Heat resistant release sheet and method for manufacturing same
A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.
1. A heat resistant release sheet comprising
a polyimide substrate; and
a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween, wherein
PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and
a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm.
2. The heat resistant release sheet according to claim 1 , wherein the number-average molecular weight of the PTFE composing the first PTFE layer is substantially equal to the number-average molecular weight of the PTFE composing the second PTFE.
3. A method for manufacturing the heat resistant release sheet according to claim 1 , comprising:
forming a film of a PTFE dispersion liquid on each of both principal surfaces of the polyimide substrate, only one of the principal surfaces having been treated with a low-temperature plasma treatment; and
by drying and sintering the formed films, forming the first PTFE layer from the film on the one of the principal surfaces and the second PTFE layer from the film on the other principal surface of the polyimide substrate so as to obtain the heat resistant release sheet.
4. The method for manufacturing the heat resistant release sheet according to claim 3 , wherein the low-temperature plasma treatment is a sputter etching treatment.
5. A heat resistant release sheet comprising:
a polyimide substrate; and
a polytetrafluoroethylene (PTFE) layer disposed on one of principal surfaces of the polyimide substrate, wherein
PTFE composing the PTFE layer has a number-average molecular weight of 6 million or more, and
a peel force required to peel the PTFE layer from the polyimide substrate is 0.5 N/20 mm or more.
6. The heat resistant release sheet according to claim 5 , wherein the other principal surface of the polyimide substrate is an exposed surface.
7. The heat resistant release sheet according to claim 5 , wherein
a PTFE piece is present on a part of the other principal surface of the polyimide substrate, and
PTFE composing the PTFE piece has a number-average molecular weight that is substantially equal to the number-average molecular weight of the PTFE composing the PTFE layer.
8. A method for manufacturing a heat resistant release sheet, comprising:
removing the second PTFE layer from the heat resistant release sheet according to claim 1 ; and
obtaining a heat resistant release sheet comprising:
a polyimide substrate; and
a polytetrafluoroethylene (PTFE) layer disposed on one of principal surfaces of the polyimide substrate, wherein
PTFE composing the PTFE layer has a number-average molecular weight of 6 million or more, and
a peel force required to peel the PTFE layer from the polyimide substrate is 0.5 N/20 mm or more.