Integrated circuit with a ring-shaped hot spot area and multidirectional cooling

1. An integrated circuit, comprising:

a first area along an outside perimeter of a first surface of the integrated circuit, the first area defining a first inner perimeter and comprising a first set of electronic components arranged between the outside perimeter and the first inner perimeter;

a second area comprising a center of the integrated circuit on the first surface and that includes a second set of electronic components, the second area defining a first outer perimeter that is less than the first inner perimeter and spaced apart from the first inner perimeter; and

a ring-shaped hot spot area disposed between the first area and the second area on the first surface, wherein the ring-shaped hot spot area:

defines a ring outer perimeter that is juxtaposed with the first inner perimeter of the first area;

defines a ring inner perimeter that is juxtaposed with the first outer perimeter of the second area to substantially surround the second area; and

includes a third set of electronic components that (i) produce more heat than the first set of electronic components during operation of the integrated circuit and (ii) produce more heat than the second set of electronic components during operation of the integrated circuit, wherein the first area surrounds the ring-shaped hot spot area and the second area.

2. The integrated circuit of claim 1 , wherein the first area, the second area, and the ring-shaped hot spot area are centrally disposed about the center of the integrated circuit on the first surface.

3. The integrated circuit of claim 1 , wherein the third set of electronic components include computational components of a microprocessor core of the integrated circuit.

4. The integrated circuit of claim 1 , wherein the ring-shaped hot spot area comprises four rectangular-shaped segments of electronic components that form a continuous rectangular-shaped ring about the second area on the first surface of the integrated circuit.

5. The integrated circuit of claim 1 , wherein the ring-shaped hot spot area comprises four rectangular-shaped segments of electronic components that form a segmented rectangular ring-shaped hot spot area.

6. The integrated circuit of claim 1 , wherein:

the ring-shaped hot spot area comprises a set of rectangular-shaped segments that are distributed about the ring-shaped hot spot area and that are spaced apart from each other rectangular-shaped segment; and

spaces between the rectangular-shaped segments comprise electronic components that produce less heat than electronic components in the rectangular-shaped segments.

7. The integrated circuit of claim 1 , further comprising a second ring-shaped hot spot area disposed between the ring-shaped hot spot area and the second area, the second ring-shaped hot spot area substantially surrounding the second area and including a fourth set of electronic components that produce more heat than the second set of electronic components.

8. The integrated circuit of claim 7 , wherein the fourth set of electronic components produce a different amount of heat than the third set of electronic components.

9. The integrated circuit of claim 7 , wherein the second ring-shaped hot spot area comprises four rectangular-shaped segments of electronic components that form a continuous hollow box-shaped area around the second area.

10. The integrated circuit of claim 7 , wherein the second ring-shaped hot spot area comprises four rectangular-shaped segments of electronic components that form a segmented rectangular ring-shaped hot spot area.

11. The integrated circuit of claim 7 , wherein:

the second ring-shaped hot spot area comprises a set of rectangular-shaped segments that are distributed about the second ring-shaped hot spot area and that are spaced apart from each other rectangular-shaped segment; and

spaces between the rectangular-shaped segments comprise electronic components that produce less heat than electronic components in the rectangular-shaped segments.

12. The integrated circuit of claim 1 , further comprising a fin array cold plate comprising a base disposed over the ring-shaped hot spot area and that passes a cooling liquid in multiple directions over the base disposed over the ring-shaped hot spot area such that the cooling liquid passes over the ring-shaped hot spot area.

13. The integrated circuit of claim 12 , wherein the fin array cold plate comprises a pin-fin array cold plate or a plate-fin array cold plate.

14. The integrated circuit of claim 12 , wherein the fin array cold plate passes the cooling liquid in four lateral directions over the ring-shaped hot spot area.

15. The integrated circuit of claim 12 , wherein the fin array cold plate is configured to provide one or more of (i) outside-in cooling liquid flow in a direction from one or more sides of the outside perimeter of the integrated circuit towards the center of the integrated circuit or (ii) inside-out cooling liquid flow in a direction from the center of the integrated circuit towards the one or more sides of the outside perimeter of the integrated circuit.

16. The integrated circuit of claim 15 , wherein the fin array cold plate comprises a symmetric distribution point that provides uniform cooling.

17. The integrated circuit of claim 12 , further comprising a second ring-shaped hot spot area disposed between the ring-shaped hot spot area and the second area, the second ring-shaped hot spot area substantially surrounding the second area and including a fourth set of electronic components that produce more heat than the first set of electronic components and the third set of electronic components, wherein:

the fin array cold plate passes the cooling liquid over both the ring-shaped hot spot area and the second ring-shaped hot spot area.

18. The integrated circuit of claim 1 , wherein the third set of electronic components comprises computational circuits and the second set of electronic components comprises memory circuits.

19. An integrated circuit, comprising:

a first area along an outside perimeter of a first surface of the integrated circuit, the first area defining a first inner perimeter and comprising a first set of electronic components arranged between the outside perimeter and the first inner perimeter;

a second area comprising a center of the integrated circuit on the first surface and that includes a second set of electronic components, the second area defining a first outer perimeter that is less than the first inner perimeter and spaced apart from the first inner perimeter; and

a ring-shaped hot spot area disposed between the first area and the second area on the first surface, wherein the ring-shaped hot spot area:

defines a ring outer perimeter that is juxtaposed with the first inner perimeter of the first area;

defines a ring inner perimeter that is juxtaposed with the first outer perimeter of the second area to substantially surround the second area; and

includes a third set of electronic components that (i) have a higher power density than the first set of electronic components and (ii) have a higher power density than the second set of electronic components, wherein the first area surrounds the ring-shaped hot spot area and the second area.

20. The integrated circuit of claim 19 , wherein the ring-shaped hot spot area comprises four rectangular-shaped segments of electronic components that form a continuous rectangular-shaped ring about the second area on the first surface of the integrated circuit.