Measuring microscope for measuring masks for lithographic methods and measuring method and calibration method therefor
The present invention relates to a method for calibrating a measuring microscope which may be used to measure masks, in which a calibration mask is utilized in a self-calibration algorithm in order to ascertain error correction data of the measuring microscope, wherein, in the self-calibration algorithm, the calibration mask is imaged and measured in various positions in the measuring microscope in order to ascertain one or more portions of the error correction data, wherein the surface profile of the calibration mask is ascertained and utilized when determining the error correction. Moreover, the invention relates to a measuring microscope and a method for operating same.
1. A method for measuring structured elements for lithographic methods, said method utilizing a measuring microscope by use of which images of the structured elements can be created, wherein the structured elements to be measured are arranged in an object plane of the measuring microscope,
wherein one or more coordinates of the structured elements to be measured are captured in the direction of an optical axis of the measuring microscope, wherein an interferometric measurement is carried out for the purpose of capturing the coordinates in the direction of the optical axis by an interferometer having a z mirror being perpendicular to the optical axis,
wherein the captured coordinates in the direction of the optical axis serve as a reference value and coordinates ascertained after the reference value in time and in the direction of the optical axis of the elements to be measured are corrected by use of a change in a refractive index influencing the imaging of the measuring microscope, said change having taken place during the corresponding time interval,
wherein the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask measured in a measuring appliance which differs from the measuring microscope is ascertained and taken into account during the calibration, and/or
wherein use is made of an error correction ascertained in a method for calibrating the measuring microscope in which a calibration mask is utilized in a self-calibration algorithm in order to ascertain the error correction data of the measuring microscope, wherein, in the self-calibration algorithm, the calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask measured in a measuring appliance which differs from the measuring microscope is ascertained and taken into account during the calibration.
2. The method according to claim 1 , wherein the measuring microscope comprises a device for determining the refractive index of the medium present in the measuring microscope.
3. The method of claim 1 in which the calibration comprises at least one, or more, parts for compensating mask influences and at least one, or more, parts for compensating influences of the stage, wherein the part or parts for compensating mask influences in the direction of the mask surface are correlated with the surface profile.
4. The method of claim 1 in which a tilt of the mask or a wedge-shaped distortion of the mask is taken into account as a part of the stage during the calibration.
5. The method of claim 1 in which the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask is ascertained and taken into account during the calibration,
wherein the calibration comprises at least one, or more, parts for compensating mask influences and at least one, or more, parts for compensating influences of the stage, wherein the part or parts for compensating mask influences in the direction of the mask surface are correlated with the surface profile.
6. The method of claim 1 in which the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask is ascertained and taken into account during the calibration,
wherein a tilt of the mask or a wedge-shaped distortion of the mask is taken into account as a part of the stage during the calibration.
7. The method of claim 1 in which the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask is ascertained and taken into account during the calibration,
wherein the bending of the mask on account of the bearing thereof is taken into account during the determination by way of simulation when determining the surface profile of the calibration mask.
8. The method of claim 1 in which the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is imaged and measured in various positions in the measuring microscope, wherein the surface profile of the calibration mask is ascertained and taken into account during the calibration,
wherein the calibration mask is borne on a three-point bearing when determining the surface profile.
9. A method for measuring structured elements for lithographic methods, said method utilizing a measuring microscope by use of which images of the structured elements can be created, wherein the structured elements to be measured are arranged in an object plane of the measuring microscope,
wherein one or more coordinates of the structured elements to be measured are captured in the direction of the optical axis of the measuring microscope,
wherein the captured coordinates in the direction of the optical axis serve as a reference value and coordinates ascertained after the reference value in time and in the direction of the optical axis of the elements to be measured are corrected by use of a change in a refractive index influencing the imaging of the measuring microscope, said change having taken place during the corresponding time interval, and
wherein the method for measuring structured elements is utilized in a self-calibration algorithm in which a calibration mask is placed at various positions relative to the measuring microscope, the calibration mask is moved among the various positions relative to the measuring microscope, at each of the various positions the calibration mask is imaged and measured in the measuring microscope, and
wherein a surface profile of the calibration mask is ascertained and taken into account during the calibration, and the surface profile of the calibration mask is ascertained by measuring the calibration mask in a measuring appliance which differs from the measuring microscope.
10. The method of claim 9 in which the self-calibration algorithm comprises:
moving the calibration mask to a first position relative to the measuring microscope,
imaging and measuring the calibration mask while the calibration mask is at the first position,
moving the calibration mask to a second position relative to the measuring microscope, the second position being different from the first position, and
imaging and measuring the calibration mask while the calibration mask is at the second position.
11. The method of claim 9 in which a tilt of the mask or a wedge-shaped distortion of the mask is taken into account as a part of the calibration.