Vertical field effect transistor with self-aligned source and drain top junction
A semiconductor structure, and a method for forming the same includes an amorphous semiconductor layer in contact with a top surface of a channel fin extending vertically from a bottom source/drain located above a substrate. A hard mask memorization layer is formed directly above the amorphous semiconductor layer, portions of the amorphous semiconductor layer in contact with the top surface of the channel fin are recrystallized forming recrystallized regions. The amorphous semiconductor layer is selective removed and a second dielectric layer is deposited to form a top spacer. The hard mask memorization layer and the recrystallized regions are removed, and a first epitaxial region is formed above the channel fin followed by a second epitaxial region positioned above the first epitaxial region and between the second dielectric layer forming a top source/drain of the semiconductor structure.
1. A semiconductor structure comprising:
a first epitaxial region in contact with a top surface of a channel fin extending vertically from a bottom source/drain located above a substrate;
a second epitaxial region above the first epitaxial region, wherein the second epitaxial region has a horizontal thickness that is larger than a horizontal thickness of the first epitaxial region, the first epitaxial region and the second epitaxial region comprising a top source/drain region of the semiconductor structure, the first epitaxial region comprising a first doping concentration and the second epitaxial region comprising a second doping concentration that is lower than the first doping concentration; and
a top spacer adjacent to the first epitaxial region and the second epitaxial region, the top spacer being in contact with a top surface of a high-k metal gate stack located around the channel fin and in contact with a top surface of a first dielectric layer disposed between adjacent channel fins.
2. The semiconductor structure of claim 1 , wherein the top source/drain comprises an asymmetrical t-shape region.
3. The semiconductor structure of claim 1 , wherein the top spacer comprises an inverted t-shape region.
4. The semiconductor structure of claim 1 , further comprises:
a bottom spacer above the bottom source/drain.
5. The semiconductor structure of claim 1 , further comprises:
source/drain contacts extending until a top surface of the bottom source/drain and through the first epitaxial region; and
gate contacts extending from a surface of a third dielectric to the high-k metal gate stack.