IP Library › Granted Patent US 1,108,381
Granted Patent S1
US 1,108,381 · App. 29/961,389 · Granted Jan 6, 2026

Filler block for substrate processing apparatus

Inventor: Yusaku Okajima (Toyama, JP)
Assignee: KOKUSAI ELECTRIC CORPORATION
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Quick Facts
Patent No.
US 1,108,381
App. No.
29/961,389
Granted
Jan 6, 2026
Kind
S1
Claims (1)

The ornamental design for a filler block for substrate processing apparatus as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2025
From: OKAJIMA, YUSAKU
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 073111/0283 →
Priority Claims (1)
JP 2024-004871 D · Mar 8, 2024 · national
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