Substrate processing apparatus

1. A substrate processing apparatus comprising:

a substrate supporting unit;

a processing unit on the substrate supporting unit; and

an exhaust unit connected to a reaction space between the substrate supporting unit and the processing unit,

wherein a first gas in the reaction space is exhausted to the exhaust unit through a first channel,

a second gas in a lower space below the substrate supporting unit is exhausted to the exhaust unit through a second channel, and

the first channel and the second channel are joined to each other on an inner lower surface of the exhaust unit,

wherein the first channel and the second channel meet each other at a point outside the reaction space,

wherein the first channel extends along the inner lower surface of the exhaust unit,

wherein a vertical axis extending through the second channel intersects the inner lower surface of the exhaust unit, and

wherein the vertical axis and a horizontal axis extending through the first channel intersect at the point outside the reaction space such that a collision of the first gas and the second gas in a substrate edge area may be prevented.

2. The substrate processing apparatus of claim 1 , wherein the exhaust unit further comprises:

a partition wall defining a side of the reaction space;

an outer wall parallel to the partition wall; and

a connecting portion extending to connect the partition wall to the outer wall,

wherein the first channel and the second channel are located below the partition wall, and

wherein the first gas in the reaction space and the second gas in the lower space meet each other outside a surface of the partition wall contacting the reaction space such that a turbulent flow in the substrate edge area may be prevented.

3. The substrate processing apparatus of claim 1 , further comprising:

a flow control ring surrounding the substrate supporting unit,

wherein the first gas in the reaction space is exhausted to the exhaust unit through a first surface of the flow control ring, and

the second gas in the lower space below the substrate supporting unit is exhausted to the exhaust unit through a second surface of the flow control ring.

4. The substrate processing apparatus of claim 3 ,

wherein the exhaust unit protrudes from the flow control ring such that the flow control ring overlaps at least a portion of the exhaust unit.

5. The substrate processing apparatus of claim 3 , further comprising:

an outer ring surrounds the flow control ring,

wherein the first channel is between a lower surface of the exhaust unit and an upper surface of the flow control ring, and

the second channel is between an inner surface of the outer ring and an outer surface of the flow control ring.

6. The substrate processing apparatus of claim 5 , further comprising:

a support configured to support the processing unit and the exhaust unit; and

the outer ring is between the exhaust unit and the support.

7. The substrate processing apparatus of claim 5 ,

wherein the substrate supporting unit is configured to be vertically movable, and

the flow control ring is configured to move up and down according to the vertical movement of the substrate supporting unit.

8. The substrate processing apparatus of claim 1 , further comprising a third channel connected to the first channel and the second channel,

wherein a ‘T’ shape channel is formed below the exhaust unit by the first channel, the second channel, and the third channel.

9. The substrate processing apparatus of claim 5 ,

wherein the flow control ring comprises:

a first portion overlapping at least a portion of the substrate supporting unit; and

a second portion extending from the first portion along the side of the substrate supporting unit.

10. The substrate processing apparatus of claim 9 ,

wherein the flow control ring further comprises:

a third portion extending from the second portion to overlap at least a portion of the exhaust unit.

11. The substrate processing apparatus of claim 5 ,

wherein the flow control ring comprises:

a first portion overlapping at least a portion of the outer ring; and

a second portion extending from the first portion along the side of the substrate supporting unit.

12. The substrate processing apparatus of claim 11 ,

wherein the substrate supporting unit is configured to be vertically movable, and

the flow control ring slides with respect to the outer ring by a pushing force of the substrate supporting unit as the substrate supporting unit moves up and down.

13. The substrate processing apparatus of claim 11 ,

wherein the first portion of the flow control ring comprises an uneven structure, and

the second channel is formed between the first portion of the flow control ring and the outer ring according to the uneven structure.

14. The substrate processing apparatus of claim 11 ,

wherein the second portion of the flow control ring has a surface inclined with respect to the substrate supporting unit.

15. A substrate processing apparatus comprising:

a substrate supporting unit;

a processing unit above the substrate supporting unit;

an exhaust unit connected to a reaction space between the substrate supporting unit and the processing unit; and

a ring below the exhaust unit, wherein an outer perimeter of the ring overlaps at least a portion of an inner perimeter of the exhaust unit,

a first gas in the reaction space is transmitted to the exhaust unit through a first surface of the ring, and

a second gas in a lower space below the substrate supporting unit is transmitted to the exhaust unit through a second surface of the ring,

wherein the substrate processing apparatus further comprises:

a first channel between the reaction space and the exhaust unit; and

a second channel between the lower space and the exhaust unit,

wherein the first channel and the second channel are joined to each other at a point outside the reaction space on an inner lower surface of the exhaust unit,

wherein the first channel extends along the inner lower surface of the exhaust unit, and

wherein a vertical axis extending through the second channel intersects the inner lower surface of the exhaust unit,

wherein the vertical axis and a horizontal axis extending through the first channel intersect at the point outside the reaction space such that a collision of the first gas and the second gas in a substrate edge area may be prevented.

16. The substrate processing apparatus of claim 15 , further comprising a third channel connected to the first channel and the second channel,

wherein a ‘T’ shape channel is formed below the exhaust unit by the first channel, the second channel, and the third channel.

17. A substrate processing apparatus comprising:

a substrate supporting unit;

a processing unit above the substrate supporting unit;

an exhaust unit connected to a reaction space between the substrate supporting unit and the processing unit,

a first channel for flowing a first gas in the reaction space; and

a second channel for flowing a second gas in a lower space below the substrate supporting unit, and

wherein the first channel and the second channel are joined to each other at a point outside the reaction space,

wherein the first channel extends along an inner lower surface of the exhaust unit, and

wherein a vertical axis extending through the second channel intersects the inner lower surface of the exhaust unit,

wherein the vertical axis and a horizontal axis extending through the first channel intersect at the point outside the reaction space such that a collision of the first gas and the second gas in a substrate edge area may be prevented.

18. The substrate processing apparatus of claim 17 , further comprising a third channel connected to the first channel and the second channel,

wherein a ‘T’ shape channel is formed below the exhaust unit by the first channel, the second channel, and the third channel.

19. The substrate processing apparatus of claim 17 ,

wherein the exhaust unit comprises: a partition wall defining the side of the reaction space; and

the first channel and the second channel are joined to each other outside a surface of the partition wall contacting the reaction space,

wherein the first gas in the reaction space and the second gas in the lower space meet each other outside a surface of the partition wall contacting the reaction space such that a turbulent flow in the substrate edge area may be prevented.