor and a fourth transistor,
wherein a current drive capability of the third transistor is lower than a current drive capability of the second transistor,
wherein a first potential is input to a first terminal of the third transistor,
wherein a second terminal of the third transistor is electrically connected to the read bit line,
wherein the second terminal of the third transistor is electrically connected to the read bit line via the fourth transistor, and
wherein a channel length of the third transistor is different from a channel length of the fourth transistor.
9. The storage device according to claim 8 , wherein the metal oxide comprises a Zn oxide, a Zn-Sn oxide, a Ga-Sn oxide, an In-Ga oxide, an In-Zn oxide, and an In-M-Zn oxide (M is Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf).
10. The storage device according to claim 8 ,
wherein the first transistor is a write transistor, and
wherein the second transistor is a read transistor.
11. The storage device according to claim 8 ,
wherein the cancel circuit includes an inverter circuit,
wherein an output terminal of the inverter circuit is electrically connected to a gate of the third transistor, and
wherein an input terminal of the inverter circuit is electrically connected to the read bit line.
12. The storage device according to claim 8 , wherein the one of the plurality of memory cells includes a selection transistor.