Support unit, apparatus and method for treating a substrate
An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.
1. A substrate treating apparatus comprising:
a process chamber having a treatment space inside thereof;
a support unit for supporting a substrate inside of the process chamber; and
a gas supply unit for supplying a treatment gas into the treatment space,
wherein the support unit includes:
an electrode layer of a metal material to which a high frequency electric power can be applied;
a ground line having one end connected to the electrode layer and the other end grounded, the ground line being independent of a line through which the high frequency electric power is provided;
a ground switch provided on the ground line; and
a controller for controlling the ground switch,
wherein the ground line includes:
a first line connected to the electrode layer; and
a second line which is grounded,
the first line and second line being independent of a line through which the high frequency electric power is provided, and
wherein the ground switch is provided to electrically connect the second line and the first line.
2. The apparatus of claim 1 , wherein the second line is provided with a plurality of numbers and each second line provided in parallel with one another, and
wherein the ground switch is provided to electrically connect any one of the second lines to the first line.
3. The apparatus of claim 2 , wherein in each of the second lines, a resistance element having a predetermined resistance value is provided.
4. The apparatus of claim 3 , wherein the resistance values of the resistance elements are different from each other.
5. The apparatus of claim 2 , where the controller maintains the ground switch open while the high frequency electric power is applied to the electrode layer and maintains the ground switch closed such that any one of the second lines is electrically connected to the first line while the high frequency electric power is not applied to the electrode layer.
6. The apparatus of claim 1 , wherein the support unit further includes a support plate which is provided as a dielectric substance, and
wherein the support plate includes an electrostatic electrode electrically connected to an electrostatic power by an electrostatic switch.
7. The apparatus of claim 6 wherein the support unit further includes a cooling path to which cooling fluid is supplied.
8. The apparatus of claim 7 , wherein the lower plate includes a cooling path to which cooling fluid is supplied.
9. The apparatus of claim 7 , wherein the electrode layer is provided between the support plate and the lower plate.
10. The apparatus of claim 1 , further comprising a shower head unit including a supply hole through which the treatment gas passes.
11. A substrate treating apparatus comprising:
a process chamber having a treatment space inside thereof;
a support unit for supplying the treatment gas into the treatment space; and,
a baffle unit positioned between an inner wall of the process chamber and the support unit
wherein the support unit includes
a support plate which is provided as a dielectric substance, the support plate including an electrostatic electrode electrically connected to an electrostatic power by an electrostatic switch;
an electrode layer of a metal material to which a high frequency electric power can be applied, the electrode layer being provided under the support plate;
a lower plate provided below the electrode layer, the lower plate including a cooling path to which cooling fluid is supplied;
a ground line having one end connected to the electrode layer and the other end grounded the ground line includes a first line connected to the electrode layer and second line which is grounded, the first line and the second line being independent of a line through which the high frequency electric power is provided;
a ground switch provided on the ground line; and
a controller for controlling the ground switch, and
wherein the ground switch is opened while the high frequency electric power is applied to the electrode layer and is closed while the high frequency electric power is not applied to the electrode layer.
12. The apparatus of claim 11 , wherein the ground line includes a first line connected to the electrode layer and second line which is ground.
13. The apparatus of claim 12 , wherein the second line is provided with a plurality of numbers and each second line is provided in parallel with one another, and
wherein the ground switch is provided to electrically connect any one of the second lines to the first line.
14. The apparatus of claim 13 , wherein in each of the second lines, a resistance element having a predetermined resistance value is provided.
15. The apparatus of claim 11 , wherein the ground line is independent of a line through which the high frequency electric power is provided.
16. A substrate treating apparatus comprising:
a process chamber having a treatment space inside thereof;
a support unit for supporting a substrate inside of the process chamber;
a gas supply unit for supplying a treatment gas into the treatment space;
a shower head unit including a supply hole through which the treatment gas is passed;
a baffle unit positioned between an inner wall of the process chamber and the support unit,
wherein the support unit includes:
a support plate which is provided as a dielectric substance, the support plate including an electrostatic electrode electrically connected to an electrostatic power by an electrostatic switch;
an electrode layer of a metal material to which a high frequency electric power can be applied, the electrode layer being provided under the support plate;
a lower plate provided below the electrode layer, the lower plate including a cooling path to which cooling fluid is supplied;
a ground line having one end connected to the electrode layer and the other end grounded, the ground line includes a first line connected to the electrode layer and second line which is grounded, the first line and the second line being independent of a line through which the high frequency electric power is provided; and
a ground switch provided on the ground line;
wherein the ground switch is opened while the high frequency electric power is applied to the electrode layer and is closed while the high frequency electric power is not applied to the electrode layer.
17. The apparatus of claim 16 , wherein the ground line includes a first line connected to the electrode layer and a second line which is grounded.
18. The apparatus of claim 17 , wherein the second line is provided with a plurality of numbers and each second line is provided in parallel with one another, and
wherein the ground switch is provided to electrically connect any one of the second lines to the first line.
19. The apparatus of claim 18 , wherein in each of the second lines, a resistance element having a predetermined resistance value is provided.
20. The apparatus of claim 16 , wherein the ground line is independent of a line through which the high frequency electric power is provided.