Air spacer structures

1. A structure, comprising:

a plurality of gate structures comprising active regions;

contacts extending to the active regions;

a plurality of anchor structures between the active regions; and

air spacer structures adjacent to the contacts,

wherein:

upper surfaces of the anchor structures are lower than upper surfaces of the contacts and the gate structures;

the contacts are anchored into the anchor structures;

the air spacer structures comprise airgaps between the gate structures and the contacts;

the air spacer structures comprise a low-k liner;

the gate structures comprise sidewall spacers and a etch stop liner adjacent to the sidewall spacers;

the etch stop liner extends beneath the anchor structures;

the etch stop liner is a dual etch stop liner comprising a bottom liner and a top liner; and

each of the air space structure includes an upper airgap and a lower airgap separated from one another by the low-k liner.

2. The structure of claim 1 , wherein a low-k liner lines the anchor structures.

3. The structure of claim 1 , wherein the bottom liner and the top liner are composed of a low-k material.

4. The structure of claim 1 , further comprising a cap over the air spacer structures.

5. The structure of claim 4 , wherein the cap is composed of a same material as the anchor structures.

6. A structure, comprising:

a plurality of gate structures comprising source and drain (S/D) regions;

contacts extending to the S/D regions;

a plurality of anchor structures located between the S/D regions and between the contacts to separate adjacent ones of the S/D regions and adjacent ones of the contacts from one another; and

air spacer structures adjacent to sidewalls of the S/D regions, sidewalls of the contacts and sidewalls of the anchor structures,

wherein:

the air spacer structures separate the sidewalls of the S/D regions from the sidewalls of the anchor structures;

the contacts are anchored into the anchor structures;

the air spacer structures comprise airgaps between the gate structures and the contacts;

upper surfaces of the anchor structures are lower than upper surfaces of the contacts and the gate structures;

the air spacer structures comprise a low-k liner;

the gate structures comprise sidewall spacers and a etch stop liner adjacent to the sidewall spacers;

the etch stop liner extends beneath the anchor structures;

the etch stop liner is a dual etch stop liner comprising a bottom liner and a top liner; and

each of the air space structure includes an upper airgap and a lower airgap separated from one another by the low-k liner.

7. A method, comprising:

forming a plurality of gate structures comprising active regions;

forming contacts extending to the active regions;

forming a plurality of anchor structures between the active regions; and

forming air spacer structures adjacent to the contacts,

wherein:

upper surfaces of the anchor structures are lower than upper surfaces of the contacts and the gate structures;

the contacts are anchored into the anchor structures;

the air spacer structures comprise airgaps between the gate structures and the contacts;

upper surfaces of the contacts and the gate structures are devoid of the anchor structures;

the air spacer structures comprise a low-k liner;

the gate structures comprise sidewall spacers and a etch stop liner adjacent to the sidewall spacers;

the etch stop liner extends beneath the anchor structures;

the etch stop liner is a dual etch stop liner comprising a bottom liner and a top liner; and

each of the air space structure includes an upper airgap and a lower airgap separated from one another by the low-k liner.

8. The method of claim 7 , wherein etching the at least one liner is a top liner of the dual liner.