Protective bilayer inner spacer for nanosheet devices
A method for manufacturing a semiconductor device includes forming a plurality of first semiconductor layers alternately stacked with a plurality of second semiconductor layers on a semiconductor substrate, and laterally recessing the plurality of first semiconductor layers with respect to the plurality of second semiconductor layers to form a plurality of vacant areas on lateral sides of the plurality of first semiconductor layers. In the method, a plurality of first inner spacers are formed on the lateral sides of the plurality of first semiconductor layers in respective ones of the plurality of vacant areas, and a plurality of second inner spacers are formed on sides of the plurality of first inner spacers in the respective ones of the plurality of vacant areas. The method also includes laterally recessing the plurality of second semiconductor layers, and growing a plurality of source/drain regions from the plurality of second semiconductor layers.
1. A method for manufacturing a semiconductor device, comprising:
forming a plurality of first semiconductor layers alternately stacked with a plurality of second semiconductor layers on a semiconductor substrate;
laterally recessing the plurality of first semiconductor layers with respect to the plurality of second semiconductor layers to form a plurality of vacant areas on lateral sides of the plurality of first semiconductor layers;
forming a plurality of first inner spacers on the lateral sides of the plurality of first semiconductor layers in respective ones of the plurality of vacant areas;
forming a plurality of second inner spacers on sides of the plurality of first inner spacers in the respective ones of the plurality of vacant areas;
laterally recessing the plurality of second semiconductor layers;
growing a plurality of source/drain regions from the plurality of second semiconductor layers;
removing the plurality of first semiconductor layers;
removing the plurality of first inner spacers; and
forming a plurality of gate structures in place of the removed plurality of first semiconductor layers and the removed plurality of first inner spacers.
2. The method according to claim 1 , wherein the first inner spacers are selectively removed with respect to the second inner spacers.
3. The method according to claim 1 , wherein the first and second inner spacers comprise different material from each other.
4. The method according to claim 1 , wherein the plurality of second inner spacers fills in remaining portions of the respective ones of the plurality of vacant areas left unfilled by the plurality of first inner spacers.
5. The method according to claim 1 , wherein the plurality of first semiconductor layers comprise silicon germanium and the plurality of second semiconductor layers comprise silicon.
6. The method according to claim 5 , wherein the plurality of source/drain regions comprise silicon germanium.
7. The method according to claim 1 , wherein the plurality of second semiconductor layers are laterally recessed to a depth such that outer surfaces of the plurality of second semiconductor layers are in line with the plurality of first inner spacers.
8. The method according to claim 1 , further comprising forming a dummy gate structure on the plurality of first semiconductor layers alternately stacked with the plurality of second semiconductor layers.
9. The method according to claim 8 , further comprising removing portions of the plurality of first and second semiconductor layers using the dummy gate structure as a mask.
10. A method for manufacturing a semiconductor device, comprising:
forming a plurality of first semiconductor layers alternately stacked with a plurality of second semiconductor layers on a semiconductor substrate;
laterally recessing the plurality of first semiconductor layers with respect to the plurality of second semiconductor layers to form a plurality of vacant areas on lateral sides of the plurality of first semiconductor layers;
forming a plurality of first inner spacers on the lateral sides of the plurality of first semiconductor layers in respective ones of the plurality of vacant areas;
forming a plurality of second inner spacers on sides of the plurality of first inner spacers in the respective ones of the plurality of vacant areas;
laterally recessing the plurality of second semiconductor layers; and
growing a plurality of source/drain regions from the plurality of second semiconductor layers;
wherein forming the plurality of first inner spacers comprises:
depositing a first inner spacer material to fill in respective ones of the plurality of vacant areas; and
etching the deposited first inner spacer material to remove a portion of the deposited first inner spacer material from the filled-in respective ones of the plurality of vacant areas.
11. The method according to claim 10 , wherein the plurality of second inner spacers fills in remaining portions of the respective ones of the plurality of vacant areas following the etching of the deposited first inner spacer material.
12. The method according to claim 10 , wherein the first and second inner spacers comprise different material from each other.
13. A method for manufacturing a semiconductor device, comprising:
forming a plurality of sacrificial semiconductor layers alternately stacked with a plurality of channel semiconductor layers on a semiconductor substrate;
laterally recessing the plurality of sacrificial semiconductor layers with respect to the plurality of channel semiconductor layers to form a plurality of vacant areas on lateral sides of the plurality of sacrificial semiconductor layers;
forming a plurality of first inner spacers on the lateral sides of the plurality of sacrificial semiconductor layers in respective ones of the plurality of vacant areas;
forming a plurality of second inner spacers on sides of the plurality of first inner spacers in the respective ones of the plurality of vacant areas;
laterally recessing the plurality of channel semiconductor layers;
growing a plurality of source/drain regions from the plurality of channel semiconductor layers;
removing the plurality of sacrificial semiconductor layers;
removing the plurality of first inner spacers; and
forming a plurality of gate structures in place of the removed plurality of sacrificial semiconductor layers and the removed plurality of first inner spacers.
14. The method according to claim 13 , wherein the first inner spacers are selectively removed with respect to the second inner spacers.
15. The method according to claim 13 , wherein the first and second inner spacers comprise different material from each other.
16. The method according to claim 13 , wherein forming the plurality of first inner spacers comprises:
depositing a first inner spacer material to fill in respective ones of the plurality of vacant areas; and
etching the deposited first inner spacer material to remove a portion of the deposited first inner spacer material from the filled-in respective ones of the plurality of vacant areas.
17. The method according to claim 16 , wherein the plurality of second inner spacers fills in remaining portions of the respective ones of the plurality of vacant areas following the etching of the deposited first inner spacer material.
18. The method according to claim 13 , wherein the plurality of second inner spacers fills in remaining portions of the respective ones of the plurality of vacant areas left unfilled by the plurality of first inner spacers.
19. The method according to claim 13 , wherein the plurality of sacrificial semiconductor layers comprise silicon germanium and the plurality of channel semiconductor layers comprise silicon.
20. The method according to claim 19 , wherein the plurality of source/drain regions comprise silicon germanium.