Semiconductor memory device having plurality of memory chips

1. A semiconductor memory device comprising:

a plurality of first sub-blocks defined in a first memory chip; and

a plurality of second sub-blocks defined in a second memory chip that is stacked on the first memory chip in a stack direction,

wherein each of a plurality of memory blocks includes one of the plurality of first sub-blocks and one of the plurality of second sub-blocks,

wherein an erase voltage is separately applied to the first memory chip and the second memory chip in an erase operation, and the erase operation is performed in a sub-block, and

wherein the erase voltage is provided to a source plate and bit lines of the first memory chip or the second memory chip that includes a selected sub-block, and a ground voltage is provided to a source plate and bit lines of the first memory chip or the second memory chip that does not include the selected sub-block.

2. The semiconductor memory device according to claim 1 , wherein a first sub-block and a second sub-block that configure a memory block are spaced apart in the stack direction.

3. The semiconductor memory device according to claim 1 ,

wherein each of the first and second memory chips includes a coupling capacitor comprising a first electrode configured by a bit line, a second electrode configured by a wiring line and overlapping with the bit line, and an insulation layer configured by a dielectric layer and disposed between the bit line and the wiring line, and

wherein, in the erase operation, the erase voltage is applied to the wiring line of the first memory chip or the second memory chip that includes a selected sub-block, and is provided to the bit line of the first memory chip or the second memory chip in which the selected sub-block is included.

4. The semiconductor memory device according to claim 3 , further comprising:

a logic circuit defined on a circuit chip that is stacked together with the first and second memory chips,

wherein the logic circuit comprises:

a first erase voltage pass unit that transfers the erase voltage to the source plate and the wiring line of the first memory chip when one of the plurality of first sub-blocks is selected; and

a second erase voltage pass unit that transfers the erase voltage to the source plate and the wiring line of the second memory chip when one of the plurality of second sub-blocks is selected, and

wherein the first erase voltage pass unit and the second erase voltage pass unit operate independently of each other.

5. The semiconductor memory device according to claim 4 ,

wherein the first erase voltage pass unit transfers the erase voltage to the source plate and the wiring line of the first memory chip through a via that traverses the first memory chip in the stack direction, and

wherein the second erase voltage pass transfers the erase voltage to the source plate and the wiring line of the second memory chip through a via that traverses the second memory chip in the stack direction.

6. The semiconductor memory device according to claim 4 ,

wherein each of the first and second memory chips further includes an erase voltage pass unit that is coupled in common to the source plate and the wiring line and that transfers the erase voltage to the source plate and the wiring line in the erase operation, and

wherein the erase voltage pass unit of the first memory chip and the erase voltage pass unit of the second memory chip operate independently of each other.

7. The semiconductor memory device according to claim 1 ,

wherein each of the plurality of first sub-blocks and each of the plurality of second sub-blocks includes a plurality of cell strings, and

wherein each of the plurality of cell strings comprises:

a drain select transistor coupled to a bit line;

a source select transistor coupled to a source plate; and

a plurality of memory cells coupled between the drain select transistor and the source select transistor.

8. The semiconductor memory device according to claim 7 , further comprising:

a logic circuit defined on a circuit chip that is stacked together with the first and second memory chips,

wherein the logic circuit includes a row decoder that provides operating voltages to a drain select line coupled to a gate of the drain select transistor, to a source select line coupled to a gate of the source select transistor and to a plurality of word lines coupled to gates of the plurality of memory cells,

wherein, in each of the plurality of memory blocks, a drain select line coupled to the first sub-block and a drain select line coupled to the second sub-block are separately provided with an operating voltage from the row decoder,

wherein, in each of the plurality of memory blocks, a source select line coupled to the first sub-block and a source select line coupled to the second sub-block are separately provided with an operating voltage from the row decoder, and

wherein, in each of the plurality of memory blocks, each one of a plurality of word lines coupled to the first sub-block corresponds to a different one of the plurality of word lines coupled to the second sub-block, and corresponding word line pairs are provided with the same operating voltage from the row decoder.

9. The semiconductor memory device according to claim 8 ,

wherein, in the erase operation, a drain select line and a source select line of a selected sub-block are floated after a ground voltage is applied,

wherein a drain select line and a source select line of an unselected sub-block of the first memory chip or the second memory chip that includes the selected sub-block are floated,

wherein a ground voltage is applied to a drain select line and a source select line of an unselected sub-block of the first memory chip or the second memory chip that does not include the selected sub-block,

wherein a ground voltage is applied to the plurality of word lines of the memory block that includes the selected sub-block, and

wherein the plurality of word lines of the memory block that does not include the selected sub-block are floated.

10. A semiconductor memory device comprising:

a plurality of planes, each defined in a first memory chip and a second memory chip that is stacked on the first memory chip in a stack direction,

wherein each of the plurality of planes includes a first sub-plane that includes a plurality of first sub-blocks disposed in the first memory chip and includes a second sub-plane that includes a plurality of second sub-blocks disposed in the second memory chip,

wherein, in each of the plurality of planes, each of a plurality of memory blocks includes one of the plurality of first sub-blocks and one of the plurality of second sub-blocks,

wherein an erase voltage is separately applied to each first sub-plane and second sub-plane in an erase operation, and the erase operation is performed in a sub-block, and

wherein the erase voltage is provided to a source plate and bit lines of a sub-plane that includes a selected sub-block, and a ground voltage is provided to a source plate and bit lines of a sub-plane that does not include the selected sub-block.

11. The semiconductor memory device according to claim 10 , wherein a first sub-block and a second sub-block that configure a memory block are arranged in the stack direction.

12. The semiconductor memory device according to claim 10 ,

wherein each of the first and second sub-planes includes a coupling capacitor comprising a first electrode configured by a bit line, a second electrode configured by a wiring line and overlapping with the bit line, and an insulation layer disposed between the bit line and the wiring line and configured by a dielectric layer, and

wherein, in the erase operation, the erase voltage is applied to the wiring line of a sub-plane that includes a selected sub-block, and is provided to the bit line of the sub-plane that includes the selected sub-block.

13. The semiconductor memory device according to claim 10 , wherein the erase voltage is provided to the source plate through a via that traverses the memory chip that includes the selected sub-block, and the ground voltage is provided to the source plate through a via that traverses the memory chip that does not include the selected sub-block.

14. The semiconductor memory device according to claim 10 ,

wherein each of the plurality of first and each of the plurality of second sub-blocks includes a plurality of cell strings, and

wherein each of the plurality of cell strings comprises:

a drain select transistor coupled to a bit line;

a source select transistor coupled to a source plate; and

a plurality of memory cells coupled between the drain select transistor and the source select transistor.

15. The semiconductor memory device according to claim 14 , further comprising:

a logic circuit defined on a circuit chip that is stacked together with the first and second memory chips,

wherein the logic circuit includes a row decoder that provides operating voltages to a drain select line coupled to a gate of the drain select transistor, to a source select line coupled to a gate of the source select transistor and to a plurality of word lines coupled to gates of the plurality of memory cells,

wherein, in each of the plurality of memory blocks, a drain select line coupled to the first sub-block and a drain select line coupled to the second sub-block are separately provided with an operating voltage from the row decoder,

wherein, in each of the plurality of memory blocks, a source select line coupled to the first sub-block and a source select line coupled to the second sub-block are separately provided with an operating voltage from the row decoder, and

wherein, in each of the plurality of memory blocks, each one of a plurality of word lines coupled to the first sub-block corresponds to a different one of the plurality of word lines coupled to the second sub-block, and corresponding word lines pairs are provided with the same operating voltage from the row decoder.

16. The semiconductor memory device according to claim 15 ,

wherein, in the erase operation, a drain select line and a source select line of a selected sub-block are floated after a ground voltage is applied,

wherein a drain select line and a source select line of an unselected sub-block of the sub-plane that includes the selected sub-block are floated,

wherein a ground voltage is applied to a drain select line and a source select line of a sub-block of a sub-plane that does not include the selected sub-block,

wherein a ground voltage is applied to the plurality of word lines of the memory block that includes the selected sub-block, and

wherein the plurality of word lines of the memory block that does not include the selected sub-block are floated.

17. A semiconductor memory device comprising:

a plurality of first sub-blocks defined in a first memory chip including a first erase voltage pass unit; and

a plurality of second sub-blocks defined in a second memory chip, including a second erase voltage pass unit, that is stacked on the first memory chip in a stack direction,

wherein each of a plurality of memory blocks includes one of the plurality of first sub-blocks and one of the plurality of second sub-blocks, and

wherein the first erase voltage pass unit and the second erase voltage pass unit being coupled in common to a line to receive an erase voltage in an erase operation.

18. The semiconductor memory device according to claim 17 , wherein the line is a through-chip via.