IP Library Granted Patent US 11,143,598
Granted Patent B2
US 11,143,598 · App. 17/070,692 · Granted Oct 12, 2021

Defect inspection apparatus and defect inspection method

Inventors: Toshifumi Honda (Tokyo, JP); Shunichi Matsumoto (Tokyo, JP); Masami Makuuchi (Tokyo, JP); Yuta Urano (Tokyo, JP); Keiko Oka (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
G01N21/8806G01N21/47G01N21/956G01N2021/4792G01N2021/8812G01N2021/8848
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Quick Facts
Patent No.
US 11,143,598
App. No.
17/070,692
Granted
Oct 12, 2021
Kind
B2
Abstract

A defect inspection apparatus includes: an illumination unit configured to illuminate an inspection object region of a sample with light emitted from a light source; a detection unit configured to detect scattered light in a plurality of directions, which is generated from the inspection object region; a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal; and a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample. The detection unit includes a lens array configured to divide an image to form a plurality of images on the photoelectric conversion unit. The signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample.

Claims (63)

1. A defect inspection apparatus to detect defects that exist in a sample surface comprising:

an illumination unit configured to illuminate an inspection object region of the sample surface with light emitted from a light source;

a detection unit configured to detect scattered light generated from the inspection object region,

a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal; and

a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample surface, wherein

the detection unit includes a first lens configured to converge the scattered light generated from the inspection object region;

an imaging unit configured to divide an aperture and form a plurality of images on the photoelectric conversion unit, the aperture being set to allow passing of only light in a region to be converted by the photoelectric conversion unit,

the signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample surface, and

the photoelectric conversion unit includes a plurality of pixel blocks corresponding to a plurality of arrays of a lens array

wherein the optical axis of the first lens is tilted from the normal of the sample surface.

2. The defect inspection apparatus according to claim 1 , wherein the detection unit includes:

the first lens;

a second lens configured to form an image of the light converged by the first lens at a predetermined position;

a third lens configured to converge light from the image formed by the second lens; and

the lens array including a plurality of arrays and configured to divide an image converged by the third lens to divide the aperture by the plurality of lenses to form the plurality of images on the photoelectric conversion unit.

3. The defect inspection apparatus according to claim 2 , wherein the detection unit further includes:

an aperture that is arranged at the predetermined position and shields a region, where photoelectric conversion is not performed by the photoelectric conversion unit, in the image formed by the second lens.

4. The defect inspection apparatus according to claim 1 , wherein

the inspection object region is divided into a plurality of inspection regions,

the pixel block is configured with a plurality of pixel groups respectively corresponding to the plurality of inspection regions obtained by dividing the inspection object region,

each of the pixel groups includes a plurality of pixels arranged in a line shape, and

the photoelectric conversion unit electrically connects the plurality of pixels and synthesizes photoelectric conversion signals output by the plurality of pixels to output the electrical signals.

5. The defect inspection apparatus according to claim 2 , wherein

the lens array is arranged at a position where a pupil of the first lens is relayed, and

the plurality of arrays divide the pupil of the first lens and forms the image on the photoelectric conversion unit for each of the pupil regions obtained by dividing the pupil.

6. The defect inspection apparatus according to claim 2 , wherein

the lens array is arranged at a pupil position of the third lens.

7. The defect inspection apparatus according to claim 2 , wherein

the lens array is arranged at a rear focal position of the third lens.

8. The defect inspection apparatus according to claim 4 , further comprising:

a gain control unit configured to determine output intensity of the electrical signal corresponding to a quantity of light input to the pixels for each pixel group of the pixel block in the photoelectric conversion unit.

9. The defect inspection apparatus according to claim 8 , wherein

the photoelectric conversion unit is configured with an avalanche photodiode formed for each of the pixels, and

the gain control unit controls an inverse voltage to be applied to the avalanche photodiode.

10. A defect inspection method to detect defects that exist in a sample surface, comprising:

an illumination step of illuminating an inspection object region of the sample surface with light emitted from a light source;

a light conversion step of converting scattered light generated from the inspection object region from the tilted direction of the normal of the sample surface;

an imaging step of dividing an aperture and form a plurality of images on the photoelectric conversion unit, the aperture being set to allow passing of only light in a region to be converted by the photoelectric conversion unit,

a photoelectric conversion step of converting the detected scattered light by a photoelectric conversion unit into an electrical signal;

a defect detection step of processing the converted electrical signal to detect a defect of the sample surface, wherein

an aperture of an imaging unit is divided to form a plurality of images on the photoelectric conversion unit in the light detection step, the aperture being set to allow passing of only light in a region to be converted by the photoelectric conversion unit, and

electrical signals corresponding to the plurality of formed images are synthesized to detect a defect of the sample surface in the defect detection step.

11. The defect inspection method according to claim 10 , wherein

a plurality of pixel blocks are formed in the photoelectric conversion unit, and

the plurality of images are formed on the plurality of pixel blocks of the photoelectric conversion unit respectively.

12. The defect inspection method according to claim 11 , wherein

the inspection object region is divided into a plurality of inspection regions,

the pixel block is configured with a plurality of pixel groups respectively corresponding to the plurality of inspection regions obtained by dividing the inspection object region,

the pixel group is configured with a plurality of pixels arranged in a line shape, and

the photoelectric conversion unit electrically connects the plurality of pixels, and synthesizes photoelectric conversion signals output by the plurality of pixels to output the electrical signals.

13. The defect inspection method according to claim 12 , further comprising:

a step of determining output intensity of the electrical signals each corresponding to a quantity of light input to the pixel for each pixel group of the pixel block of the photoelectric conversion unit.

14. The defect inspection method according to claim 13 , wherein

the photoelectric conversion unit is configured with an avalanche photodiode formed for each of the pixels, and

the output intensity of the electrical signal is determined by controlling a reverse voltage to be applied to the avalanche photodiode.

15. The defect inspection apparatus according to claim 1 , wherein

an imaging unit forms each of the plurality of images obtained by dividing the aperture at magnification determined for each image on the photoelectric conversion unit.

16. The defect inspection apparatus according to claim 1 , wherein

in the photoelectric conversion unit, a pitch of pixels formed in the photoelectric conversion unit is set according to magnification of an image formed on the photoelectric conversion unit.

17. The defect inspection apparatus according to claim 2 , wherein

the lens array forms an image of the inspection object region in one direction and an image of a position of a pupil of the first lens in another direction different from the one direction, at magnification determined for each image on the photoelectric conversion unit.

18. The defect inspection apparatus according to claim 2 , wherein

the lens array forms an image of the inspection object region in one direction and an image of a position of the first lens where a pupil thereof is relayed in another direction different from the one direction, at magnification determined for each image on the photoelectric conversion unit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2021
From: HONDA, TOSHIFUMI; MATSUMOTO, SHUNICHI; MAKUUCHI, MASAMI; URANO, YUTA; OKA, KEIKO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 056837/0381 →
CHANGE OF NAME Recorded Jul 13, 2021
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 056859/0408 →
Priority Claims (1)
WO PCT/JP2017/019046 · May 22, 2017 · international
Continuity (2)
Continuation 16616069
Related Publication 20210025829A1 · Jan 28, 2021