Methods and system for microelectromechanical packaging
Hybrid optical integration places very strict manufacturing tolerances and performance requirements upon the multiple elements to exploit passive alignment techniques as well as having additional processing requirements. Alternatively, active alignment and soldering/fixing where feasible is also complex and time consuming with 3, 4, or 6-axis control of each element. However, microelectromechanical (MEMS) systems can sense, control, and activate mechanical processes on the micro scale. Beneficially, therefore the inventors combine silicon MEMS based micro-actuators with silicon CMOS control and drive circuits in order to provide alignment of elements within a silicon optical circuit either with respect to each other or with other optical elements hybridly integrated such as compound semiconductor elements. Such inventive MEMS based circuits may be either maintained as active during deployment or powered off once the alignment has been “locked” through an attachment/retention/latching process.
1. A device comprising:
a substrate; and
a first microelectromechanical systems (MEMS) micro-positioner comprising:
a platform;
a pair of first microelectromechanical systems (MEMS) actuators, a first first MEMS actuator of the pair of first MEMS actuators disposed on a first side of the platform and a second first MEMS actuator of the pair of first MEMS actuators disposed on a second side of the platform opposite the first side of the platform;
a pair of second microelectromechanical systems (MEMS) actuators, a first second MEMS actuator of the pair of second MEMS actuators disposed on a third side of the platform and a second second MEMS actuator of the pair of second MEMS actuators disposed on a fourth side of the platform opposite the third side of the platform; wherein
a first part of each first MEMS actuator of the pair of first MEMS actuators is attached to the platform and a second part of each first MEMS actuator of the pair of first MEMS actuators is coupled to the substrate;
a first part of each second MEMS actuator of the pair of second MEMS actuators is attached to the platform and a second part of each second MEMS actuator of the pair of second MEMS actuators is coupled to the substrate;
the first side of the platform and second side of the platform are disposed laterally to an axis of the platform;
the third side of the platform and fourth side of the platform are disposed longitudinally along the axis of the platform;
the platform is moveable laterally under action of the pair of first MEMS actuators; and
the platform is moveable longitudinally under the action of the pair of second MEMS actuators.
2. The device according to claim 1 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate.
3. The device according to claim 2 , wherein
the plurality of springs hold the platform up.
4. The device according to claim 1 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate;
an optical waveguide disposed upon the substrate having an end terminating at a facet formed within the substrate;
an optical element disposed upon and attached to the platform for coupling optical signals at least one of to and from the optical waveguide; wherein
the facet and end of the optical waveguide are disposed in predetermined positions relative to the platform; and
the optical element is moved by the platform relative to the end of the optical waveguide.
5. The device according to claim 1 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate;
a passive optical die attached to the substrate in a predetermined position relative to the first MEMS micro-positioner;
an optical waveguide disposed upon the passive die; and
an optical element disposed upon and attached to the platform for coupling optical signals at least one of to and from the optical waveguide; wherein
a portion of the passive optical die is disposed over the first MEMS micro-positioner; and
the optical element is moved by the platform relative to the end of the optical waveguide.
6. The device according to claim 5 , wherein
the optical element is one of a ball lens, an injection molded glass lens, an injection molded plastic lens, a graded index (GRIN) lens, an optical fiber based GRIN lens, and an optical fiber.
7. The device according to claim 1 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate;
an optical waveguide either disposed upon the substrate or forming part of a passive die disposed upon the substrate having a first end; and
an active optical die disposed upon and attached to the platform at least one of providing optical signals to the first end of the optical waveguide or receiving optical signals from the first end of the optical waveguide; wherein
electrical connections for the active optical die are made via a predetermined subset of the plurality of springs; and
the active optical die is moved by the platform relative to the first end of the optical waveguide.
8. The device according to claim 1 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate;
an optical waveguide either disposed upon the substrate or forming part of a passive die disposed upon the substrate having a first end; and
an active optical die disposed upon and attached to the platform at least one of providing optical signals to the first end of the optical waveguide or receiving optical signals from the first end of the optical waveguide; wherein
electrical connections for the active optical die are made via wirebonds to at least one of the active optical die and the platform; and
the active optical die is moved by the platform relative to the first end of the optical waveguide.
9. The device according to claim 1 , further comprising
a second MEMS micro-positioner comprising:
a first part comprising a second platform and the first MEMS micro-positioner;
one or more third microelectromechanical systems (MEMS) actuators; wherein
the second part of each first MEMS actuator of the pair of first MEMS actuators is coupled to the second platform;
the second part of each second MEMS actuator of the pair of second MEMS actuators is coupled to the second platform;
a first part of each third MEMS actuator is attached to the second platform and a second part of each third MEMS actuator is coupled to the substrate;
the second MEMS micro-positioner moves the first MEMS micro-positioner relative to the substrate.
10. The device according to claim 9 , wherein
the second MEMS micro-positioner provides for rotation of the first MEMS micro-positioner.
11. The device according to claim 9 , wherein
the second MEMS micro-positioner provides for longitudinal motion of the first MEMS micro-positioner.
12. The device according to claim 9 , wherein
the one or more third microelectromechanical systems (MEMS) actuators comprises:
a second pair of first microelectromechanical systems (MEMS) actuators, a first first MEMS actuator of the second pair of first MEMS actuators disposed on a first side of the second platform and a second first MEMS actuator of the second pair of first MEMS actuators disposed on a second side of the second platform opposite the first side of the second platform;
a second pair of second microelectromechanical systems (MEMS) actuators, a first second MEMS actuator of the second pair of second MEMS actuators disposed on a third side of the second platform and a second second MEMS actuator of the second pair of second MEMS actuators disposed on a fourth side of the second platform opposite the third side of the second platform; wherein
the first side of the second platform and second side of the second platform are disposed laterally to an axis of the platform;
the third side of the second platform and fourth side of the second platform are disposed longitudinally along the axis of the platform;
the second platform is moveable laterally in a first direction under action of the second pair of first MEMS actuators; and
the second platform is moveable longitudinally in a second direction under the action of the second pair of second MEMS actuators.
13. A device comprising:
a substrate; and
a first microelectromechanical systems (MEMS) micro-positioner comprising:
a platform;
a pair of first microelectromechanical systems (MEMS) actuators, a first first MEMS actuator of the pair of first MEMS actuators disposed on a first side of the platform and a second first MEMS actuator of the pair of first MEMS actuators disposed on a second side of the platform opposite the first side of the platform;
a pair of second microelectromechanical systems (MEMS) actuators, a first second MEMS actuator of the pair of second MEMS actuators disposed on a third side of the platform and a second second MEMS actuator of the pair of second MEMS actuators disposed on a fourth side of the platform opposite the third side of the platform; wherein
a first part of each first MEMS actuator of the pair of first MEMS actuators is attached to the platform and a second part of each first MEMS actuator of the pair of first MEMS actuators is coupled to the substrate;
a first part of each second MEMS actuator of the pair of second MEMS actuators is attached to the platform and a second part of each second MEMS actuator of the pair of second MEMS actuators is coupled to the substrate;
the first side of the platform and second side of the platform are disposed laterally to an axis of the platform;
the third side of the platform and fourth side of the platform are disposed longitudinally along the axis of the platform;
the platform is moveable laterally under action of the pair of first MEMS actuators, longitudinally under action of the pair of second MEMS actuators and vertically under action of the pair of first MEMS actuators and the pair of second MEMS actuators.
14. The device according to claim 13 , further comprising
a plurality of springs, each spring disposed at a predetermined position relative to the platform and having a first end attached to the platform and a second distal end attached to the substrate.
15. The device according to claim 14 , wherein
the plurality of springs hold the platform up.
16. The device according to claim 13 , further comprising
a second MEMS micro-positioner comprising:
a first part comprising a second platform and the first MEMS micro-positioner;
one or more third microelectromechanical systems (MEMS) actuators; wherein
the second part of each first MEMS actuator of the pair of first MEMS actuators is coupled to the second platform;
the second part of each second MEMS actuator of the pair of second MEMS actuators is coupled to the second platform;
a first part of each third MEMS actuator is attached to the second platform and a second part of each third MEMS actuator is coupled to the substrate;
the second MEMS micro-positioner moves the first MEMS micro-positioner relative to the substrate.
17. The device according to claim 16 , wherein
the second MEMS micro-positioner provides for rotation of the first MEMS micro-positioner.
18. The device according to claim 16 , wherein
the second MEMS micro-positioner provides for longitudinal motion of the first MEMS micro-positioner.