Method and apparatus for maintaining cooling of modular electronic system during module removal
In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
1. An apparatus comprising:
a frame supporting a plurality of slidably removable modules, at least a portion of said plurality of slidably removable modules each comprising a panel movable between a closed position and an open position in which the panel extends into an open slot from which an adjacent slidably removable module of said plurality of slidably removable modules is removed;
a cooling fan for cooling said plurality of slidably removable modules prior to an online removal process for the adjacent slidably removable module;
a thermal sensor for sensing an internal temperature at the apparatus;
an electromechanical mechanism for unlocking the panel of a slidably removable module of said plurality of slidably removable modules immediately adjacent to the adjacent slidably removable module prior to removal of the adjacent slidably removable module; and
a processor for receiving an indication of an online removal process for the adjacent slidably removable module, increasing a speed of the cooling fan, and providing an indication that the adjacent slidably removable module is ready for removal upon identifying that the internal temperature has reached a cooling state;
wherein the panel of the slidably removable module immediately adjacent to the adjacent slidably removable module is configured to open and extend into the open slot upon removal of the adjacent slidably removable module to substantially block airflow bypass from the open slot and maintain cooling within the apparatus.
2. The apparatus of claim 1 wherein the electromechanical mechanism comprises a metallurgical phase transition temperature filament configured to unlock the panel of the slidably removable module immediately adjacent to the adjacent slidably removable module when an operating temperature reaches a predetermined threshold.
3. The apparatus of claim 1 wherein the processor is further operable to unlock the adjacent slidably removable module for removal when the internal temperature has reached said cooling state.
4. The apparatus of claim 1 wherein the adjacent slidably removable module comprises an indicator light configured to indicate when said cooling state has been reached and the adjacent slidably removable module is ready for removal.
5. The apparatus of claim 1 wherein the processor is further operable to transmit an electrical signal to a locking mechanism of the electromechanical mechanism to unlock the panel when said cooling state is reached.