Array substrate and method of mounting integrated circuit using the same
An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.
1. An electronic device, comprising:
an array substrate;
a pad portion disposed on the array substrate; and
an integrated circuit disposed on the pad portion and comprising a bump portion;
wherein:
the pad portion comprises a first sub-pad unit comprising an inclined first pad and a second sub-pad unit comprising an inclined second pad;
the first pad and the second pad are inclined in different directions symmetrically about an imaginary line that divides the pad portion; and
the pad portion is electrically connected with the bump portion;
the bump portion comprises a first sub-bump unit comprising an inclined first bump and a second sub-bump unit comprising an inclined second bump;
the first bump and the second bump are inclined in different directions symmetrically about the imaginary line that divides the pad portion.
2. The electronic device of claim 1 , wherein at least one of the first pad and the second pad has a parallelogram shape.
3. The electronic device of claim 1 , wherein:
the first bump has a same inclination angle as the first pad; and
the second bump has a same inclination angle as the second pad.
4. The electronic device of claim 1 , wherein a shape of the first bump corresponds to a shape of the first pad, and a shape of the second bump corresponds to a shape of the second pad.
5. The electronic device of claim 1 , wherein the first pad is electrically connected with the first bump and the second pad is electrically connected with the second bump.
6. The electronic device of claim 1 , wherein an area of the first pad is greater than an area of the first bump.
7. The electronic device of claim 1 , wherein:
the first bump comprises a first region and a second region; and
the first region overlaps the first pad and the second region does not overlap the first pad.
8. The electronic device of claim 1 , wherein at least one of the first pad and the second pad has a quadrangle shape.
9. The electronic device of claim 2 , wherein the pad portion further comprises a third sub-pad unit comprising a third pad having a rectangular shape and disposed between the first sub-pad unit and the second sub-pad unit.
10. The electronic device of claim 9 , wherein the bump portion further comprises a third sub-bump unit comprising a third bump having a rectangular shape and disposed between the first sub-bump unit and the second sub-bump unit.