Stacked semiconductor device
A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.
1 . A semiconductor device comprising:
a first stacked chip including first and second interfaces each configured to transfer a data word between an exterior and a second stacked chip, the data word transferred by the first interface being symmetrical, in units of bytes, to the data word transferred by the second interface; and
the second stacked chip including:
first and second channels corresponding to the respective first and second interfaces, each having first and second pseudo-channels; and
first and second control circuits corresponding to the respective first and second interfaces, each configured to select one of the first and second pseudo-channels according to a channel designation signal indicating one of the first and second pseudo-channels and a location of the corresponding interface, and transfer the data word between the selected pseudo-channel and the corresponding interface.
2 . The semiconductor device of claim 1 ,
wherein the first stacked chip includes a first area interfacing with the exterior and a second area interfacing with the second stacked chip through through-electrodes, and
wherein the first area includes the first and second channel interfaces and divided into left and right channel interfaces, which have a mirror structure with reference to a middle of the first area.
3 . The semiconductor device of claim 1 ,
wherein the first channel interface transfers the data word in a first order in units of bytes, and
wherein the second channel interface transfers the data word in a second order in units of bytes, opposite to the first order.
4 . The semiconductor device of claim 3 , wherein the first order includes an ascending order, and the second order includes a descending order.
5 . The semiconductor device of claim 1 ,
wherein the first control circuit transfers the data word to or from the selected pseudo-channel, in a first order in units of bytes, and
wherein the second control circuit transfers the data word to or from the selected pseudo-channel, in a second order in units of bytes, opposite to the first order.
6 . The semiconductor device of claim 5 , wherein the first order includes an ascending order, and the second order includes a descending order.
7 . The semiconductor device of claim 1 , wherein each of the first and second control circuits includes:
a channel control circuit configured to output a channel seed command as one of a first channel command and a second channel command according to the channel designation signal and the location; and
a data transfer circuit configured to transfer upper bits of the data word between the first pseudo-channel and the first stacked chip according to the first channel command, and transfer lower bits of the data word between the second pseudo-channel and the first stacked chip according to the second channel command.
8 . The semiconductor device of claim 7 , wherein each of the first and second control circuits further includes:
a command decoder configured to decode a command/address signal input from the first stacked chip to generate the channel designation signal and the channel seed command.
9 . The semiconductor device of claim 7 , wherein the channel control circuit includes:
a swap control circuit configured to transmit the channel designation signal as one of a first swap control signal and a second swap control signal according to a location information signal indicating the location; and
a command setting circuit configured to set the channel seed command to the first channel command or the second channel command according to the first swap control signal and the second swap control signal.
10 . The semiconductor device of claim 9 , wherein the swap control circuit includes:
a first swap circuit configured to output, as the first swap control signal, the channel designation signal when the location information signal is a first logic level, and an inverted signal of the channel designation signal when the location information signal is a second logic level; and
a second swap circuit configured to output, as the second swap control signal, an inverted signal of the channel designation signal when the location information signal is the first logic level, and the channel designation signal when the location information signal is the second logic level.
11 . The semiconductor device of claim 9 , wherein the command setting circuit includes:
a first setting circuit configured to output the channel seed command as the first channel command when the second swap control signal is enabled; and
a second setting circuit configured to output the channel seed command as the second channel command when the first swap control signal is enabled.
12 . The semiconductor device of claim 7 , wherein the data transfer circuit includes:
a control signal generation circuit configured to generate first write and read control signals, which correspond to the first channel command, and second write and read control signals, which correspond to the second channel command;
a first data input/output (I/O) circuit configured to transmit the upper bits to the first pseudo-channel according to the first write control signal, and transfer the upper bits from the first pseudo-channel to the first stacked chip according to the first read control signal; and
a second data I/O circuit configured to transmit the lower bits to the second pseudo-channel according to the second write control signal, and transfer the lower bits from the second pseudo-channel to the first stacked chip according to the second read control signal.